摘要:
Tape heating means is allowed to come close to an adhesive tape for support and, in a heating state, the adhesive tape for support is stretched and tensioned with proper tension in a tape width direction and a transport direction. A heated work is bonded to an adhesive face of the tensioned adhesive tape for support, thereby supporting the work.
摘要:
Conventionally, no consideration was given to the control of the main power supply circuit in a storage apparatus. Thus, unnecessary electric power will be consumed because it is not possible to inhibit the power consumption of the main power supply circuit of the storage apparatus. With this storage system having a plurality of storage apparatuses, a storage apparatus internally has a power supply control program for controlling the respective components and the main power supply circuit, and the power supply control command program provided to the management computer migrates a storage extent to be used for business to another storage apparatus based on the operation schedule of business to use the storage extent of the storage apparatus, and commands the power supply control of the main power supply circuit in the storage apparatuses and the respective components.
摘要:
Provided is an improved method of joining a protective tape having one object to suppress generation of bending of a semiconductor wafer after a back-grinding process. The protective tape is supplied toward the semiconductor wafer suction-held on a chuck table, and an intermediate sheet is supplied along an upper side of the protective tape. Then, the intermediate sheet is interposed between a joining member and the protective tape along a surface of a base material in the protective tape so as to be movable. Under this state, the joining member and the semiconductor wafer move relative to each other in a horizontal direction, whereby the protective tape is joined to a surface of the semiconductor wafer.
摘要:
Provided is an environment that storage device configuration management can be efficiently done in a data center having a virtualization device. A SAN manager acquires configuration information from a device constituting a SAN and prepares a correspondence relationship between a host computer and a virtual volume in the SAN, and a corresponding relationship between the host computer and a real volume, depending upon the acquired information. Based on the corresponding relationship, the SAN manager outputs a correspondence relationship of between virtual and real volumes. Meanwhile, by interpreting a failure-notification message received from the devices of the SAN, detected and outputted is an influence upon an access to a real or virtual volume as to the failure. Furthermore, when a plurality of failure notifications are received from the devices connected to the SAN, a plurality of failure notifications are associatively outputted depending upon a correspondence relationship between real and virtual volumes.
摘要:
A pool that is a storage area group composed of a plurality of real pages based on a plurality of RAID groups is managed. The storage system carries out the rebuild processing that includes the steps of copying each of data that has been stored into all allocated real pages among all real pages based on a specific RAID group to an unallocated real page based on at least one RAID group separate from the specific RAID group, allocating a real page of each copy destination to each virtual page of an allocated destination of an allocated real page of each copy source, and canceling an allocation of an allocated real page of each copy source to a virtual page.
摘要:
An aligned workpiece is mounted on and held by a holding table, and a support board separating mechanism separates a support board from a semiconductor wafer. Herein, a double-faced adhesive tape is left on one of the support board and the semiconductor wafer. Either the support board or the semiconductor wafer on which the double-faced adhesive tape is left is transported to an adhesive tape peeling mechanism while being held by the holding table, and the double-faced adhesive tape is peeled off and removed from the surface of thereof. The separated semiconductor wafer and support board are collected independently.
摘要:
A SAN manager acquires configuration information from devices constituting a SAN and produces a corresponding relationship between a host computer and a virtual volume (virtual volume mapping) and a corresponding relationship between the host computer and a real volume (real volume mapping). Based on those pieces of mapping information, the SAN manager outputs a corresponding relationship between virtual and real volumes. Meanwhile, the failure notification messages received from the in-SAN devices are construed to detect and output an influence of the failure upon the access to a real or virtual volume. Furthermore, when receiving a plurality of failure notifications from the devices connected to the SAN, the plurality of failure notifications are outputted with an association based on the corresponding relationship between real and virtual volumes.
摘要:
A disk array includes a drive management unit, which is a program for identifying kinds of disk devices and managing different disk devices separately, and a drive management table for storing information to be utilized by the drive management unit. The disk array further includes a program for managing accumulated time of disk devices. The program includes a drive lifetime setting portion for setting lifetimes of drives, a drive start/stop portion for intentionally starting/stopping ATA disk devices, and an operation time measurement portion for measuring accumulated operation time. Since it is necessary to be conscious of difference in reliability and performance among disk devices when forming a RAID, a drive kind notification unit, which is a program for notifying of the kind of a disk device when forming the RAID, is provided.
摘要:
An adhesive tape joining apparatus of this invention adopts an inverted “T”-shaped layout configured with a rectangular section that extends laterally when being viewed in a plane and a protrusion section that is coupled on a center of the rectangular section. An adhesive tape joining part is disposed in the protrusion section and joins an adhesive tape to a ring frame and a wafer. A transport mechanism is disposed in the rectangular section and transports the wafer, the ring frame, and the wafer held by the ring frame. An electronic substrate processing unit is disposed in at least one of two regions adjoining to the rectangular section with the protrusion section being interposed therebetween, and is coupled to the transport mechanism.
摘要:
A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mechanism to operate so as to satisfy the determined results by the computing unit. Thereafter, the adhesive tape including the joint is cut and removed.