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公开(公告)号：US4408086A
公开(公告)日：1983-10-04
申请号：US212511
申请日：1980-12-03
申请人： Shunsuke Matsushima , Kazuhiko Hata , Kentaro Mashita , Shuichi Kanagawa , Shinji Nakao , Kiyoshi Nakai , Kunimasa Kamio
发明人： Shunsuke Matsushima , Kazuhiko Hata , Kentaro Mashita , Shuichi Kanagawa , Shinji Nakao , Kiyoshi Nakai , Kunimasa Kamio
CPC分类号： C07C37/14 , C08G64/14 , C07C2102/08
摘要： m-Isopropenylphenol oligomer which is useful for the production of synthetic resins such as epoxy resins is produced by polyermizing m-isopropenylphenol at a temperature of 135.degree. to 230.degree. C. using a catalytic amount of an acid catalyst in the presence or absence of a solvent, or freezing m-isopropenylphenol in the presence or absence of an acid catalyst.
摘要翻译： 可用于生产合成树脂如环氧树脂的间 - 异丙烯基苯酚低聚物是通过在135℃至230℃的温度下，使用催化量的酸催化剂在存在或不存在的情况下将m-异丙烯基苯酚 溶剂或冷冻的异丙烯基苯酚在酸催化剂存在或不存在下进行。
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公开(公告)号：US4337367A
公开(公告)日：1982-06-29
申请号：US106845
申请日：1979-12-26
申请人： Shuichi Kanagawa , Shinji Nakao , Kiyoshi Nakai , Kunimasa Kamio , Shunsuke Matsushima , Kazuhiko Hata , Kentaro Mashita
发明人： Shuichi Kanagawa , Shinji Nakao , Kiyoshi Nakai , Kunimasa Kamio , Shunsuke Matsushima , Kazuhiko Hata , Kentaro Mashita
CPC分类号： C08G59/063 , C08G59/3218
摘要： An oligomer of m-isopropenylphenol is produced by subjecting m-isopropenylphenol to thermal polymerization in the absence of a catalyst.
摘要翻译： 间 - 异丙烯基苯酚的低聚物是通过在不存在催化剂的情况下使间 - 异丙烯基苯酚进行热聚合而制备的。
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23.发明授权Thermosetting resin composition of an allylated novolak and a bis-maleimide 失效烯丙基酚醛清漆和双马来酰亚胺的热固性树脂组合物
公开(公告)号：US4632966A
公开(公告)日：1986-12-30
申请号：US793531
申请日：1985-10-10
IPC分类号： C08F290/14 , C08K5/3415 , C08L61/14 , C08G8/30 , C08G8/36
CPC分类号： C08K5/3415 , C08F290/14 , C08L61/14
摘要： A thermosetting resin composition comprising an N,N'-bismaleimide compound and an allylated phenol novolak resin having partially or wholly allyl-etherified phenolic hydroxyl groups and substantially no nucleous-substituted allyl group.
摘要翻译： 一种热固性树脂组合物，其包含N，N'-双马来酰亚胺化合物和具有部分或全部烯丙基醚化的酚羟基并且基本上不含核取代的烯丙基的烯丙基化酚醛清漆树脂。
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24.发明授权Thermosetting resin composition and a composite material comprising cured product and said resin composition and its matrix 失效热固性树脂组合物和包含固化产物和所述树脂组合物及其基质的复合材料
公开(公告)号：US5300592A
公开(公告)日：1994-04-05
申请号：US971263
申请日：1992-11-04
CPC分类号： C08G59/027 , C08G59/02 , C08G59/08 , C08G73/12 , C08L63/04 , C08L79/08 , C08L79/085
摘要： A resin composition comprising a polymeleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are epoxidized and allyl-etherified and, as an optional ingredient, a curing agent, or a resin composition comprising a polymaleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are allyl-etherified and an epoxy resin; and a heat resistant composite material comprising cured product of said resin composition as its matrix phase and containing a fiber as its reinforcing material.
摘要翻译： 一种树脂组合物，其包含在一个分子中具有两个或更多个马来酰亚胺基团的聚咪唑酰亚胺化合物，酚羟基被烯氧基化的苯酚酚醛清漆树脂和作为任选的成分的固化剂或包含聚马来酰亚胺 在一个分子中具有两个或更多个马来酰亚胺基团的化合物，酚羟基被烯丙基醚化的苯酚酚醛清漆树脂和环氧树脂; 以及耐热复合材料，其包含所述树脂组合物的固化产物作为其基质相并含有纤维作为其增强材料。
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25.发明授权Thermosetting resin composition composed of a polymaleimide compound, a phenolic novolac resin and an epoxy resin 失效由聚马来酰亚胺化合物，酚醛清漆树脂和环氧树脂组成的热固性树脂组合物
公开(公告)号：US5041507A
公开(公告)日：1991-08-20
申请号：US360589
申请日：1989-06-02
CPC分类号： C08G59/027 , C08G59/02 , C08G59/08 , C08G73/12 , C08L63/04 , C08L79/08 , C08L79/085
摘要： A resin composition comprising a polymeleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are epoxidized and allyl-etherified and, as an optional ingredient, a curing agent, or a resin composition comprising a polymaleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are allyl-etherified and an epoxy resin; and a heat resistant composite material comprising cured product of said resin composition as its matrix phase and containing a fiber as its reinforcing material.
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26.发明授权
公开(公告)号：US4931515A
公开(公告)日：1990-06-05
申请号：US281889
申请日：1988-12-08
IPC分类号： C08G59/00 , C08G59/08 , C08G59/18 , C08G59/32 , C08J5/24 , C08K5/02 , C08L63/00 , C08L63/04 , H01B3/40
CPC分类号： C08G59/08 , C08L63/04 , Y10T428/31511
摘要： An epoxy resin composition comprising a novolak type epoxy resin which is produced from a substituted-phenol novolak and epihalohydrin, and is 0.15 or less in a maximum absorbance of a 3% (W/V) dichloromethane solution of the epoxy resin, the absorbance being measured at a wave number of between 3570 and 3600 cm.sup.-1 with an infrared spectrophotometer having a cell of 2 mm length, which is useful particularly in encapsulating and laminating applications in electronic fields.
摘要翻译： 一种环氧树脂组合物，其包含由取代苯酚酚醛清漆和表卤代醇制备的酚醛清漆型环氧树脂，并且在环氧树脂的3％（W / V）二氯甲烷溶液的最大吸光度中为0.15以下，吸光度为 用具有2mm长度的电池的红外分光光度计在3570和3600cm -1之间的波数下测量，这特别适用于电子领域的封装和层压应用。
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27.发明授权Thermosetting resin composition comprising a partly allylated novolac epoxy resin and bismaleimide 失效包含部分烯丙基化酚醛环氧树脂和双马来酰亚胺的热固性树脂组合物
公开(公告)号：US4755569A
公开(公告)日：1988-07-05
申请号：US20740
申请日：1987-03-02
申请人： Shuichi Kanagawa , Shigeo Hozumi , Kunimasa Kamio
发明人： Shuichi Kanagawa , Shigeo Hozumi , Kunimasa Kamio
CPC分类号： C08G59/4042 , C08G73/12 , C08G8/36
摘要： A thermosetting resin composition comprising (A) a phenol novolac resin, some of the hydroxyl groups of which have been allyl-etherified and the other hydroxyl groups having added thereto a compound having one or more epoxy groups and (B) a polymaleimide compound having two or more maleimide groups in the molecule.
摘要翻译： 一种热固性树脂组合物，其包含（A）苯酚酚醛清漆树脂，其一些羟基已被烯丙基醚化，其它羟基加入具有一个或多个环氧基的化合物和（B）具有两个或多个环氧基的聚马来酰亚胺化合物 或更多的马来酰亚胺基团。
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公开(公告)号：US4529790A
公开(公告)日：1985-07-16
申请号：US636240
申请日：1984-07-31
CPC分类号： H05K1/0326 , C08G59/08 , C08G8/04 , C08L63/04 , H01B3/40 , H01L23/293 , H01L2924/0002
摘要： An epoxy resin composition comprising a polyglycidyl ether prepared by reacting a 3-methyl-6-alkylphenol in the presence or absence of a phenol other than the 3-methyl-6-alkylphenol with an aldehyde to obtain a novolak, and then reacting the novolak with an epihalohydrin, which composition is useful in electronic fields, for example, for encapsulating semiconductor products or for the production of printed circuit boards.
摘要翻译： 一种环氧树脂组合物，其包含通过使3-甲基-6-烷基苯酚在3-甲基-6-烷基酚以外的苯酚存在或不存在下使3-甲基-6-烷基酚与醛反应制备的聚缩水甘油醚，得到酚醛清漆，然后使酚醛清漆 具有表卤代醇，该组合物可用于电子领域，例如用于封装半导体产品或用于生产印刷电路板。
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公开(公告)号：US4410457A
公开(公告)日：1983-10-18
申请号：US375096
申请日：1982-05-05
申请人： Kenji Fujimura , Shigeru Sekiya , Kunimasa Kamio , Koichi Okuno , Satoru Haraguchi , Koiti Ohasi , Hiroyuki Yamaguchi
发明人： Kenji Fujimura , Shigeru Sekiya , Kunimasa Kamio , Koichi Okuno , Satoru Haraguchi , Koiti Ohasi , Hiroyuki Yamaguchi
IPC分类号： C08G59/00 , C08L33/00 , C08L33/02 , C08L63/00 , C09J11/04 , C09J163/00 , H01B1/22 , H01B1/24 , H01L23/482 , H05K1/09 , H01B1/06
CPC分类号： H01B1/22 , H01B1/24 , H01L23/4828 , H05K1/095 , H01L2924/0002
摘要： An electroconductive paste comprising(a) an electroconductive filler,(b) a reactive solvent, and(c) a hardener comprising(c-1) an epoxy resin,(c-2) a latent hardener, and(c-3) an epoxy compound-dialkylamine adduct,the percent by weight of (a), (b) and (c) being 95 to 50, 1 to 20 and 4 to 30, respectively, and the weight ratio of (c-1):(c-2):(c-3) being 100:0 to 30:0.1 to 40. The paste is useful for bonding electronic elements to metal lead frames and/or substrates.
摘要翻译： 1.一种导电浆料，其包含（a）导电填料，（b）反应性溶剂和（c）包含（c-1）环氧树脂，（c-2）潜在硬化剂和（c-3） 环氧化合物 - 二烷基胺加成物，（a），（b）和（c）的重量百分比分别为95〜50,1〜20和4〜30，（c-1）：（c -2）：（c-3）为100:0至30:0.1至40。该糊剂可用于将电子元件接合到金属引线框架和/或基板。
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公开(公告)号：US4211715A
公开(公告)日：1980-07-08
申请号：US909785
申请日：1978-05-26
申请人： Shuichi Kanagawa , Shinji Nakao , Kiyoshi Nakai , Kunimasa Kamio , Shunsuke Matsushima , Kazuhiko Hata , Kentaro Mashita
发明人： Shuichi Kanagawa , Shinji Nakao , Kiyoshi Nakai , Kunimasa Kamio , Shunsuke Matsushima , Kazuhiko Hata , Kentaro Mashita
IPC分类号： C08G59/00 , C08G59/06 , C08G59/32 , C07D303/28
CPC分类号： C08G59/063 , C08G59/3218
摘要： An epoxy resin of the formulae (I) and/or (II), ##STR1## wherein R and R' are each hydrogen atom or an alkyl group having 1 to 3 carbon atoms and n is a mean value satisfying the equation, 0
摘要翻译： 式（I）和/或（II）的环氧树脂，其中R和R'各自为氢原子或具有1至3个碳原子的烷基，n为 平均值满足方程式0
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