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21.发明授权公开(公告)号：US10122367B1
公开(公告)日：2018-11-06
申请号：US15712239
申请日：2017-09-22
Applicant: Texas Instruments Incorporated
Abstract: Disclosed examples include isolated phase shifted dual active bridge DC to DC converters with a first bridge circuit operative according to a primary side clock signal to provide a primary voltage signal to a transformer primary winding, a second bridge circuit operative according to a secondary side clock signal to convert a secondary voltage signal from a transformer secondary winding to provide an output voltage signal, and a secondary side control circuit that alternately operates in a first mode to regulate the output voltage signal by controlling a phase shift angle between switching transitions of secondary side switching control signals and switching transitions of the secondary side clock signal, and a second mode to discontinue the secondary side switching control signals and synchronize the secondary side clock signal to transitions in the secondary voltage signal while the secondary side switching control signals are discontinued.
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公开(公告)号：US09570992B2
公开(公告)日：2017-02-14
申请号：US14984076
申请日：2015-12-30
Applicant: Texas Instruments Incorporated
Inventor： Roberto Giampiero Massolini , Maurizio Granato , Giovanni Frattini
IPC: H02M3/335
CPC classification number: H02M3/33507 , H02M3/158 , H02M2001/008 , H02M2001/009
Abstract: Disclosed examples include multiple output DC to DC converters with a buck converter including a half bridge switching circuit and transformer primary winding to provide a first output voltage signal, as well as a boost converter to provide an isolated second output voltage signal. The boost converter includes a transformer secondary winding magnetically coupled with the primary winding to provide a boost converter inductor, a switching circuit, an output diode providing the second output voltage signal, and a PWM controller that synchronizes the boost converter switching with the low side switch of the buck converter based on a sensed voltage of the transformer secondary winding.
Abstract translation: 公开的示例包括具有包括半桥开关电路和变压器初级绕组的降压转换器的多输出DC至DC转换器，以提供第一输出电压信号，以及提供隔离的第二输出电压信号的升压转换器。 升压转换器包括与初级绕组磁耦合的变压器次级绕组，以提供升压转换器电感器，开关电路，提供第二输出电压信号的输出二极管和将升压转换器开关与低压开关同步的PWM控制器 基于感测到的变压器次级绕组的电压的降压转换器。
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公开(公告)号：US20150069572A1
公开(公告)日：2015-03-12
申请号：US14025807
申请日：2013-09-12
Applicant: Texas Instruments Incorporated
Inventor： Vijaylaxmi Khanolkar , Anindya Poddar , Randall Walberg , Giovanni Frattini , Roberto Giampiero Massolini
CPC classification number: H01F27/2804 , H01F2027/2809 , H01F2027/2819 , H01L23/645 , H01L24/48 , H01L24/49 , H01L28/10 , H01L2224/48091 , H01L2224/48137 , H01L2224/48195 , H01L2224/48247 , H01L2924/00014 , H01L2924/12042 , H01L2924/19107 , H01L2224/45099 , H01L2924/00
Abstract: A semiconductor package is provided that has a transformer formed within a multilayer dielectric laminate substrate. The transformer has a first inductor coil formed in one or more dielectric laminate layers of the substrate, a second inductor coil formed in one or more dielectric laminate layers of the substrate, and an isolation barrier comprising two or more dielectric laminate layers of the multilayer substrate positioned between the first inductor coil and the second inductor coil. The transformer may be mounted on a lead frame along with one or more integrated circuits and molded into a packaged isolation device.
Abstract translation: 提供一种半导体封装，其具有形成在多层电介质层叠基板内的变压器。 变压器具有形成在衬底的一个或多个电介质层压层中的第一电感线圈，形成在衬底的一个或多个电介质层压层中的第二电感线圈，以及包括多层衬底的两个或多个介电层压层的隔离屏障 位于第一电感线圈和第二电感线圈之间。 变压器可以与一个或多个集成电路一起安装在引线框架上并被模制成封装的隔离装置。
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公开(公告)号：US11257739B2
公开(公告)日：2022-02-22
申请号：US16927694
申请日：2020-07-13
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Joyce Marie Mullenix , Roberto Giampiero Massolini , Rajeev D. Joshi
IPC: H01L23/495 , H01L23/00
Abstract: A method includes forming a first magnetic material on a first surface of a conductive loop, forming a second magnetic material on a second surface of the conductive loop opposite the first surface to form an inductor, attaching a semiconductor die to a leadframe, and attaching the inductor to the leadframe with solder balls. The semiconductor die is between the inductor and the leadframe. The conductive loop: spans parallel to the leadframe; or is between the first magnetic material and the second magnetic material.
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公开(公告)号：US11133375B2
公开(公告)日：2021-09-28
申请号：US16905197
申请日：2020-06-18
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Benjamin Stassen Cook , Roberto Giampiero Massolini , Daniel Carothers
IPC: H01L21/00 , H01L49/02 , H01L23/495 , H01L27/06 , H01L21/3065 , H01L21/768 , H01L23/498 , H01L23/00
Abstract: In an integrated circuit (IC), a semiconductor substrate has a first side and an opposite second side. The second side has a trench. Circuitry is on the first side. An inductive structure is within the trench. The inductive structure is connected to the circuitry through vias in the semiconductor substrate. The semiconductor substrate is mounted on a package substrate. At least a portion of the inductive structure contacts the package substrate. The circuitry is coupled to the inductive structure through wires to the package substrate.
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Patent Agency Ranking
公开(公告)号：US10714412B2
公开(公告)日：2020-07-14
申请号：US15820736
申请日：2017-11-22
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Joyce Marie Mullenix , Roberto Giampiero Massolini , Rajeev D. Joshi
IPC: H01L23/495 , H01L23/00
Abstract: A semiconductor package includes a leadframe comprising input/output pins accessible external to the semiconductor package and a semiconductor die electrically connected to the leadframe. The semiconductor package also includes a passive electrical component mounted on a side of the semiconductor die opposite the leadframe. Mold compound encapsulates the passive electrical component, semiconductor die, and leadframe to form the semiconductor package. Associated methods are disclosed as well.
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27.发明授权公开(公告)号：US10574252B2
公开(公告)日：2020-02-25
申请号：US16233198
申请日：2018-12-27
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Martijn Fridus Snoeij , Mikhail Valeryevich Ivanov , Roberto Giampiero Massolini , Brian David Johnson
Abstract: In at least some embodiments, a system comprises a frequency generator configured to generate a second clock signal having a second frequency using a first clock signal having a first frequency. The second frequency is offset from the first frequency and each of a plurality of harmonic frequencies of the second frequency is offset from a harmonic frequency of the first frequency. The system also includes a power converter configured to produce a power signal that at least partially corresponds to the second frequency. The system further comprises an analog-to-digital converter (ADC) configured to sample and convert analog voltages at the first frequency. The ADC is powered by the power signal.
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28.发明授权公开(公告)号：US10218374B2
公开(公告)日：2019-02-26
申请号：US15395212
申请日：2016-12-30
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Martijn Fridus Snoeij , Mikhail Valeryevich Ivanov , Roberto Giampiero Massolini , Brian David Johnson
Abstract: In at least some embodiments, a system comprises a frequency generator configured to generate a second clock signal having a second frequency using a first clock signal having a first frequency. The second frequency is offset from the first frequency and each of a plurality of harmonic frequencies of the second frequency is offset from a harmonic frequency of the first frequency. The system also includes a power converter configured to produce a power signal that at least partially corresponds to the second frequency. The system further comprises an analog-to-digital converter (ADC) configured to sample and convert analog voltages at the first frequency. The ADC is powered by the power signal.
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公开(公告)号：US10032850B2
公开(公告)日：2018-07-24
申请号：US15152518
申请日：2016-05-11
Applicant: Texas Instruments Incorporated
Inventor： Benjamin Stassen Cook , Roberto Giampiero Massolini , Daniel Carothers
IPC: H01L21/00 , H01L49/02 , H01L21/3065 , H01L21/768 , H01L23/495 , H01L23/498
Abstract: An integrated circuit (IC) that includes a circuit substrate having a front side surface and an opposite back side surface. Active circuitry is located on the front side surface. An inductive structure is located within a deep trench formed in the circuit substrate below the backside surface. The inductive structure is coupled to the active circuitry.
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公开(公告)号：US09338533B2
公开(公告)日：2016-05-10
申请号：US14204280
申请日：2014-03-11
Applicant: Texas Instruments Incorporated
Inventor： Maurizio Granato , Giovanni Frattini , Roberto Giampiero Massolini
CPC classification number: B06B1/0284 , B06B1/0292 , H04R1/00 , H04R3/06 , H04R2217/03
Abstract: A transducer has an input and produces a mechanical output, wherein the magnitude of the mechanical output of the transducer is dependent on the frequency and magnitude of current at the input. A driver for the transducer includes a device having a transfer function associated with the device, the device having a device input and a device output, the device output being connectable to the input of the transducer and the device input being connectable to a power source. The device attenuates the current output at a frequency that causes a peak in the magnitude of the mechanical output of the transducer.
Abstract translation: 换能器具有输入并产生机械输出，其中换能器的机械输出的大小取决于输入端的电流的频率和幅度。 用于换能器的驱动器包括具有与装置相关联的传递功能的装置，所述装置具有装置输入和装置输出，所述装置输出可连接到所述换能器的输入端，所述装置输入可连接到电源。 该器件以导致换能器的机械输出大小的峰值的频率衰减电流输出。
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