公开(公告)号：US20100261071A1

公开(公告)日：2010-10-14

申请号：US12759404

申请日：2010-04-13

申请人： Sergey D. Lopatin ,  Robert Z. Bachrach ,  Liang-Yuh Chen

发明人： Sergey D. Lopatin ,  Robert Z. Bachrach ,  Liang-Yuh Chen

IPC分类号： H01M6/02 ,  H01M4/02 ,  H01M6/00 ,  D01H13/30 ,  C25D17/00

CPC分类号： H01M4/66 ,  H01M4/133 ,  H01M4/366 ,  H01M4/587 ,  H01M4/626 ,  H01M4/661 ,  H01M4/667 ,  H01M10/0525 ,  Y10T29/49115

摘要： A cost effective method and apparatus are provided for forming metallized fibers and depositing multilayer films thereon to form thin film electrochemical energy storage devices. In one embodiment, a fibrous substrate is formed using a fiber spinning process and the fibrous substrate is plated with a copper layer using wet deposition. Multiple material layers are then deposited onto the copper layer to form a lithium-ion battery fiber.

摘要翻译： 提供了一种成本有效的方法和装置，用于形成金属化纤维并在其上沉积多层膜以形成薄膜电化学能量存储装置。 在一个实施例中，使用纤维纺丝工艺形成纤维基材，并且使用湿沉积将纤维基材镀铜层。 然后将多个材料层沉积到铜层上以形成锂离子电池纤维。

公开(公告)号：US07654885B2

公开(公告)日：2010-02-02

申请号：US10956617

申请日：2004-10-01

申请人： Stan D. Tsai ,  Shou-Sung Chang ,  Liang-Yuh Chen

发明人： Stan D. Tsai ,  Shou-Sung Chang ,  Liang-Yuh Chen

IPC分类号： B24B29/00

CPC分类号： B23H5/08 ,  B24B37/046 ,  B24B37/22

摘要： A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness greater than the first thickness and a second compressibility greater than the first compressibility. The first thickness, first compressibility, second thickness and second compressibility are such that the polishing surface deflects at least 2 mil under an applied pressure of 1 psi or less.

摘要翻译： 抛光垫具有固定到抛光层的抛光层和背衬层。 抛光层具有抛光表面，第一厚度，第一可压缩性和约40至80肖氏硬度之间的硬度。背衬层具有大于第一厚度的第二厚度和大于第一可压缩性的第二压缩率。 第一厚度，第一可压缩性，第二厚度和第二压缩性使得抛光表面在1psi或更小的施加压力下偏转至少2密耳。

公开(公告)号：US20080242202A1

公开(公告)日：2008-10-02

申请号：US11695484

申请日：2007-04-02

申请人： Yuchun Wang ,  Robert A. Ewald ,  Wei-Yung Hsu ,  Liang-Yuh Chen

发明人： Yuchun Wang ,  Robert A. Ewald ,  Wei-Yung Hsu ,  Liang-Yuh Chen

IPC分类号： B24B7/22

CPC分类号： B23H5/08

摘要： A method and apparatus for extending a polishing article lifetime on a polishing tool with multiple platens is described. The apparatus includes an advanceable roll to roll platen with multiple embodiments of a polishing article to be used thereon. The polishing article is adapted to perform a polishing process by removing conductive and dielectric material from a substrate while minimizing downtime of the polishing tool. In some embodiments, the polishing article may be a dielectric material or a conductive material and is configured to include a longer usable lifetime to minimize replacement and downtime of the tool.

摘要翻译： 描述了一种用于在具有多个压板的抛光工具上延伸抛光制品寿命的方法和装置。 该设备包括具有可在其上使用的抛光制品的多个实施例的可推进的辊对辊压盘。 抛光制品适于通过从衬底移除导电和电介质材料，同时最小化抛光工具的停机时间来执行抛光工艺。 在一些实施例中，抛光制品可以是介电材料或导电材料，并且被配置为包括更长的可用寿命以最小化工具的更换和停机时间。

公开(公告)号：US20080156657A1

公开(公告)日：2008-07-03

申请号：US12014687

申请日：2008-01-15

申请人： Paul D. Butterfield ,  Liang-Yuh Chen ,  Yongqi Hu ,  Antoine P. Manens ,  Rashid Mavliev ,  Stan D. Tsai ,  Feng Q. Liu ,  Ralph Wadensweiler

发明人： Paul D. Butterfield ,  Liang-Yuh Chen ,  Yongqi Hu ,  Antoine P. Manens ,  Rashid Mavliev ,  Stan D. Tsai ,  Feng Q. Liu ,  Ralph Wadensweiler

IPC分类号： B23H3/00

CPC分类号： B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/24 ,  B24B53/017 ,  B24D13/14 ,  H01L21/32125

摘要： Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.

摘要翻译： 提供球组件的实施例。 在一个实施例中，球组件包括壳体，球，导电适配器和接触元件。 壳体具有延伸到内部通道的第一端的环形座。 导电适配器联接到壳体的第二端。 接触元件将适配器和球电耦合并保持在座椅和适配器之间的壳体中。

公开(公告)号：US20080047841A1

公开(公告)日：2008-02-28

申请号：US11877223

申请日：2007-10-23

申请人： ANTOINE MANENS ,  Vladimir Galburt ,  Yan Wang ,  Alain Duboust ,  Donald Olgado ,  Liang-Yuh Chen

发明人： ANTOINE MANENS ,  Vladimir Galburt ,  Yan Wang ,  Alain Duboust ,  Donald Olgado ,  Liang-Yuh Chen

IPC分类号： C25F3/02 ,  C25F7/00

CPC分类号： B23H5/08 ,  B24B37/042 ,  C25D17/10 ,  C25F7/00

摘要： Embodiments of the present invention provide an apparatus for electrochemically processing a substrate. The apparatus comprises a processing layer having a surface adapted for processing a substrate thereon, a polishing head for retaining a substrate against the processing surface, a retaining ring a terminal adapted for coupling to a power source, and a plurality of independently biasable electrodes disposed below the processing layer.

摘要翻译： 本发明的实施例提供了一种用于电化学处理衬底的装置。 该装置包括具有适于在其上处理基板的表面的处理层，用于将基板保持在处理表面上的抛光头，保持环用于耦合到电源的端子和设置在电源下方的多个可独立施加的电极 处理层。

公开(公告)号：US07323095B2

公开(公告)日：2008-01-29

申请号：US10792069

申请日：2004-03-03

申请人： Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ratson Morad ,  Daniel A. Carl ,  Sasson Somekh

发明人： Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ratson Morad ,  Daniel A. Carl ,  Sasson Somekh

IPC分类号： C25D21/00 ,  C25D7/12

CPC分类号： C25D7/123 ,  C25D5/06 ,  C25D5/22 ,  C25D17/001 ,  C25D17/008 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/7684 ,  H01L21/76877

摘要： A method and apparatus is provided for depositing and planarizing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a partial enclosure, a permeable disc, a diffuser plate and optionally an anode. A substrate carrier is positionable above the partial enclosure and is adapted to move a substrate into and out of contact or close proximity with the permeable disc. The partial enclosure and the substrate carrier are rotatable to provide relative motion between a substrate and the permeable disc. In another aspect, a method is provided in which a substrate is positioned in a partial enclosure having an electrolyte therein at a first distance from a permeable disc. A current is optionally applied to the surface of the substrate and a first thickness is deposited on the substrate. Next, the substrate is positioned closer to the permeable disc. During the deposition, the partial enclosure and the substrate are rotated relative one another.

摘要翻译： 提供了一种用于沉积和平坦化衬底上的材料层的方法和装置。 在一个实施例中，提供了一种装置，其包括部分外壳，可渗透盘，漫射板和任选的阳极。 衬底载体可定位在部分外壳上方，并且适于将衬底移动到与可渗透盘接触或接近的位置。 部分外壳和基板载体可旋转以提供基板和可渗透盘之间的相对运动。 在另一方面，提供了一种方法，其中将基底定位在其中具有电解质的部分封闭体中，其中离开可渗透盘的第一距离处。 任选地将电流施加到衬底的表面，并且在衬底上沉积第一厚度。 接下来，将基板定位成更靠近可渗透盘。 在沉积期间，部分封闭物和基底相对彼此旋转。

公开(公告)号：US20070295611A1

公开(公告)日：2007-12-27

申请号：US11764726

申请日：2007-06-18

申请人： FENG LIU ,  Stan Tsai ,  Yongqi Hu ,  Siew Neo ,  Yan Wang ,  Alain Duboust ,  Liang-Yuh Chen

发明人： FENG LIU ,  Stan Tsai ,  Yongqi Hu ,  Siew Neo ,  Yan Wang ,  Alain Duboust ,  Liang-Yuh Chen

IPC分类号： B23H9/00 ,  B23H7/00

CPC分类号： B23H7/08 ,  B23H1/022 ,  B23H1/06

摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer. The ECMP polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as copper, with a reduction in planarization type defects and yielding a desirable surface finish.

摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 一方面，组合物包括酸性电解质体系，一种或多种螯合剂，一种或多种腐蚀抑制剂，一种或多种无机或有机酸盐，一种或多种pH调节剂，以提供约2至约10 ，选自磨料颗粒，一种或多种氧化剂及其组合的研磨增强材料和溶剂。 该组合物可用于导电材料去除工艺中，包括在包括电极的处理设备中设置其上形成有导电材料层的衬底，在电极和衬底之间提供组合物，在电极和衬底之间施加偏压，以及 从导电材料层去除导电材料。 本文所述的ECMP抛光组合物和方法提高了材料从衬底表面（例如铜）的有效去除速率，同时平坦化型缺陷减少并产生理想的表面光洁度。

公开(公告)号：US07232363B2

公开(公告)日：2007-06-19

申请号：US10942600

申请日：2004-09-16

申请人： Hanzhong Zhang ,  Feng Liu ,  Stan Tsai ,  Rashid Mavliev ,  Donald Olgado ,  Liang-Yuh Chen

发明人： Hanzhong Zhang ,  Feng Liu ,  Stan Tsai ,  Rashid Mavliev ,  Donald Olgado ,  Liang-Yuh Chen

IPC分类号： B24B57/02 ,  B24B7/22

CPC分类号： B24B37/04 ,  B24B57/02

摘要： A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing operation. A polishing solution dispenser applies a polishing solution to the polishing pad substantially within the polishing area during the polishing operation. A polishing solution retaining mechanism is attached to one of the base or the carrier head assembly. The retaining mechanism engages a top surface of the polishing pad and retains the polishing solution substantially within the polishing area during the polishing operation. Some implementations may reduce polishing solution consumption and allow for increased angular velocity.

摘要翻译： 对基板研磨装置和方法进行说明。 基座包括至少一个可移动的压板以接合抛光垫。 在抛光操作期间，至少一个承载头组件基本上在抛光区域内将衬底压靠在抛光垫上。 抛光溶液分配器在抛光操作期间基本上在抛光区域内将抛光溶液施加到抛光垫。 抛光溶液保持机构附接到基座或承载头组件中的一个。 保持机构接合抛光垫的顶表面，并且在抛光操作期间将抛光液基本保持在抛光区域内。 一些实施方案可以减少抛光溶液消耗并允许增加的角速度。

公开(公告)号：US20070131654A1

公开(公告)日：2007-06-14

申请号：US11299295

申请日：2005-12-09

申请人： Erik Wasinger ,  Gary Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Shin ,  Donald Olgado

发明人： Erik Wasinger ,  Gary Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Shin ,  Donald Olgado

IPC分类号： C03C15/00 ,  H01L21/306

CPC分类号： C03C19/00 ,  B24B1/04 ,  B24B9/065 ,  B24B21/004 ,  H01L21/02021

摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.

摘要翻译： 适于抛光衬底边缘的装置和方法包括抛光膜，适于张紧和加载抛光膜的框架，使得膜的至少一部分被支撑在平面中，以及基板旋转驱动器，其适于旋转 衬底抵靠抛光膜的平面，使得抛光膜适于对衬底施加力，轮廓到衬底的边缘，边缘至少包括外边缘和第一斜面，并且抛光外边缘和 第一斜面作为基底旋转。 提供了许多其他方面。

公开(公告)号：US20070066200A9

公开(公告)日：2007-03-22

申请号：US11418557

申请日：2006-05-05

申请人： Shijian Li ,  Liang-Yuh Chen ,  Alain Duboust

发明人： Shijian Li ,  Liang-Yuh Chen ,  Alain Duboust

IPC分类号： H01L21/306 ,  B24D11/00

CPC分类号： B24B37/24 ,  B23H5/08 ,  B24B57/02

摘要： Methods, articles of manufacture, and apparatus are provided for depositing and planarizing one or more layers of material on a substrate, or combinations thereof, are disclosed. In one embodiment, an article of manufacture is provided for polishing a substrate, comprising a polishing article having a polishing surface, a plurality of perforations formed in at least a portion of the polishing article for flow of material therethrough, and a plurality of grooves disposed in the polishing surface. The article of manufacture may be used in a method for processing a substrate, comprising positioning the substrate in an electrolyte solution containing a polishing article, optionally depositing a material on the substrate by an electrochemical deposition method, and polishing the substrate with the polishing article.

摘要翻译： 提供了方法，制品和装置，用于沉积和平坦化衬底上的一层或多层材料，或其组合。 在一个实施例中，提供了用于抛光衬底的制品，其包括具有抛光表面的抛光制品，在抛光制品的至少一部分中形成的用于材料流动的多个穿孔，以及多个槽， 在抛光面上。 制造物品可以用于处理基材的方法，包括将基底定位在含有抛光制品的电解质溶液中，任选地通过电化学沉积方法将材料沉积在基底上，并用抛光制品抛光基底。