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    LIGHT EMITTING DIODE PACKAGE HAVING ANODIZED INSULATION LAYER AND FABRICATION METHOD THEREFOR
    2.
    发明申请
    LIGHT EMITTING DIODE PACKAGE HAVING ANODIZED INSULATION LAYER AND FABRICATION METHOD THEREFOR 有权
    具有阳离子绝缘层的发光二极管封装及其制造方法

    公开(公告)号：US20110312109A1

    公开(公告)日：2011-12-22

    申请号：US13220258

    申请日：2011-08-29

    申请人： Young Ki LEE ,  Seog Moon CHOI ,  Sang Hyun SHIN

    发明人： Young Ki LEE ,  Seog Moon CHOI ,  Sang Hyun SHIN

    IPC分类号： H01L33/48

    CPC分类号： H01L33/483 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.

    摘要翻译： 一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。 封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

    LIGHT EMITTING DIODE PACKAGE HAVING MULTI-STEPPED REFLECTING SURFACE STRUCTURE AND FABRICATION METHOD THEREOF
    3.
    发明申请
    LIGHT EMITTING DIODE PACKAGE HAVING MULTI-STEPPED REFLECTING SURFACE STRUCTURE AND FABRICATION METHOD THEREOF 有权
    具有多步反射表面结构的发光二极管封装及其制造方法

    公开(公告)号：US20090227050A1

    公开(公告)日：2009-09-10

    申请号：US12467513

    申请日：2009-05-18

    申请人： Sang Hyun SHIN ,  Seog Moon CHOI ,  Young Ki LEE

    发明人： Sang Hyun SHIN ,  Seog Moon CHOI ,  Young Ki LEE

    IPC分类号： H01L21/00

    CPC分类号： H01L33/483 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

    摘要翻译： 使用LED作为光源的高亮度和高输出LED封装及其制造方法。 LED封装包括Al基板，其中形成有凹入的多阶反射表面，以及由安装在反射表面上并与图案化电极电连接的LED组成的光源。 LED封装还包括形成在图案化电极和衬底之间的阳极氧化绝缘层，以及覆盖在衬底的光源上的密封剂。 LED封装还包括形成在LED下面的Al散热器，以增强散热能力。 根据本发明，基板由Al材料制成并阳极氧化以在其上形成绝缘层，从而允许LED的良好的散热效果，从而显着提高LED封装的寿命和发光效率。

    HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF
    4.
    发明申请
    HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF 有权
    散热基板及其制造方法

    公开(公告)号：US20110061901A1

    公开(公告)日：2011-03-17

    申请号：US12614407

    申请日：2009-11-07

    申请人： Chang Hyun LIM ,  Seog Moon CHOI ,  Sang Hyun SHIN ,  Young Ki LEE ,  Sung Keun PARK

    发明人： Chang Hyun LIM ,  Seog Moon CHOI ,  Sang Hyun SHIN ,  Young Ki LEE ,  Sung Keun PARK

    IPC分类号： H05K1/00 ,  H05K3/00

    CPC分类号： H05K3/02 ,  H05K1/0201 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2203/0315

    摘要： Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

    摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

    HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
    散热电路板及其制造方法

    公开(公告)号：US20120273558A1

    公开(公告)日：2012-11-01

    申请号：US13540504

    申请日：2012-07-02

    申请人： Hye Sook SHIN ,  Seog Moon CHOI ,  Shan GAO ,  Chang Hyun LIM ,  Tae Hyun KIM ,  Young Ki LEE

    发明人： Hye Sook SHIN ,  Seog Moon CHOI ,  Shan GAO ,  Chang Hyun LIM ,  Tae Hyun KIM ,  Young Ki LEE

    IPC分类号： B23K1/20

    CPC分类号： H05K7/205 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/053 ,  H05K3/202 ,  H05K3/24 ,  H05K3/341 ,  H05K2201/066 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155

    摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

    摘要翻译： 公开了一种散热电路板，其包括金属芯，该金属芯包括在其表面上形成的绝缘层，形成在绝缘层上的电路层，包括种子层和第一电路图案，以及散热框架层， 使用焊料并具有第二电路图案的电路层，其中散热框架层不是通过电镀工艺而是通过使用焊料结合到电路层上，因此降低了电镀工艺的成本和时间并减轻了施加的应力 由于电镀过程而导致散热电路板。 还提供了制造散热电路板的方法。