公开(公告)号：US12087498B2

公开(公告)日：2024-09-10

申请号：US17405017

申请日：2021-08-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dongbin Hou ,  Sombuddha Chakraborty ,  Kenji Kawano ,  Jeffrey Morroni ,  Yuki Sato

IPC: H01F17/04 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28 ,  H01F27/34 ,  H01F41/00 ,  H02M3/158

CPC classification number: H01F27/346 ,  H01F27/022 ,  H01F27/24 ,  H01F27/2847 ,  H01F41/005 ,  H02M3/1584 ,  H02M3/1586

Abstract: A device includes a first inductor and a second inductor reversely coupled with the first inductor. The first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor. The housing is filled with a magnetic molding compound.

公开(公告)号：US20240088647A1

公开(公告)日：2024-03-14

申请号：US18512134

申请日：2023-11-17

Applicant: Texas Instruments Incorporated

Inventor： Yogesh Kumar Ramadass ,  Ujwal Radhakrishna ,  Jeffrey Morroni

IPC: H02H7/20 ,  H01L23/525 ,  H03K17/687

CPC classification number: H02H7/20 ,  H01L23/5256 ,  H03K17/6871

Abstract: In one example, an apparatus comprises: a first switch and a second switch coupled between a fuse terminal and a ground terminal, the first switch having a first switch control terminal, the second switch having a second switch control terminal; and a driver circuit having a control input, a first control output, and a second control output, the control input coupled to the fuse terminal, the first control output coupled to the first switch control terminal, and the second control output coupled to the second switch control terminal.

公开(公告)号：US11430722B2

公开(公告)日：2022-08-30

申请号：US15951003

申请日：2018-04-11

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeffrey Morroni ,  Rajeev Dinkar Joshi ,  Sreenivasan K. Koduri ,  Sujan Kundapur Manohar ,  Yogesh K. Ramadass ,  Anindya Poddar

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/498 ,  H01L21/48 ,  H01L23/50

Abstract: A semiconductor package includes a leadframe, a semiconductor die attached to the leadframe, and a passive component electrically connected to the semiconductor die through the leadframe. The leadframe includes a cavity in a side of the leadframe opposite the semiconductor die, and at least a portion of the passive component resides within the cavity in a stacked arrangement.

公开(公告)号：US20220244638A1

公开(公告)日：2022-08-04

申请号：US17512959

申请日：2021-10-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hidetoshi Inoue ,  Kenji Kawano ,  Yuki Sato ,  Takafumi Ando ,  Michael Lueders ,  Stefan Herzer ,  Jeffrey Morroni

IPC: G03F7/00 ,  H01L21/027

Abstract: A permanent resist, such as TMMF, is used when patterning conductive material on a substrate, enabling lines that have a higher line-to-space ratio (L/S) or a higher aspect ratio (T/L) or both. Pattern density can thus be increased, allowing for improved performance (e.g., greater efficiency, in the case of transformer coil patterning) and greater heat dissipation. As examples, the permanent-resist-based patterning fabrication methods can be used to create transformer coils within an integrated circuit (IC) module, or a routable lead frame for one or more IC dies.

公开(公告)号：US20210343662A1

公开(公告)日：2021-11-04

申请号：US17138150

申请日：2020-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Takafumi Ando ,  Jeffrey Morroni ,  Charles Allen Devries, JR. ,  Kristen Nguyen Parrish

IPC: H01L23/64 ,  H01L49/02 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.

公开(公告)号：US11094455B2

公开(公告)日：2021-08-17

申请号：US16233804

申请日：2018-12-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dongbin Hou ,  Sombuddha Chakraborty ,  Kenji Kawano ,  Jeffrey Morroni ,  Yuki Sato

IPC: H01F27/24 ,  H01F27/34 ,  H01F27/28 ,  H01F27/02 ,  H01F41/00 ,  H02M3/158

Abstract: A device includes a first inductor and a second inductor reversely coupled with the first inductor, wherein the first and second inductors have overlapping windings. The device also includes a housing for the first and second inductor, wherein the housing is filled with a magnetic molding compound.

公开(公告)号：US10044257B1

公开(公告)日：2018-08-07

申请号：US15424426

申请日：2017-02-03

Applicant: Texas Instruments Incorporated

Inventor： Rahmi Hezar ,  Jeffrey Morroni

IPC: H02M1/44 ,  H02M1/14 ,  H02M3/156 ,  H02M1/00

Abstract: Methods and apparatus for providing adaptive electromagnetic interference control in a power converter are disclosed. An example apparatus includes a current interface to measure an internal current of the power converter. The example apparatus further includes a performance determiner to determine a spur power of an output voltage of the power converter based on the measured internal current. The example apparatus further includes a ramp generator to adjust a hopping configuration of a ramp voltage based on the spur power.

公开(公告)号：US09660531B1

公开(公告)日：2017-05-23

申请号：US14932705

申请日：2015-11-04

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Monodeep Kar ,  Saurav Bandyopadhyay ,  Jeffrey Morroni

IPC: H02M3/158

CPC classification number: H02M3/1588 ,  Y02B70/1466

Abstract: A power converter includes a power stage having a switch-node of a switched-mode power supply that is coupled to an input voltage node by a power field-effect transistor (FET) to energize an inductive circuit and is coupled to a ground node by a synchronous rectifier in parallel with the inductive circuit. The power converter also includes a controller coupled to the power stage. The controller controls switching of the power FET and synchronous rectifier in a complimentary manner. The controller switches on the power FET during a first switching cycle. Subsequently, the controller switches on the synchronous rectifier and, in response to a current through the inductive circuit being approximately zero, switches off the synchronous rectifier. Subsequently, the controller switches on the synchronous rectifier again to generate a negative current through the inductive circuit prior to entering a second switching cycle.