公开(公告)号：US09768154B2

公开(公告)日：2017-09-19

申请号：US15271521

申请日：2016-09-21

Applicant: TDK Corporation

Inventor： Toshio Tomonari ,  Hirohumi Asou ,  Hisayuki Abe

IPC: H01L23/552 ,  H01L25/18 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L25/00

CPC classification number: H01L25/18 ,  H01L21/561 ,  H01L23/29 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/141 ,  H01L2924/1432 ,  H01L2924/14335 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81

Abstract: Disclosed herein is a semiconductor package that includes: a package substrate having a main surface; a plurality of semiconductor devices mounted on the main surface of the package substrate; a mold member formed on the main surface of the package substrate so as to cover the semiconductor devices, the mold member having an upper surface substantially parallel to the main surface of the package substrate; and an electromagnetic wave shield formed on the upper surface of the mold member. The mold member comprises a mold resin and metal magnetic particles dispersed in the mold resin. The metal magnetic particles are exposed to the upper surface of the mold member.

公开(公告)号：US20170229228A1

公开(公告)日：2017-08-10

申请号：US15426325

申请日：2017-02-07

Applicant: TDK Corporation

Inventor： Yoshihiro KAWASAKI ,  Syun Ashizawa ,  Hirohumi Asou ,  Nobuo Takagi

IPC: H01F27/255 ,  H01F27/29 ,  H01F27/28

CPC classification number: H01F27/255 ,  H01F3/10 ,  H01F17/045 ,  H01F27/2823 ,  H01F27/2828 ,  H01F27/29 ,  H01F27/292

Abstract: Disclosed herein is a coil component that includes a drum core having a winding core and first and second flange portions provided at opposite ends of the winding core; a wire wound around the winding core; terminal electrodes provided in the first and second flange portions, the terminal electrodes being connected to ends of the wire; and a magnetic top plate made of magnetic-powder containing resin in which magnetic powder is mixed in binder resin, the magnetic top plate being fixed to the first and second flange portions. The magnetic top plate has a lower surface facing the first and second flange portions and an upper surface located opposite to the lower surface. The density of the binder resin is higher in a surface layer part on a side of the upper surface than in a surface layer part on a side of the lower surface.

公开(公告)号：US20170092633A1

公开(公告)日：2017-03-30

申请号：US15271521

申请日：2016-09-21

Applicant: TDK Corporation

Inventor： Toshio Tomonari ,  Hirohumi Asou ,  Hisayuki Abe

IPC: H01L25/18 ,  H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L25/18 ,  H01L21/561 ,  H01L23/29 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/141 ,  H01L2924/1432 ,  H01L2924/14335 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81

Abstract: Disclosed herein is a semiconductor package that includes: a package substrate having a main surface; a plurality of semiconductor devices mounted on the main surface of the package substrate; a mold member formed on the main surface of the package substrate so as to cover the semiconductor devices, the mold member having an upper surface substantially parallel to the main surface of the package substrate; and an electromagnetic wave shield formed on the upper surface of the mold member. The mold member comprises a mold resin and metal magnetic particles dispersed in the mold resin. The metal magnetic particles are exposed to the upper surface of the mold member.

公开(公告)号：US11715976B2

公开(公告)日：2023-08-01

申请号：US16802372

申请日：2020-02-26

Applicant: TDK Corporation

Inventor： Noritaka Chiyo ,  Toshio Tomonari ,  Shigeru Kaneko ,  Shigenori Hirata ,  Akihito Watanabe ,  Hirohumi Asou ,  Junpei Hayama ,  Shigeki Ohtsuka ,  Takahiro Ohishi ,  Takaaki Imai ,  Tomohiro Moriki ,  Takakazu Maruyama

IPC: H02J50/10 ,  H04B5/00 ,  H01F27/28 ,  H01F5/04

CPC classification number: H02J50/10 ,  H01F5/04 ,  H01F27/2828 ,  H04B5/0037 ,  H04B5/0081

Abstract: Disclosed herein is a coil component that includes a first coil pattern wound in a planar spiral shape. At least one turn constituting the first coil pattern is divided into a plurality of lines by a spiral slit, and a space width between the plurality of lines differs depending on a planar position.

公开(公告)号：US10374276B2

公开(公告)日：2019-08-06

申请号：US15615049

申请日：2017-06-06

Applicant: TDK Corporation

Inventor： Toshio Tomonari ,  Hirohumi Asou ,  Kosuke Kunitsuka

IPC: H01P3/06 ,  H01P11/00 ,  H01B11/18 ,  H01F27/29 ,  H01G11/36 ,  H01G11/48 ,  H01F5/00 ,  H01F5/06 ,  H01F27/28 ,  H01B1/02 ,  H01F27/00 ,  H01F30/00 ,  H01B3/18

Abstract: Disclosed herein is a wire that includes: a core wire made of a conductor; an insulating film covering an outer periphery of the core wire; a catalyst adsorption film covering an outer periphery of the insulating film, the catalyst adsorption film including a catalyst serving as a reaction start point of electroless plating; and an outer periphery conductor covering an outer periphery of the catalyst adsorption film.

公开(公告)号：US10290934B2

公开(公告)日：2019-05-14

申请号：US14696768

申请日：2015-04-27

Applicant: TDK CORPORATION

Inventor： Toshio Tomonari ,  Hirohumi Asou ,  Toshifumi Komachi

IPC: H01Q7/00 ,  H01Q1/38 ,  H01Q1/52 ,  H01Q7/06 ,  H01Q1/24

Abstract: An antenna device is provided with a substrate; an antenna coil formed into a loop-shaped or spiral-shaped on the substrate; a first metallic layer overlapping with a first part of the antenna coil in a planar view; and a second metallic layer overlapping with a second part of the antenna coil different from the first part. The first and second metallic layers are disposed on both sides of a center of an inner diameter portion of the antenna coil in a planar view, respectively. A slit formed between the first and second metallic layers overlaps with the inner diameter portion of the antenna coil in a planar view. At least one of the first and second metallic layers is formed on the substrate together with the antenna coil.

公开(公告)号：US10149417B2

公开(公告)日：2018-12-04

申请号：US14710831

申请日：2015-05-13

Applicant: TDK CORPORATION

Inventor： Toshio Tomonari ,  Hirohumi Asou ,  Toshihiro Kuroshima

IPC: H05K9/00 ,  C23C18/16 ,  C23C18/31

Abstract: A magnetism suppressing sheet is provided with a metallic foil formed by plating and a magnetic film formed by applying magnetic metal powder-containing resin paste to one main surface of the metallic foil. A manufacturing method of a magnetism suppressing sheet includes the steps of preparing a support film on which a metallic foil has been formed, and forming a magnetic film by applying a magnetic metal powder-containing paste to one main surface of the metallic foil.

公开(公告)号：US10014101B2

公开(公告)日：2018-07-03

申请号：US15426325

申请日：2017-02-07

Applicant: TDK Corporation

Inventor： Yoshihiro Kawasaki ,  Syun Ashizawa ,  Hirohumi Asou ,  Nobuo Takagi

IPC: H01F27/29 ,  H01F27/02 ,  H01F27/24 ,  H01F27/255 ,  H01F27/28 ,  H01F3/10 ,  H01F17/04

CPC classification number: H01F27/255 ,  H01F3/10 ,  H01F17/045 ,  H01F27/2823 ,  H01F27/2828 ,  H01F27/29 ,  H01F27/292

Abstract: Disclosed herein is a coil component that includes a drum core having a winding core and first and second flange portions provided at opposite ends of the winding core; a wire wound around the winding core; terminal electrodes provided in the first and second flange portions, the terminal electrodes being connected to ends of the wire; and a magnetic top plate made of magnetic-powder containing resin in which magnetic powder is mixed in binder resin, the magnetic top plate being fixed to the first and second flange portions. The magnetic top plate has a lower surface facing the first and second flange portions and an upper surface located opposite to the lower surface. The density of the binder resin is higher in a surface layer part on a side of the upper surface than in a surface layer part on a side of the lower surface.

公开(公告)号：US20180175494A1

公开(公告)日：2018-06-21

申请号：US15840192

申请日：2017-12-13

Applicant: TDK Corporation

Inventor： Yuhei Horikawa ,  Makoto Orikasa ,  Yoshihiro Kanbayashi ,  Hisayuki Abe ,  Hirohumi Asou ,  Kosuke Kunitsuka

IPC: H01Q1/38 ,  H01Q1/22 ,  H01Q7/00

CPC classification number: H01Q1/38 ,  H01Q1/2208 ,  H01Q1/2225 ,  H01Q7/00 ,  H04B5/0031 ,  H04B5/0081

Abstract: Disclosed herein is a wiring component that includes a base material and a planar coil pattern formed on the base material. The planar coil pattern includes a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion connected to the first connecting position; and a connection wiring portion that short-circuits the second connecting position and the third connecting position. A cross-section structure of the planar coil pattern has a base resin layer formed on the base material, and a conductive layer formed on the base resin layer.

公开(公告)号：US09929781B2

公开(公告)日：2018-03-27

申请号：US15099046

申请日：2016-04-14

Applicant: TDK Corporation

Inventor： Toshifumi Komachi ,  Hirohumi Asou ,  Toshio Tomonari

IPC: H01Q7/06 ,  H01Q7/08 ,  H04B5/00

CPC classification number: H04B5/0081 ,  H01Q7/08

Abstract: An antenna device is provided with a magnetic core having a winding core and first and second flanges provided at one end and the other end of the winding core, respectively, an antenna coil constituted of a wire wound around the winding core, and a metal layer disposed parallel to a coil axis direction of the antenna coil. The metal layer has a slit overlapped with at least a part of the first flange in a plan view.