公开(公告)号：US09748697B2

公开(公告)日：2017-08-29

申请号：US14798536

申请日：2015-07-14

Applicant: Tyco Electronics Corporation ,  TYCO ELECTRONICS JAPAN G.K.

Inventor： Sandeep Patel ,  Linda Ellen Shields ,  Bruce Allen Champion ,  Chad William Morgan ,  Masayuki Aizawa

IPC: H01R13/66 ,  H01R13/6471 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R13/6471 ,  H01R13/6616 ,  H05K1/0228 ,  H05K1/023 ,  H05K1/117 ,  H05K2201/09409

Abstract: Pluggable connector includes a plug housing configured to couple to a communication cable. The plug housing has a plug cavity. The pluggable connector also includes a module board that is disposed within the plug cavity and configured to be communicatively coupled to the communication cable. The module board has a mating edge configured to interface with a mating connector. The module board includes a plurality of signal pathways and a plurality of ground pathways in which the signal pathways are interleaved between corresponding ground pathways. The signal and ground pathways include respective contact pads that are disposed proximate to the mating edge for engaging corresponding contacts of the mating connector. Each of the ground pathways has separate first and second trace segments and a damping component that electrically joins the first and second trace segments.

公开(公告)号：US20170207579A1

公开(公告)日：2017-07-20

申请号：US14996692

申请日：2016-01-15

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Sandeep Patel ,  Bruce Allen Champion ,  Linda Ellen Shields ,  Michael John Phillips ,  Thomas Taake de Boer ,  John Joseph Consoli

IPC: H01R13/6473 ,  H01R12/72

CPC classification number: H01R13/6473 ,  H01R12/721 ,  H01R12/724 ,  H01R13/6471 ,  H01R24/60 ,  H05K1/0233 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/086 ,  H05K2201/10189

Abstract: An interconnect system includes a circuit board including a substrate having a first surface and a second surface opposite the first surface, a plurality of signal conductors and a plurality of ground conductors including respective contact pads in a mating area of the substrate for engaging corresponding contacts of an electrical connector, and a plurality of ground vias extending at least partially through the substrate between the first and second surfaces. The ground vias are coupled to corresponding ground conductors. The ground vias include lossy plugs at least partially filling the ground vias. The lossy plugs are manufactured from lossy material capable of absorbing electrical resonance propagating through the substrate.

公开(公告)号：US09692183B2

公开(公告)日：2017-06-27

申请号：US14600542

申请日：2015-01-20

Applicant: Tyco Electronics Corporation

Inventor： Michael John Phillips ,  Matthew Ryan Schmitt ,  Bruce Allen Champion ,  Brandon Michael Matthews ,  Steve Douglas Sattazahn

IPC: H01R13/648 ,  H01R13/6471 ,  H01R107/00 ,  H01R12/72

CPC classification number: H01R13/6471 ,  H01R12/724 ,  H01R2107/00

Abstract: A receptacle connector includes a housing having a slot configured to receive a mating connector therein. Signal contacts are held by the housing. The signal contacts include signal mating segments and signal mounting segments. The signal mating segments include signal mating interfaces that are exposed within the slot for engagement with the mating connector. Ground contacts are held by the housing. The ground contacts include ground mating segments and ground mounting segments. The ground mating segments include ground mating interfaces that are exposed within the slot for engagement with the mating connector. A ground bus electrically commons the ground contacts with each other. The ground contacts and the ground bus are integrally fabricated as a single, unitary, continuous structure.

公开(公告)号：US20170170606A1

公开(公告)日：2017-06-15

申请号：US14967605

申请日：2015-12-14

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Michael John Phillips ,  Thomas Taake de Boer ,  Bruce Allen Champion ,  John Joseph Consoli ,  Sandeep Patel ,  Linda Ellen Shields

IPC: H01R13/6471 ,  H01R12/70 ,  H01R13/6585

CPC classification number: H01R13/6471 ,  H01R12/7005 ,  H01R12/721 ,  H01R12/725 ,  H01R12/735 ,  H01R13/405 ,  H01R13/6585

Abstract: An electrical connector includes a housing having a first end and a second end with a mating slot formed between the first and second ends configured to receive a mating connector having contact pads. A leadframe assembly is disposed in the housing. The leadframe assembly has a contact array including ground contacts and signal contacts interspersed between corresponding ground contacts. The leadframe assembly has an overmold body supporting the ground and signal contacts. The overmold body has lossy ground absorbers coupled to corresponding ground contacts. The lossy ground absorbers are manufactured from lossy material absorbing electrical resonance propagating through the leadframe assembly.

公开(公告)号：US09559465B2

公开(公告)日：2017-01-31

申请号：US14445160

申请日：2014-07-29

Applicant: Tyco Electronics Corporation

Inventor： Michael John Phillips ,  Michael Eugene Shirk ,  Bruce Allen Champion ,  Linda Ellen Shields

IPC: H01R13/6461 ,  H01R13/6471 ,  H01R13/6587 ,  H01R13/6585 ,  H01R12/72

CPC classification number: H01R13/6461 ,  H01R12/724 ,  H01R13/6471 ,  H01R13/6585 ,  H01R13/6587

Abstract: An electrical connector assembly may include a plurality of signal isolating barriers. Each of the plurality of signal isolating barriers may be positioned around a group of board contacts proximate to a board connecting interface. Each of the plurality of signal isolating barriers isolates the group of the plurality of board contacts from other groups of the plurality of board contacts.

Abstract translation: 电连接器组件可以包括多个信号隔离屏障。 多个信号隔离屏障中的每一个可以围绕靠近板连接接口的一组板触点定位。 多个信号隔离屏障中的每一个将多个电路板触点的组与多个电路板触点的其他组隔离。

公开(公告)号：US20160336692A1

公开(公告)日：2016-11-17

申请号：US14712370

申请日：2015-05-14

Applicant: Tyco Electronics Corporation

Inventor： Bruce Allen Champion ,  Chad William Morgan

IPC: H01R13/6471 ,  H01R13/6585 ,  H01R12/72

CPC classification number: H01R13/6471 ,  H01R12/721 ,  H01R13/6585

Abstract: An electrical connector includes a housing and a plurality of ground wafers and signal wafers. A front side is configured to mate with a mating connector. The ground wafers and signal wafers are stacked next to one another along a stack axis. The ground wafers are interleaved between adjacent pairs of the signal wafers. Each signal wafer includes at least one signal conductor held by a signal holder that is composed of a first material. Each ground wafer includes at least one ground conductor held by a ground holder that is composed of second material. The second material is a lossy material and the first material is a low loss dielectric material that has a loss tangent that is lower than a loss tangent of the lossy material. The signal conductors and the ground conductors are configured to engage and electrically connect to the mating connector.

Abstract translation: 电连接器包括壳体和多个接地晶片和信号晶片。 前侧配置成与配合连接器配合。 接地晶片和信号晶片沿着堆叠轴线彼此堆叠。 接地晶片在相邻的信号晶片对之间交错。 每个信号晶片包括由信号保持器保持的至少一个由第一材料组成的信号导体。 每个接地晶片包括由第二材料构成的由接地保持器保持的至少一个接地导体。 第二种材料是有损耗材料，第一种材料是低损耗介电材料，其损耗角正切值低于有损耗材料的损耗角正切值。 信号导体和接地导体被配置成与配合连接器接合并电连接。

公开(公告)号：US09490587B1

公开(公告)日：2016-11-08

申请号：US14967563

申请日：2015-12-14

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Michael John Phillips ,  Thomas Taake de Boer ,  Bruce Allen Champion ,  John Joseph Consoli ,  Sandeep Patel ,  Linda Ellen Shields

IPC: H01R9/03 ,  H01R13/6586 ,  H01R13/6599 ,  H01R13/6587

CPC classification number: H01R13/6586 ,  H01R13/6587 ,  H01R13/6599

Abstract: A contact module stack includes signal contact modules and ground contact modules flanking the signal contact modules in a ground-signal-signal-ground contact module arrangement. The signal contact modules each include signal leadframes and signal dielectric bodies. The ground contact modules each include ground leadframes and ground dielectric bodies. The ground leadframes each have at least one ground contact. Each ground dielectric body has a low loss layer on a first side of the ground leadframe and a lossy layer on a second side of the ground leadframe. The lossy layer and the low loss layer substantially enclose a transition portion of the ground contact. The lossy layers are manufactured from lossy material having conductive particles in a dielectric binder material. The lossy layers absorb electrical resonance propagating through the contact module stack.

Abstract translation: 触点模块堆叠包括接地信号 - 接地触头模块装置中的信号触头模块侧面的信号触点模块和接地触头模块。 信号触点模块各自包括信号引线框架和信号电介质体。 接地触头模块各自包括接地引线框架和接地绝缘体。 接地引线框架各自具有至少一个接地触点。 每个接地电介质体在接地引线框架的第一侧具有低损耗层，在接地引线框架的第二侧具有有损层。 有损层和低损耗层基本上包围接地触点的过渡部分。 有损层由介电粘合剂材料中具有导电颗粒的有损耗材料制成。 有损层吸收通过触点模块叠层传播的电谐振。