Abstract:
A method for fabricating non-volatile memory device is disclosed. The method includes the steps of: providing a substrate having a stack structure thereon; performing a first oxidation process to form a first oxide layer on the substrate and the stack structure; etching the first oxide layer for forming a first spacer adjacent to the stack structure; performing a second oxidation process to form a second oxide layer on the substrate; forming a dielectric layer on the first spacer and the second oxide layer; and etching the dielectric layer for forming a second spacer.
Abstract:
A non-volatile memory cell includes a substrate, an erase gate disposed on the substrate and having a top plane, two floating gates disposed respectively at both sides of the erase gate, two control gates disposed respectively on two floating gates, and two select gates disposed respectively at outer sides of the two floating gates, where the two select gates have tilted top planes which are symmetric to each other.