公开(公告)号：US20090227050A1

公开(公告)日：2009-09-10

申请号：US12467513

申请日：2009-05-18

申请人： Sang Hyun SHIN ,  Seog Moon CHOI ,  Young Ki LEE

发明人： Sang Hyun SHIN ,  Seog Moon CHOI ,  Young Ki LEE

IPC分类号： H01L21/00

CPC分类号： H01L33/483 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

摘要翻译： 使用LED作为光源的高亮度和高输出LED封装及其制造方法。 LED封装包括Al基板，其中形成有凹入的多阶反射表面，以及由安装在反射表面上并与图案化电极电连接的LED组成的光源。 LED封装还包括形成在图案化电极和衬底之间的阳极氧化绝缘层，以及覆盖在衬底的光源上的密封剂。 LED封装还包括形成在LED下面的Al散热器，以增强散热能力。 根据本发明，基板由Al材料制成并阳极氧化以在其上形成绝缘层，从而允许LED的良好的散热效果，从而显着提高LED封装的寿命和发光效率。

公开(公告)号：US20090061550A1

公开(公告)日：2009-03-05

申请号：US12259576

申请日：2008-10-28

申请人： Yong Suk KIM ,  Young Soo OH ,  Hyoung Ho KIM ,  Taek Jung LEE ,  Seog Moon CHOI

发明人： Yong Suk KIM ,  Young Soo OH ,  Hyoung Ho KIM ,  Taek Jung LEE ,  Seog Moon CHOI

IPC分类号： H01L21/50

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/16225

摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.

摘要翻译： 本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。 为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。 在LED封装中，准备在底面上具有至少一个沟槽的衬底。 多个电极形成在基板的顶表面上。 此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。 此外，碳纳米管填料填充在基板的槽中。

公开(公告)号：US20070246728A1

公开(公告)日：2007-10-25

申请号：US11736159

申请日：2007-04-17

申请人： Yong Sik KIM ,  Seog Moon CHOI ,  Hyun Ho KIM

发明人： Yong Sik KIM ,  Seog Moon CHOI ,  Hyun Ho KIM

IPC分类号： H01L33/00

CPC分类号： H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/0091 ,  H01L2924/00014

摘要： A surface mounting device-type light emitting diode (SMD-type LED) comprises a lead frame composed of a pair of lead terminals; a package housing a portion of the lead frame therein, the package having an emission window which is opened so that light is emitted through the emission window; an LED chip mounted on the lead frame inside the package; a wire for electrically connecting the LED chip and the lead frame; and a molding material filled in the package, the molding material having surface irregularities with a predetermined shape formed on the surface thereof which is exposed through the emission window of the package.

摘要翻译： 表面安装器件型发光二极管（SMD型LED）包括由一对引线端子构成的引线框架; 一个将引线框架的一部分容纳在其中的封装，该封装具有一个打开的发射窗，使得光通过发射窗口发射; LED芯片安装在封装内的引线框架上; 用于电连接LED芯片和引线框架的导线; 以及填充在所述封装中的成型材料，所述成型材料具有形成在其表面上的具有预定形状的表面凹凸，所述表面凹凸通过所述封装的所述发射窗露出。

公开(公告)号：US20120127666A1

公开(公告)日：2012-05-24

申请号：US13007545

申请日：2011-01-14

申请人： Ji Hyun PARK ,  Seog Moon CHOI ,  Young Ki LEE

发明人： Ji Hyun PARK ,  Seog Moon CHOI ,  Young Ki LEE

IPC分类号： H05K7/20 ,  H05K1/00 ,  H05K3/00 ,  C23C28/00 ,  C25D7/00

CPC分类号： H05K1/053 ,  H05K2201/09745

摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：具有散热器的基底，具有凹槽; 绝缘层，其通过在其上进行阳极氧化而形成在所述基底基板上; 以及形成在绝缘层上的电路层，由此制造具有由金属材料制成的散热器的散热基板，从而可以保护弱热的器件，从而解决了降低寿命的问题 跨度和可靠性降低。

公开(公告)号：US20120118615A1

公开(公告)日：2012-05-17

申请号：US13091016

申请日：2011-04-20

申请人： Kwan Ho LEE ,  Seog Moon CHOI ,  Tae Hyun KIM

发明人： Kwan Ho LEE ,  Seog Moon CHOI ,  Tae Hyun KIM

IPC分类号： H05K1/03 ,  B32B37/24 ,  B32B15/04 ,  B32B7/02 ,  B82Y40/00 ,  B82Y30/00

CPC分类号： B82Y30/00 ,  B32B15/08 ,  B32B15/14 ,  B32B2255/06 ,  B32B2255/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2264/108 ,  B32B2457/00 ,  Y10T428/2495 ,  Y10T428/31678

摘要： Disclosed herein is a metal clad laminate, a method of manufacturing the same and a heat-radiating substrate using the same. The metal clad laminate has increased adhesion because a layer of carbon nanoparticles is formed between bonding surfaces of upper and lower metal foils to a prepreg, and has improved heat conductive properties and mechanical properties because the prepreg has carbon fibers incorporated therein. Also, resin members having carbon nanofibers incorporated therein may be alternately stacked with metal layers, and metal layers may be inserted in the prepreg thus improving heat conductive properties, and the number of stacked layers may vary depending on the end use thereby controlling heat conductive properties and mechanical properties of the metal clad laminate.

摘要翻译： 本文公开了一种金属覆层压板，其制造方法和使用其的散热基板。 金属复合层压板具有增加的粘附性，因为在上金属箔和下金属箔的接合表面之间形成一层碳纳米颗粒与预浸料，并且由于预浸料坯具有掺入碳纤维，所以具有改善的导热性能和机械性能。 此外，其中结合有碳纳米纤维的树脂构件可以交替地层叠有金属层，并且金属层可以插入预浸料中，从而改善导热性能，并且堆叠层的数量可以根据最终用途而变化，从而控制导热性能 和金属包覆层压板的机械性能。

公开(公告)号：US20120049993A1

公开(公告)日：2012-03-01

申请号：US13219800

申请日：2011-08-29

申请人： Kyu Bum HAN ,  Seog Moon CHOI ,  Young Ho SON

发明人： Kyu Bum HAN ,  Seog Moon CHOI ,  Young Ho SON

IPC分类号： H01F27/28

CPC分类号： H01F27/38

摘要： Disclosed herein is a transformer integrated with an inductor. The transformer includes a transformer unit configured to perform voltage transformation by mutual induction between first and second cores connected opposite to each other and primary and secondary coils included in a space between the first core and the second core; and an inductor unit having a third core connected to the second core and an inductor included in a space between the second core and the third core. The transformer is fabricated by physically integrating two elements having different functions into one element, thereby simplifying the configuration of a system.

摘要翻译： 本文公开了与电感器集成的变压器。 变压器包括变压器单元，其被配置为通过在彼此相对连接的第一和第二芯之间的相互感应和包括在第一芯和第二芯之间的空间中的初级和次级线圈进行电压变换; 以及电感器单元，其具有连接到第二芯的第三芯和包括在第二芯和第三芯之间的空间中的电感器。 通过将具有不同功能的两个元件物理地集成到一个元件中来制造变压器，从而简化了系统的配置。

公开(公告)号：US20150084089A1

公开(公告)日：2015-03-26

申请号：US14555186

申请日：2014-11-26

申请人： Young Ki LEE ,  Seog Moon CHOI ,  Sang Hyun SHIN

发明人： Young Ki LEE ,  Seog Moon CHOI ,  Sang Hyun SHIN

IPC分类号： H01L33/48 ,  H01L33/62

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H05K3/28 ,  H05K2203/0315 ,  H05K2203/0542

摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

摘要翻译： 一种用于高温条件的绝缘结构及其制造方法。 在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。 通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

公开(公告)号：US20120139098A1

公开(公告)日：2012-06-07

申请号：US13009812

申请日：2011-01-19

申请人： Kwan Ho LEE ,  Seog Moon CHOI

发明人： Kwan Ho LEE ,  Seog Moon CHOI

IPC分类号： H01L23/36

CPC分类号： H01L23/427 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a power package module, including: a power package mounted with a plurality of semiconductor chips; a heat radiation module coming into contact with the power package and including a first heat radiation member for discharging heat generated from the power package; and a second heat radiation member, one side of which is connected to the first heat radiation member and the other side of which is connected to the power package.

摘要翻译： 本文公开了一种功率封装模块，包括：安装有多个半导体芯片的功率封装; 热辐射模块与功率封装接触并且包括用于排放从功率封装产生的热量的第一散热构件; 以及第二散热构件，其一侧连接到第一散热构件，另一侧连接到动力封装。

公开(公告)号：US20120049788A1

公开(公告)日：2012-03-01

申请号：US13018806

申请日：2011-02-01

申请人： Jong Man KIM ,  Seog Moon CHOI ,  Kyu Bum HAN

发明人： Jong Man KIM ,  Seog Moon CHOI ,  Kyu Bum HAN

IPC分类号： H02J7/00

CPC分类号： H05K7/20918

摘要： Disclosed herein is a charge module for charging a high-capacity battery.The charge module according to the exemplary embodiment of the present invention includes: a heat sink; a fan cover covering the top of the heat sink; a fan mounted on the upper center of the fan cover; and a heat pipe inserted into the side wall of the heat sink to dissipate heat from the side wall of the heat sink through the circulation of refrigerants.

摘要翻译： 这里公开了一种用于对高容量电池进行充电的充电模块。 根据本发明的示例性实施例的充电模块包括：散热器; 覆盖散热器顶部的风扇盖; 风扇安装在风扇罩的上部中心; 以及插入散热器的侧壁中的热管，以通过制冷剂的循环从散热器的侧壁散发热量。