公开(公告)号：US12027484B2

公开(公告)日：2024-07-02

申请号：US17369029

申请日：2021-07-07

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Ren Chen ,  Po-Yung Chang ,  Pei-Geng Weng ,  Yuan-Hung Hsu ,  Chang-Fu Lin ,  Don-Son Jiang

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/14 ,  H01L21/56 ,  H01L23/31 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/562

Abstract: An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.

公开(公告)号：US20230187382A1

公开(公告)日：2023-06-15

申请号：US18109120

申请日：2023-02-13

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsun Hsu ,  Chi-Jen Chen ,  Hsi-Chang Hsu ,  Yuan-Hung Hsu ,  Rui-Feng Tai ,  Don-Son Jiang

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L25/0655 ,  H01L23/3157 ,  H01L25/50 ,  H01L21/4853 ,  H01L24/05 ,  H01L21/56 ,  H01L2224/05556 ,  H01L24/16 ,  H01L2224/16227

Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.

公开(公告)号：US20220181225A1

公开(公告)日：2022-06-09

申请号：US17160720

申请日：2021-01-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Jen Chen ,  Hsi-Chang Hsu ,  Yuan-Hung Hsu ,  Chang-Fu Lin ,  Don-Son Jiang

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: An electronic package and a method for manufacturing the electronic package are provided. The method includes forming a slope surface on at least one side surface of at least one of a plurality of electronic components, and then disposing the plurality of electronic components on a carrier structure, such that the two adjacent electronic components form a space by the slope surface. Afterwards, an encapsulation layer is formed on the carrier structure and filled into the space to cover the two adjacent electronic components so as to disperse stress on the electronic components through the design of the space to prevent cracking due to stress concentration.

公开(公告)号：US20220173052A1

公开(公告)日：2022-06-02

申请号：US17160749

申请日：2021-01-28

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsun Hsu ,  Chi-Jen Chen ,  Hsi-Chang Hsu ,  Yuan-Hung Hsu ,  Rui-Feng Tai ,  Don-Son Jiang

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56 ,  H01L21/48

Abstract: An electronic package is provided and includes at least one protective structure positioned between a first electronic element and a second electronic element on a carrier for reducing stresses generated inside the first electronic element and the second electronic element when a filling material is formed on the carrier, encapsulates the protective structure and comes into contact with the first electronic element and the second electronic element, thereby preventing cracking of the first electronic element and the second electronic element and improving the reliability of the electronic package.

公开(公告)号：US20200093006A1

公开(公告)日：2020-03-19

申请号：US16201239

申请日：2018-11-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ying-Chang Tseng ,  Yuan-Hung Hsu ,  Chang-Fu Lin

IPC: H05K3/34 ,  H05K1/18 ,  H01Q1/22 ,  H01Q1/38

Abstract: This present disclosure provides an electronic package and a method for manufacturing the same. An antenna board with a limiter is stacked on a circuit board. A support body for holding the antenna board and the circuit board in place is provided between the antenna board and the circuit board, such that in the process of forming the support body, the limiter stops the flow of an adhesive material of the support body, and the adhesive material of the support body is prevented from overflowing onto an antenna structure of the antenna board to make sure that the antenna of the antenna board functions properly.

公开(公告)号：US12255165B2

公开(公告)日：2025-03-18

申请号：US18602396

申请日：2024-03-12

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Ren Chen ,  Po-Yung Chang ,  Pei-Geng Weng ,  Yuan-Hung Hsu ,  Chang-Fu Lin ,  Don-Son Jiang

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.

公开(公告)号：US20240162169A1

公开(公告)日：2024-05-16

申请号：US18537638

申请日：2023-12-12

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Yuan-Hung Hsu ,  Chi-Jen Chen

IPC: H01L23/00 ,  H01L21/768 ,  H01L23/538

CPC classification number: H01L23/562 ,  H01L21/76804 ,  H01L23/5384 ,  H01L23/5386

Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.

公开(公告)号：US11881459B2

公开(公告)日：2024-01-23

申请号：US16867937

申请日：2020-05-06

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Yuan-Hung Hsu ,  Chi-Jen Chen

IPC: H01L23/00 ,  H01L21/768 ,  H01L23/538

CPC classification number: H01L23/562 ,  H01L21/76804 ,  H01L23/5384 ,  H01L23/5386

Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.

公开(公告)号：US20230361091A1

公开(公告)日：2023-11-09

申请号：US18220501

申请日：2023-07-11

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Wei-Jhen Chen ,  Chih-Hsun Hsu ,  Yuan-Hung Hsu ,  Chih-Nan Lin ,  Chang-Fu Lin ,  Don-Son Jiang ,  Chih-Ming Huang ,  Yi-Hsin Chen

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L25/105 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L21/565 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/81801 ,  H01L2924/182 ,  H01L2224/73204

Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.

公开(公告)号：US11792938B2

公开(公告)日：2023-10-17

申请号：US17086888

申请日：2020-11-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Lung Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Yuan-Hung Hsu

IPC: H05K3/46 ,  H05K1/18 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/184 ,  H05K1/0271 ,  H05K3/303 ,  H05K3/4697 ,  H05K2201/10568

Abstract: A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.