公开(公告)号：US20070006996A1

公开(公告)日：2007-01-11

申请号：US10562362

申请日：2004-06-25

申请人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Atsushi Ochi ,  Mitsuru Yamamoto

发明人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Atsushi Ochi ,  Mitsuru Yamamoto

IPC分类号： F28D15/00

CPC分类号： G06F1/203 ,  G06F2200/201

摘要： [Object] A cooling device for a thin electronic equipment having a larger heat radiation area and preventing leakage of refrigerant. [Means for Solving Problems] A cooling device includes first and second cooling panels (1, 2) wherein a passage (11, 21) is formed by bonding together a top heat radiation panel and a bottom heat radiation panel each having a groove therein, and a circulation pump (3) for circulating refrigerant within the passage (11, 21). In the top heat radiation panel of the second cooling panel (2) are formed an outlet port through which the refrigerant flows out from the passage (21) to the circulation pump (3) and an inlet port through which the refrigerant flows in from the circulation pump (3) to the passage (21). The circulation pump (3) is fixed onto the top heat radiation plate of the cooling panel (2) so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.

摘要翻译： 用于薄型电子设备的冷却装置具有较大的散热面积并防止制冷剂泄漏。 解决问题的手段冷却装置包括第一和第二冷却板（1,2），其中通过将顶部散热板和每个在其中具有凹槽的底部散热板粘合在一起而形成通道（11,21） 以及用于使制冷剂在通道（11,21）内循环的循环泵（3）。 在第二冷却板（2）的顶部散热板中形成有一个出口，制冷剂通过该出口从通道（21）流出到循环泵（3）和制冷剂从其中流入的入口 循环泵（3）到通道（21）。 循环泵（3）固定在冷却板（2）的顶部散热板上，使得吸入口和排出口分别与出口和入口对准。

公开(公告)号：US20060139882A1

公开(公告)日：2006-06-29

申请号：US10561980

申请日：2004-06-25

申请人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Atsushi Ochi ,  Mitsuru Yamamoto

发明人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Atsushi Ochi ,  Mitsuru Yamamoto

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A cooling device includes a cooling panel wherein a passage is formed by bonding together a bottom heat radiation plate having a groove formed therein and a top heat radiation plate, and a circulation pump circulating refrigerant within the passage. The top heat radiation plate is provided with an outlet port through which the refrigerant flows out from the passage to the circulation pump and an inlet port through which the refrigerant flows in from the circulation pump to the passage. The circulation pump is fixed onto the top heat radiation plate of the cooling panel so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.

摘要翻译： 冷却装置包括冷却板，其中通过将具有形成在其中的槽的底部散热板和顶部散热板结合在一起形成通道，以及在通道内循环制冷剂的循环泵。 顶部散热板设有出口，制冷剂通过该出口从通道流到循环泵，以及制冷剂从循环泵流入通道的入口。 循环泵被固定在冷却板的顶部散热板上，使得吸入口和排出口分别与出口和入口对准。

公开(公告)号：US07483261B2

公开(公告)日：2009-01-27

申请号：US10561980

申请日：2004-06-25

申请人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Atsushi Ochi ,  Mitsuru Yamamoto

发明人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Atsushi Ochi ,  Mitsuru Yamamoto

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A cooling device includes a cooling panel wherein a passage is formed by bonding together a bottom heat radiation plate having a groove formed therein and a top heat radiation plate, and a circulation pump circulating refrigerant within the passage. The top heat radiation plate is provided with an outlet port through which the refrigerant flows out from the passage to the circulation pump and an inlet port through which the refrigerant flows in from the circulation pump to the passage. The circulation pump is fixed onto the top heat radiation plate of the cooling panel so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.

摘要翻译： 冷却装置包括冷却板，其中通过将具有形成在其中的槽的底部散热板和顶部散热板结合在一起形成通道，以及在通道内循环制冷剂的循环泵。 顶部散热板设有出口，制冷剂通过该出口从通道流到循环泵，以及制冷剂从循环泵流入通道的入口。 循环泵被固定在冷却板的顶部散热板上，使得吸入口和排出口分别与出口和入口对准。

公开(公告)号：US07420807B2

公开(公告)日：2008-09-02

申请号：US10524770

申请日：2003-08-18

申请人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Mitsuru Yamamoto

发明人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Mitsuru Yamamoto

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.

摘要翻译： 本发明提供了一种易于构建并将其固定在电子设备上的散热装置，其热传导和散热优良，并且可以使装置的总体构型变薄。 液体冷却单元9和空气冷却单元12形成为一个单元。 液体冷却单元9的吸热表面19接触或结合到具有最大功率消耗的CPU和热发生器等发热组件，并且还在箱体2的小区域内局部地产生热量。 在液体冷却单元9中，布置有由电磁泵组成的液体冷却泵14，用于使冷却剂在流路10中循环。 由CPU 6，发热体7等发热部件产生的热量，通过使冷却液与液体冷却泵14循环，热传导到整个液体冷却单元9。

公开(公告)号：US20050231914A1

公开(公告)日：2005-10-20

申请号：US10524770

申请日：2003-08-18

申请人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Mitsuru Yamamoto

发明人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Mitsuru Yamamoto

IPC分类号： G06F1/20 ,  H01L23/467 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/473 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.

摘要翻译： 本发明提供了一种易于构建并将其固定在电子设备上的散热装置，其热传导和散热优良，并且可以使装置的总体构型变薄。 液体冷却单元9和空气冷却单元12形成为一个单元。 液体冷却单元9的吸热表面19接触或结合到功率消耗最大的诸如CPU和发热体的发热组件，并且还在箱2中的小区域内局部产生热量。 液体冷却单元9，由电磁泵构成的液体冷却泵14布置成使冷却剂在流路10中循环。由诸如CPU 6，发热体7等的发热组件产生的热量是热的 通过使液体冷却泵14循环冷却剂，将热传导到整个液体冷却单元9中。

公开(公告)号：US20070065308A1

公开(公告)日：2007-03-22

申请号：US10566580

申请日：2004-07-21

申请人： Mitsuru Yamamoto ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Sakae Kitajo

发明人： Mitsuru Yamamoto ,  Yasuhiro Sasaki ,  Atsushi Ochi ,  Sakae Kitajo

IPC分类号： F04B17/00

CPC分类号： F04B43/02 ,  F04B43/046

摘要： A diaphragm pump enabling an increase in pump efficiency by reducing the pressure loss of liquid and reduction in thickness. The flow passage in piezoelectric pump (1) includes a pressure chamber (50) formed into a flat shape in cross section and a suction side flow passage (70a) and discharge side flow passage (70b). The suction side flow passage (70a) and the discharge side flow passage (70b) are disposed at both ends of the pressure chamber (50) so that the axes thereof are aligned with each other. The check valves (20a, 20b) are respectively disposed on the suction side flow passage (70a) and the discharge side flow passage (70b), and are tilted relative to the flow direction of the liquid.

摘要翻译： 一种隔膜泵，通过减少液体的压力损失和减小厚度，可以提高泵的效率。 压电泵（1）中的流路包括形成为扁平形状的压力室（50）和吸入侧流路（70a）和排出侧流路（70b）。 吸入侧流路（70a）和排出侧流路（70b）设置在压力室（50）的两端，使其轴线彼此对准。 止回阀（20a，20b）分别设置在吸入侧流路（70a）和排出侧流路（70b）上，相对于液体的流动方向倾斜。

公开(公告)号：US06670699B2

公开(公告)日：2003-12-30

申请号：US10090459

申请日：2002-03-04

申请人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Yuzo Shimada

发明人： Kazuyuki Mikubo ,  Sakae Kitajo ,  Yuzo Shimada

IPC分类号： H01L2302

CPC分类号： H05K1/0272 ,  H01L23/433 ,  H01L23/473 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/0207 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/064 ,  H05K2201/09536 ,  H05K2201/10416 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package comprising an LSI chip, a chip bump, an interposer, and a BGA bump is mounted at a predetermined position of a printed wiring board having a core layer. A heat sink for dissipating heat generated from the LSI chip is installed within the core layer. Further, heat radiating vias for conveying heat generated from the LSI chip to the heat sink are provided within the printed wiring board so that the BGA bump in the LSI chip is thermally liked with the heat sink. The heat generated from the LSI chip is mainly dissipated through a route of chip bump→interposer→BGA bump→heat radiating via→heat sink. By virtue of the above construction, the semiconductor device packaging structure can reduce the packaging volume of the heat sink while providing satisfactory cooling capacity and, at the same time, can minimize the length of signal wiring between LSI chips.

公开(公告)号：US06611057B2

公开(公告)日：2003-08-26

申请号：US09986413

申请日：2001-11-08

申请人： Kazuyuki Mikubo ,  Sakae Kitajo

发明人： Kazuyuki Mikubo ,  Sakae Kitajo

IPC分类号： H01L2334

CPC分类号： H01L25/0657 ,  H01L23/36 ,  H01L25/0652 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/144 ,  H01L2224/0401

摘要： A semiconductor device includes two or more semiconductor modules which are stacked up into three-dimensional structure. Each semiconductor module includes a wiring board, one or more IC chips which are mounted on the wiring board, and one or more heat sinks which are attached to the IC chips via a thermal-conductive adhesive and are forcedly cooled by a coolant flowing through channels which are formed therein. The wiring board of each semiconductor module is provided with sockets having I/O pins and concavities. Electrical connection between adjacent semiconductor modules of the semiconductor device is established by inserting the I/O pins of the sockets of one semiconductor module into the concavities of the sockets of the other semiconductor module. The channels in the heat sink are implemented by a plurality of channel grooves which are generated between a plurality of fins which are formed in a cavity inside the heat sink at predetermined intervals. The coolant is supplied to the channel grooves from outside and the IC chips are forcedly cooled by the coolant. Therefore, enough cooling capacity is ensured by use of low-profile heat sinks, thereby both high processing speed (due to high packing density and short signal lines between IC chips) and sufficient cooling capacity are attained.

公开(公告)号：US06438504B1

公开(公告)日：2002-08-20

申请号：US09818636

申请日：2001-03-28

申请人： Kazuyuki Mikubo ,  Sakae Kitajo

发明人： Kazuyuki Mikubo ,  Sakae Kitajo

IPC分类号： G06N700

摘要： The thermal resistance of an entire semiconductor package with a semiconductor chip and radiation fins is calculated based on thermal resistance of resin between the semiconductor chip and case, thermal resistance of the radiation fins, and thermal resistance of three heat radiation paths in the semiconductor package. One of said three heat radiation paths is passing through the bottom surface of the case. The other of said three radiation paths is passing through the leadframe. The other of three radiation paths is passing through sides of the case other than the leadframe.

公开(公告)号：US20100025019A1

公开(公告)日：2010-02-04

申请号：US12518357

申请日：2007-12-03

申请人： Hitoshi Sakamoto ,  Kazuyuki Mikubo ,  Sakae Kitajo

发明人： Hitoshi Sakamoto ,  Kazuyuki Mikubo ,  Sakae Kitajo

IPC分类号： H01L23/34 ,  F28D15/00 ,  F28F13/00 ,  B21D53/02

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： Behavior of a vapor bubble that emerges should be controlled to improve operational stability and reliability of a phase shift heat exchanger having a microchannel. The heat exchanger has a dual layer structure and includes a material that is elastically deformed according to pressure difference between the layers. The layers are connected, and at the connection interface a resistance unit that exerts a predetermined resistance against a coolant flowing from the coolant supplying layer toward the microchannel layer is provided, to maintain internal pressure of the coolant supplying layer higher than that of the microchannel, under a normal operation. Once a vapor bubble emerges, the relationship in strength of the internal pressure is turned over, and the elastic material is lifted so that the vapor bubble is dividedly distributed over a plurality of microchannels. Alternatively, the internal pressure of the coolant supplying layer may be maintained lower than that of the microchannel, so that once a vapor bubble emerges the vapor bubble is drawn to the lower pressure side.

摘要翻译： 应该控制出现气泡的行为，以提高具有微通道的相移式热交换器的操作稳定性和可靠性。 热交换器具有双层结构，并且包括根据层之间的压力差弹性变形的材料。 这些层被连接，并且在连接接口处设置有电阻单元，其对从冷却剂供应层朝向微通道层流动的冷却剂施加预定电阻，以保持冷却剂供应层的内部压力高于微通道的内部压力， 正常运作。 一旦蒸汽气泡出现，内部压力的强度关系就会翻转，并且弹性材料被提升，使得气泡分散在多个微通道上。 或者，冷却剂供给层的内部压力可以保持低于微通道的内部压力，使得一旦蒸汽气泡出现，则蒸汽气泡被吸入低压侧。