公开(公告)号：US20220178988A1

公开(公告)日：2022-06-09

申请号：US17541551

申请日：2021-12-03

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shigeru KASAI ,  Fumiya FUJII

IPC: G01R31/28 ,  H03F3/217 ,  H03M3/00 ,  G05D23/19 ,  H05B1/02

Abstract: A power supply for supplying a power to a heating mechanism used for heating a measurement target that emits a measurement signal includes an input device configured to output an input signal that reflects a control signal in a differentiable periodic waveform having a frequency of 1 kHz or less. The power supply includes a switching amplifier configured to amplify the input signal from the input device and output the amplified signal.

公开(公告)号：US20210382105A1

公开(公告)日：2021-12-09

申请号：US17287836

申请日：2019-10-17

Applicant: Tokyo Electron Limited

Inventor： Naoki AKIYAMA ,  Susumu SAITO ,  Hiroyuki NAKAYAMA ,  Shigeru KASAI

IPC: G01R31/28 ,  G01R31/308

Abstract: An inspection apparatus for inspecting a backside irradiation type imaging device formed on an inspection object includes: a stage on which the inspection object is mounted such that the stage faces a rear surface of the backside irradiation type imaging device, wherein the stage includes: a transmitter including a flat plate formed of a light transmitting material, and configured to mount the inspection object on the transmitter; and a light emitter disposed at a location facing the inspection object with the transmitter interposed between the light emitter and the inspection object, and configured to emit light toward the transmitter, and wherein the transmitter transmits the light from the light emitter while diffusing the light.

公开(公告)号：US20210208194A1

公开(公告)日：2021-07-08

申请号：US17056524

申请日：2019-05-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shigeru KASAI ,  Yoshinori FUJISAWA

IPC: G01R31/28

Abstract: An apparatus for inspecting an electronic device, includes: a placement table on which a substrate having the electronic device provided thereon is placed and including a refrigerant flow path; a light irradiation mechanism having LEDs directed to the substrate; and a controller for controlling heat absorption by the refrigerant and heating by light from the LEDs. The controller includes: a temperature information acquisition part for acquiring information on a temperature of the electronic device; a heating controller for performing the heating control based on the temperature of the electronic device as a current inspection object; and a heat absorption controller for estimating a transition of power applied to the electronic device at a next inspection based on a transition of the temperature of the electronic device in a past inspection, and performing the heat absorption control at a time of the next inspection.

公开(公告)号：US20210102991A1

公开(公告)日：2021-04-08

申请号：US16464174

申请日：2017-09-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shigeru KASAI ,  Yoshinori FUJISAWA

IPC: G01R31/26 ,  G01R1/067

Abstract: Provided is an electronic device inspection apparatus that suppresses cost increase. A prober is provided with a stage on which a carrier or a wafer is placed. The stage is provided with a stage cover on which the carrier is placed, a cooling unit in contact with the stage cover, and an LED irradiation unit facing the carrier across the stage cover and the cooling unit. Each of the stage cover and the cooling unit is formed of light-transmitting material. A light-transmitting coolant flows in a coolant flow path in the cooling unit. The LED irradiation unit has a plurality of LEDs oriented to the carrier. The carrier is formed of a glass substrate having a substantially disk-like shape. A plurality of electronic devices is arranged on a surface of the carrier at predetermined intervals.

公开(公告)号：US20200174066A1

公开(公告)日：2020-06-04

申请号：US16697486

申请日：2019-11-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masahito KOBAYASHI ,  Shigeru KASAI

IPC: G01R31/28

Abstract: A temperature control device for controlling a temperature of an object, the temperature control device includes a heater having a heating source configured to heat the object, a cooler having a cooling source configured to cool the object; and a temperature controller configured to control the heating source and the cooling source. The temperature controller includes a sliding mode controller configured to supply power to the heating source as an operation amount, a cooling mode controller configured to supply power to the cooling source as an operation amount, and a switching controller configured to determine whether an output of the sliding mode controller will be output to the heating source as a first operation amount, or an output of the cooling mode controller will be used as a second operation amount, based on a nonlinear term value of the output of the sliding mode controller.

公开(公告)号：US20160284516A1

公开(公告)日：2016-09-29

申请号：US15075670

申请日：2016-03-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Taro IKEDA ,  Akira TANIHARA ,  Shigeru KASAI ,  Nobuhiko YAMAMOTO

IPC: H01J37/32

CPC classification number: H01J37/3222 ,  H01J37/32192 ,  H01J37/32211 ,  H01J37/32238

Abstract: A microwave plasma source for forming a surface wave plasma by radiating a microwave into a chamber of a plasma processing apparatus, which includes: a microwave output part for outputting the microwave; a microwave transmission part for transmitting the microwave; and a microwave radiation member for radiating the microwave into the chamber. The microwave transmission part includes a plurality of microwave introduction mechanisms circumferentially arranged in a peripheral portion of the microwave radiation member and configured to introduce the microwave into the microwave radiation member. The microwave radiation member includes a metal main body, a plurality of dielectric slow-wave members arranged in an overall annular shape in the vicinity of an arrangement surface of the main body, an annular dielectric microwave transmission member arranged in a microwave radiation surface of the main body, and a slot antenna part installed between the slow-wave members and the microwave transmission member.

Abstract translation: 一种微波等离子体源，用于通过将微波辐射到等离子体处理装置的腔室中来形成表面波等离子体，其包括：用于输出微波的微波输出部分; 用于传送微波的微波传输部分; 以及用于将微波辐射到室中的微波辐射构件。 微波传输部分包括多个微波引入机构，其周向布置在微波辐射部件的周边部分中，并被配置为将微波引入到微波辐射部件中。 微波辐射构件包括金属主体，在主体的配置表面附近布置成整体环形的多个电介质慢波构件，布置在主体的微波辐射表面中的环形介电微波传输构件 主体和安装在慢波构件和微波传输构件之间的缝隙天线部分。

公开(公告)号：US20160222516A1

公开(公告)日：2016-08-04

申请号：US14917414

申请日：2014-09-04

Applicant: TOKYO ELECTRON LIMITED

Inventor： Taro IKEDA ,  Shigeru KASAI ,  Emiko HARA ,  Yutaka FUJINO ,  Yuki OSADA ,  Jun NAKAGOMI ,  Tomohito KOMATSU

IPC: C23C16/511 ,  C23C16/455 ,  H01J37/32

Abstract: A plasma processing device processes a substrate by generating plasma using a surface wave formed on a surface of a shower plate by a supplied microwave, which includes a plasma generating antenna equipped with the shower plate for supplying first and second gases into a processing vessel, and a drooping member installed to protrude downward from a lower end surface of the shower plate. An outer surface of the drooping member spreads outward as it goes from a top end to a bottom end thereof. The shower plate includes first and second gas supply holes through which the first and second gases are supplied into the processing vessel, respectively. The first gas supply holes are disposed inward of the outer surface of the drooping member. The second gas supply holes are disposed outward of the outer surface of the drooping member.

Abstract translation: 等离子体处理装置通过利用供给的微波在表面波形成的喷淋板的表面波上产生等离子体来进行处理，该等离子体处理装置包括配备有用于将第一和第二气体供给到处理容器中的喷淋板的等离子体发生天线， 安装成从淋浴板的下端面向下方突出的下垂部件。 下垂构件的外表面从顶端到底端向外扩散。 淋浴板包括第一和第二气体供应孔，第一和第二气体分别通过第一和第二气体供应孔被供应到处理容器中。 第一气体供给孔设置在下垂构件的外表面的内侧。 第二气体供给孔设置在下垂构件的外表面的外侧。