公开(公告)号：US20100025019A1

公开(公告)日：2010-02-04

申请号：US12518357

申请日：2007-12-03

申请人： Hitoshi Sakamoto ,  Kazuyuki Mikubo ,  Sakae Kitajo

发明人： Hitoshi Sakamoto ,  Kazuyuki Mikubo ,  Sakae Kitajo

IPC分类号： H01L23/34 ,  F28D15/00 ,  F28F13/00 ,  B21D53/02

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： Behavior of a vapor bubble that emerges should be controlled to improve operational stability and reliability of a phase shift heat exchanger having a microchannel. The heat exchanger has a dual layer structure and includes a material that is elastically deformed according to pressure difference between the layers. The layers are connected, and at the connection interface a resistance unit that exerts a predetermined resistance against a coolant flowing from the coolant supplying layer toward the microchannel layer is provided, to maintain internal pressure of the coolant supplying layer higher than that of the microchannel, under a normal operation. Once a vapor bubble emerges, the relationship in strength of the internal pressure is turned over, and the elastic material is lifted so that the vapor bubble is dividedly distributed over a plurality of microchannels. Alternatively, the internal pressure of the coolant supplying layer may be maintained lower than that of the microchannel, so that once a vapor bubble emerges the vapor bubble is drawn to the lower pressure side.

摘要翻译： 应该控制出现气泡的行为，以提高具有微通道的相移式热交换器的操作稳定性和可靠性。 热交换器具有双层结构，并且包括根据层之间的压力差弹性变形的材料。 这些层被连接，并且在连接接口处设置有电阻单元，其对从冷却剂供应层朝向微通道层流动的冷却剂施加预定电阻，以保持冷却剂供应层的内部压力高于微通道的内部压力， 正常运作。 一旦蒸汽气泡出现，内部压力的强度关系就会翻转，并且弹性材料被提升，使得气泡分散在多个微通道上。 或者，冷却剂供给层的内部压力可以保持低于微通道的内部压力，使得一旦蒸汽气泡出现，则蒸汽气泡被吸入低压侧。

公开(公告)号：US20100012299A1

公开(公告)日：2010-01-21

申请号：US12523579

申请日：2008-01-15

申请人： Hitoshi Sakamoto ,  Kazuyuki Mikubo ,  Sakae Kitajo

发明人： Hitoshi Sakamoto ,  Kazuyuki Mikubo ,  Sakae Kitajo

IPC分类号： F28F13/02 ,  F28D15/02 ,  F28F7/00

CPC分类号： H01L23/427 ,  F28D15/046 ,  F28F13/18 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： According to the present invention, there is provided a heat exchanger unit having, over a base, a surface-modified portion composed of a metal, the surface-modified portion being brought into contact with a flow path provided for a liquid refrigerant, wherein the liquid refrigerant is a liquid having a surface tension smaller than that of water, and the surface-modified portion has a porous structure, in which a plurality of recesses are provided on the flow path side thereof, each recess has an introduction path having a cross-section area gradually reduced from the inlet of the recess, and a cavity communicated with the introduction path while placing an inflection portion in between, and the shortest distance between the inflection portion and the flow path is larger than the shortest distance between the cavity and the flow path.

摘要翻译： 根据本发明，提供了一种热交换器单元，其在基座上具有由金属构成的表面改性部分，所述表面改性部分与设置用于​​液体制冷剂的流路接触，其中， 液体制冷剂是具有小于水的表面张力的液体，并且表面改性部分具有多孔结构，其中在其流动路径侧上设置有多个凹部，每个凹部具有十字形的引入路径 切口区域从凹部的入口逐渐减小，并且与入口路径连通，同时在其间设置拐点部分，并且拐点部分和流动路径之间的最短距离大于腔体和 流路。

公开(公告)号：US07483261B2

公开(公告)日：2009-01-27

申请号：US10561980

申请日：2004-06-25

申请人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Atsushi Ochi ,  Mitsuru Yamamoto

发明人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Atsushi Ochi ,  Mitsuru Yamamoto

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A cooling device includes a cooling panel wherein a passage is formed by bonding together a bottom heat radiation plate having a groove formed therein and a top heat radiation plate, and a circulation pump circulating refrigerant within the passage. The top heat radiation plate is provided with an outlet port through which the refrigerant flows out from the passage to the circulation pump and an inlet port through which the refrigerant flows in from the circulation pump to the passage. The circulation pump is fixed onto the top heat radiation plate of the cooling panel so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.

摘要翻译： 冷却装置包括冷却板，其中通过将具有形成在其中的槽的底部散热板和顶部散热板结合在一起形成通道，以及在通道内循环制冷剂的循环泵。 顶部散热板设有出口，制冷剂通过该出口从通道流到循环泵，以及制冷剂从循环泵流入通道的入口。 循环泵被固定在冷却板的顶部散热板上，使得吸入口和排出口分别与出口和入口对准。

公开(公告)号：US07420807B2

公开(公告)日：2008-09-02

申请号：US10524770

申请日：2003-08-18

申请人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Mitsuru Yamamoto

发明人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Mitsuru Yamamoto

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.

摘要翻译： 本发明提供了一种易于构建并将其固定在电子设备上的散热装置，其热传导和散热优良，并且可以使装置的总体构型变薄。 液体冷却单元9和空气冷却单元12形成为一个单元。 液体冷却单元9的吸热表面19接触或结合到具有最大功率消耗的CPU和热发生器等发热组件，并且还在箱体2的小区域内局部地产生热量。 在液体冷却单元9中，布置有由电磁泵组成的液体冷却泵14，用于使冷却剂在流路10中循环。 由CPU 6，发热体7等发热部件产生的热量，通过使冷却液与液体冷却泵14循环，热传导到整个液体冷却单元9。

公开(公告)号：US20070065308A1

公开(公告)日：2007-03-22

申请号：US10566580

申请日：2004-07-21

申请人： Mitsuru Yamamoto ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Sakae Kitajo

发明人： Mitsuru Yamamoto ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Sakae Kitajo

IPC分类号： F04B17/00

CPC分类号： F04B43/02 ,  F04B43/046

摘要： A diaphragm pump enabling an increase in pump efficiency by reducing the pressure loss of liquid and reduction in thickness. The flow passage in piezoelectric pump (1) includes a pressure chamber (50) formed into a flat shape in cross section and a suction side flow passage (70a) and discharge side flow passage (70b). The suction side flow passage (70a) and the discharge side flow passage (70b) are disposed at both ends of the pressure chamber (50) so that the axes thereof are aligned with each other. The check valves (20a, 20b) are respectively disposed on the suction side flow passage (70a) and the discharge side flow passage (70b), and are tilted relative to the flow direction of the liquid.

摘要翻译： 一种隔膜泵，通过减少液体的压力损失和减小厚度，可以提高泵的效率。 压电泵（1）中的流路包括形成为扁平形状的压力室（50）和吸入侧流路（70a）和排出侧流路（70b）。 吸入侧流路（70a）和排出侧流路（70b）设置在压力室（50）的两端，使其轴线彼此对准。 止回阀（20a，20b）分别设置在吸入侧流路（70a）和排出侧流路（70b）上，相对于液体的流动方向倾斜。

公开(公告)号：US06999643B2

公开(公告)日：2006-02-14

申请号：US10303976

申请日：2002-11-26

申请人： Hideo Kikuchi ,  Mikio Oda ,  Hikaru Kouta ,  Sakae Kitajo ,  Yuzo Shimada

发明人： Hideo Kikuchi ,  Mikio Oda ,  Hikaru Kouta ,  Sakae Kitajo ,  Yuzo Shimada

IPC分类号： G02B6/12

CPC分类号： G02B6/4228 ,  G02B6/138 ,  G02B6/305 ,  G02B6/42 ,  G02B6/4202 ,  G02B6/4204 ,  G02B6/423 ,  G02B6/43 ,  G02B2006/12069 ,  G02B2006/1215 ,  G02B2006/12159 ,  H05K1/0274

摘要： After an optical waveguide substrate including a supporting substrate is adhered to an electric wiring board, the supporting substrate alone is dissolved using an organic solvent for removal. Alternatively, the supporting substrate alone is melted through a thermal treatment for removal. Further, a core layer of an optical waveguide is formed on the substrate using a photosensitive resin having a thermal expansion coefficient substantially identical to that of the supporting substrate.

摘要翻译： 在将包括支撑基板的光波导基板粘附到电气布线板上之后，仅使用有机溶剂溶解支撑基板以进行除去。 或者，单独的支撑衬底通过热处理熔化以除去。 此外，使用具有与支撑基板的热膨胀系数基本相同的热膨胀系数的感光性树脂，在基板上形成光波导的芯层。

公开(公告)号：US20050231914A1

公开(公告)日：2005-10-20

申请号：US10524770

申请日：2003-08-18

申请人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Mitsuru Yamamoto

发明人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Mitsuru Yamamoto

IPC分类号： G06F1/20 ,  H01L23/467 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/473 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.

摘要翻译： 本发明提供了一种易于构建并将其固定在电子设备上的散热装置，其热传导和散热优良，并且可以使装置的总体构型变薄。 液体冷却单元9和空气冷却单元12形成为一个单元。 液体冷却单元9的吸热表面19接触或结合到功率消耗最大的诸如CPU和发热体的发热组件，并且还在箱2中的小区域内局部产生热量。 液体冷却单元9，由电磁泵构成的液体冷却泵14布置成使冷却剂在流路10中循环。由诸如CPU 6，发热体7等的发热组件产生的热量是热的 通过使液体冷却泵14循环冷却剂，将热传导到整个液体冷却单元9中。

公开(公告)号：US06238086B1

公开(公告)日：2001-05-29

申请号：US09239835

申请日：1999-01-29

申请人： Kazuyuki Mikubo ,  Sakae Kitajo

发明人： Kazuyuki Mikubo ,  Sakae Kitajo

IPC分类号： G01N2518

CPC分类号： G01N25/18 ,  G01K7/42 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01039 ,  H01L2924/1532 ,  H01L2924/00014

摘要： The thermal resistance of an entire semiconductor package with a semiconductor chip and radiation fins is calculated based on thermal resistance of resin between the semiconductor chip and case, thermal resistance of the radiation fins, and thermal resistance of three heat radiation paths in the semiconductor package. One of said three heat radiation paths is passing through the bottom surface of the case. The other of said three radiation paths is passing through the leadframe. The other of three radiation paths is passing through sides of the case other than the leadframe.

摘要翻译： 基于半导体芯片和壳体之间的树脂的热阻，散热片的热阻和半导体封装中的三个热辐射路径的热阻计算出具有半导体芯片和散热片的整个半导体封装的热阻。 所述三个热辐射路径中的一个穿过壳体的底表面。 所述三个辐射路径中的另一个穿过引线框架。 三个辐射路径中的另一个穿过壳体的引导框架以外的两侧。

公开(公告)号：US08081460B2

公开(公告)日：2011-12-20

申请号：US12087879

申请日：2007-01-23

申请人： Tomotaka Ishida ,  Mitsuru Yamamoto ,  Sakae Kitajo ,  Kazuhiro Kumakura

发明人： Tomotaka Ishida ,  Mitsuru Yamamoto ,  Sakae Kitajo ,  Kazuhiro Kumakura

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  G06F1/20 ,  G06F2200/201 ,  H01L2924/0002 ,  H05K7/20272 ,  H01L2924/00

摘要： A liquid-cooled heat radiator 1 includes a heat radiation base 2 having a cooling-liquid channel 5, and an expansion tank 7 provided on the heat radiation base 2. The expansion tank 7 has a tank body 26 having an expanded portion 27, which expands upward and opens downward, and a bottom plate 28 joined to the lower end of the tank body 26 to thereby close a bottom opening of the expanded portion 27. A through-hole 29 is formed in the top wall of the expanded portion 27 of the tank body 26 and serves as a communication section for establishing communication between the interior and the exterior of the cooling-liquid channel 5. A hydrogen-permeable member 31 is fixedly fitted into the through-hole 29 so as to stop the through-hole 29. The hydrogen-permeable member 31 satisfies the relation B≧50 A, where A and B are water-vapor permeability and hydrogen permeability, respectively, of the hydrogen-permeable member 31. The hydrogen-permeable member 31 is formed from a single material selected from the group consisting of ethylene-propylene rubber, butyl rubber, fluorine-containing rubber, nitrile-butadiene rubber, and silicone rubber. The liquid-cooled heat radiator 1 can be free from an increase in pressure in the cooling-liquid channel 5.

摘要翻译： 液冷散热器1包括具有冷却液通道5的散热基座2和设置在散热基座2上的膨胀箱7.膨胀箱7具有一个具有膨胀部分27的罐体26， 向下方膨胀，向下方开口的底板28与罐体26的下端接合，从而封闭膨胀部27的底部开口。在扩孔部27的顶壁形成有通孔29， 罐本体26构成用于建立冷却液通道5的内部和外部之间的连通的连通部。通气部件31固定地配合在通孔29中，以便停止通孔 氢渗透性构件31满足B≥A≥AA的关系，其中A和B分别是透水性构件31的水蒸气渗透性和透氢性。透氢性构件31由单一的 材料sele 由乙烯 - 丙烯橡胶，丁基橡胶，含氟橡胶，丁腈橡胶和硅橡胶组成的组中。 液冷散热器1可以没有冷却液通道5中的压力增加。

公开(公告)号：US20100074775A1

公开(公告)日：2010-03-25

申请号：US12448694

申请日：2008-01-15

申请人： Mitsuru Yamamoto ,  Kazuhito Murata ,  Sakae Kitajo

发明人： Mitsuru Yamamoto ,  Kazuhito Murata ,  Sakae Kitajo

IPC分类号： F04B43/04 ,  F04B43/02

CPC分类号： F04B43/046 ,  F04B43/028 ,  F04B43/04

摘要： A pump chamber (15) is formed between a piezoelectric vibrator (7) and a valve main plate (10). The valve main plate (10) includes an inlet port (13) at its central portion, and an outlet port (14) in its peripheral portion, and the inlet port (13) is made in a smaller diameter than the outlet port (14). On the valve main plate (10) an inflow check valve (11) and an outflow check valve (12) are provided, so that when the inflow check valve (11) and the outflow check valve (12) open and close in response to the vibration of the piezoelectric vibrator (7), a fluid is introduced into and discharged from the pump chamber (15).

摘要翻译： 在压电振子（7）和阀主板（10）之间形成泵室（15）。 阀主板（10）在其中心部分包​​括入口（13）和其周边部分的出口（14），并且入口（13）制成的直径小于出口（14）的直径 ）。 在阀主板（10）上设置有流入止回阀（11）和流出止回阀（12），当流入止回阀（11）和流出止回阀（12）响应于 压电振动器（7）的振动，将流体引入泵室（15）并从泵室（15）排出。