公开(公告)号：US11373940B2

公开(公告)日：2022-06-28

申请号：US17028843

申请日：2020-09-22

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@Eugene Lee ,  Anis Fauzi bin Abdul Aziz ,  Wei Fen Sueann Lim

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: A leadframe strip for use in making leaded integrated circuit packages includes a plurality of integrally connected leadframes that each have a die attach pad and first and second dam bars located adjacent to opposite first and second sides of the die attach pad, respectively. A plurality of continuous lead structures extend, uninterrupted by other structure, between opposing ones of the dam bars of horizontally adjacent leadframes. The plurality of integrally connected leadframes are arranged in a plurality of vertical columns, wherein die attach pads in one vertical column are vertically offset from die attach pads in adjacent vertical columns.

公开(公告)号：US09013028B2

公开(公告)日：2015-04-21

申请号：US13734402

申请日：2013-01-04

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@Eugene Lee ,  Sueann Lim Wei Fen ,  Sarel Bin Ismail

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L23/49541 ,  H01L21/4821 ,  H01L21/4842 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3157 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/5328 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/27312 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/83862 ,  H01L2224/85439 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/0665 ,  H01L2924/00

Abstract: An integrated circuit (“IC”) device and method of making it. The IC device may include a conductive lead frame that has a die pad with a relatively larger central body portion and at least one relatively smaller peripheral portion in electrical continuity with the central body portion. The peripheral portion(s) project laterally outwardly from the central body portion of the die pad. Lateral displacement of a portion(s) of an encapsulation layer overlying the peripheral portion(s) is resisted by abutting surfaces on the peripheral portion(s) and the encapsulation layer.

Abstract translation: 一种集成电路（“IC”）装置及其制造方法。 IC器件可以包括导电引线框架，该导电引线框具有具有相对较大的中心体部分的芯片焊盘和至少一个与中心主体部分电连续的相对较小的周边部分。 周边部分从模片垫的中心主体部分横向向外突出。 覆盖周边部分的封装层的一部分的侧向位移被外围部分和封装层上的邻接表面抵抗。

公开(公告)号：US20140242755A1

公开(公告)日：2014-08-28

申请号：US14267565

申请日：2014-05-01

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@Eugene Lee ,  Anis Fauzi bin Abdul Aziz ,  Susan Goh Geok Ling ,  Ng Swee Tiang

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/82

CPC classification number: H01L23/49575 ,  H01L21/56 ,  H01L21/565 ,  H01L21/82 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49551 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/80 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/08245 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/73251 ,  H01L2224/80904 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/92222 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/80 ,  H01L2224/16 ,  H01L2224/08 ,  H01L2924/00

Abstract: A method of making an integrated circuit module starts with a top leadframe strip comprising a plurality of integrally connected top leadframes. A plurality of flipchip dies are mounted on the top leadframe strip with solder bumps of each flipchip bonded to predetermined pad portions on each of the top leadframes. The top leadframe strip is attached to a bottom leadframe strip. The bottom leadframe strip has a plurality of integrally connected bottom leadframes each having a central die attach pad (DAP) portion and a peripheral frame portion. A back face of each flipchip die contacts the DAP portion of each bottom leadframe. Lead portions of each top leadframe are attached to the peripheral frame portion of each bottom leadframe. The top leadframe strip is attached to the bottom leadframe strip with a back face of each flipchip die contacting the DAP portion of each bottom leadframe and with lead portions of each top leadframe attached to the peripheral frame portion of each bottom leadframe.

Abstract translation: 制造集成电路模块的方法从包括多个整体连接的顶部引线框架的顶部引线框条开始。 多个倒装芯片模具安装在顶部引线框架条上，每个倒装芯片的焊料凸块接合到每个顶部引线框架上的预定焊盘部分。 顶部引线框条连接到底部引线框条。 底部引线框带具有多个整体连接的底部引线框架，每个底部引线框架具有中央管芯附接焊盘（DAP）部分和外围框架部分。 每个倒装芯片模具的背面接触每个底部引线框架的DAP部分。 每个顶部引线框架的引线部分附接到每个底部引线框架的外围框架部分。 顶部引线框条附接到底部引线框条，每个倒装芯片模具的背面接触每个底部引线框架的DAP部分，并且每个顶部引线框架的引线部分连接到每个底部引线框架的外围框架部分。

公开(公告)号：US20140191380A1

公开(公告)日：2014-07-10

申请号：US13734402

申请日：2013-01-04

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Lee Han Meng@Eugene Lee ,  Sueann Lim Wei Fen ,  Sarel Bin Ismail

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49541 ,  H01L21/4821 ,  H01L21/4842 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3157 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/5328 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/27312 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/83862 ,  H01L2224/85439 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/0665 ,  H01L2924/00

Abstract: An integrated circuit (“IC”) device and method of making it. The IC device may include a conductive lead frame that has a die pad with a relatively larger central body portion and at least one relatively smaller peripheral portion in electrical continuity with the central body portion. The peripheral portion(s) project laterally outwardly from the central body portion of the die pad. Lateral displacement of a portion(s) of an encapsulation layer overlying the peripheral portion(s) is resisted by abutting surfaces on the peripheral portion(s) and the encapsulation layer.

Abstract translation: 一种集成电路（“IC”）装置及其制造方法。 IC器件可以包括导电引线框架，该导电引线框具有具有相对较大的中心体部分的芯片焊盘和至少一个与中心主体部分电连续的相对较小的周边部分。 周边部分从模片垫的中心主体部分横向向外突出。 覆盖周边部分的封装层的一部分的侧向位移被外围部分和封装层上的邻接表面抵抗。