摘要:
A pump chamber (15) is formed between a piezoelectric vibrator (7) and a valve main plate (10). The valve main plate (10) includes an inlet port (13) at its central portion, and an outlet port (14) in its peripheral portion, and the inlet port (13) is made in a smaller diameter than the outlet port (14). On the valve main plate (10) an inflow check valve (11) and an outflow check valve (12) are provided, so that when the inflow check valve (11) and the outflow check valve (12) open and close in response to the vibration of the piezoelectric vibrator (7), a fluid is introduced into and discharged from the pump chamber (15).
摘要:
A pump chamber (15) is formed between a piezoelectric vibrator (7) and a valve main plate (10). The valve main plate (10) includes an inlet port (13) at its central portion, and an outlet port (14) in its peripheral portion, and the inlet port (13) is made in a smaller diameter than the outlet port (14). On the valve main plate (10) an inflow check valve (11) and an outflow check valve (12) are provided, so that when the inflow check valve (11) and the outflow check valve (12) open and close in response to the vibration of the piezoelectric vibrator (7), a fluid is introduced into and discharged from the pump chamber (15).
摘要:
A liquid-cooled heat radiator 1 includes a heat radiation base 2 having a cooling-liquid channel 5, and an expansion tank 7 provided on the heat radiation base 2. The expansion tank 7 has a tank body 26 having an expanded portion 27, which expands upward and opens downward, and a bottom plate 28 joined to the lower end of the tank body 26 to thereby close a bottom opening of the expanded portion 27. A through-hole 29 is formed in the top wall of the expanded portion 27 of the tank body 26 and serves as a communication section for establishing communication between the interior and the exterior of the cooling-liquid channel 5. A hydrogen-permeable member 31 is fixedly fitted into the through-hole 29 so as to stop the through-hole 29. The hydrogen-permeable member 31 satisfies the relation B≧50 A, where A and B are water-vapor permeability and hydrogen permeability, respectively, of the hydrogen-permeable member 31. The hydrogen-permeable member 31 is formed from a single material selected from the group consisting of ethylene-propylene rubber, butyl rubber, fluorine-containing rubber, nitrile-butadiene rubber, and silicone rubber. The liquid-cooled heat radiator 1 can be free from an increase in pressure in the cooling-liquid channel 5.
摘要:
A piezoelectric element of the piezoelectric pump is driven by the output signal of an amplifier that takes as input a signal that is generated by a sine wave oscillator of the same frequency that drives the piezoelectric element. The amplifier is driven by a high voltage obtained by conversion from a low-voltage power supply by a voltage-boosting converter, whereby the piezoelectric element is driven by a low-frequency sine wave of high voltage. The frequency of the sine wave oscillation is further adjusted by a signal from a first control circuit at the time of activation. In addition, the amplitude of the sine wave oscillation is adjusted by the output signal of a second control circuit that takes as input a signal from temperature sensor for sensing the temperature of the heat-generating body.
摘要:
A cooling device includes a cooling panel wherein a passage is formed by bonding together a bottom heat radiation plate having a groove formed therein and a top heat radiation plate, and a circulation pump circulating refrigerant within the passage. The top heat radiation plate is provided with an outlet port through which the refrigerant flows out from the passage to the circulation pump and an inlet port through which the refrigerant flows in from the circulation pump to the passage. The circulation pump is fixed onto the top heat radiation plate of the cooling panel so that the suction port and discharge port are aligned with the outlet port and inlet port, respectively.
摘要:
The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.
摘要:
A diaphragm pump enabling an increase in pump efficiency by reducing the pressure loss of liquid and reduction in thickness. The flow passage in piezoelectric pump (1) includes a pressure chamber (50) formed into a flat shape in cross section and a suction side flow passage (70a) and discharge side flow passage (70b). The suction side flow passage (70a) and the discharge side flow passage (70b) are disposed at both ends of the pressure chamber (50) so that the axes thereof are aligned with each other. The check valves (20a, 20b) are respectively disposed on the suction side flow passage (70a) and the discharge side flow passage (70b), and are tilted relative to the flow direction of the liquid.
摘要:
The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.
摘要:
A liquid-cooled heat radiator 1 includes a heat radiation base 2 having a cooling-liquid channel 5, and an expansion tank 7 provided on the heat radiation base 2. The expansion tank 7 has a tank body 26 having an expanded portion 27, which expands upward and opens downward, and a bottom plate 28 joined to the lower end of the tank body 26 to thereby close a bottom opening of the expanded portion 27. A through-hole 29 is formed in the top wall of the expanded portion 27 of the tank body 26 and serves as a communication section for establishing communication between the interior and the exterior of the cooling-liquid channel 5. A hydrogen-permeable member 31 is fixedly fitted into the through-hole 29 so as to stop the through-hole 29. The hydrogen-permeable member 31 satisfies the relation B≧50 A, where A and B are water-vapor permeability and hydrogen permeability, respectively, of the hydrogen-permeable member 31. The hydrogen-permeable member 31 is formed from a single material selected from the group consisting of ethylene-propylene rubber, butyl rubber, fluorine-containing rubber, nitrile-butadiene rubber, and silicone rubber. The liquid-cooled heat radiator 1 can be free from an increase in pressure in the cooling-liquid channel 5.
摘要:
A liquid storage tank 4 of an electronic device cooling apparatus that diffuses heat generated from a heat generating component by circulation of a cooling medium to carry out cooling has cooling means, an upper cover 6a, and a lower cover 6b. An upper space 7a formed by the cooling means and the upper cover 6a is spatially connected to a flow path 2 through a branch hole 8. Further, the upper space 7a is spatially connected to a lower space 7b formed by the lower cover 6b and the cooling means through a bypass 9.