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    Chip-type electronic part storage casing and supply cassette using same
    21.
    发明授权
    Chip-type electronic part storage casing and supply cassette using same 失效
    芯片型电子部件储存壳体和使用其的供给盒

    公开(公告)号：US5752628A

    公开(公告)日：1998-05-19

    申请号：US532661

    申请日：1995-10-13

    申请人： Takeshi Nishiguchi ,  Kenji Kato ,  Takayuki Fujita ,  Shigetoshi Negishi ,  Kunio Tanaka ,  Takashi Nakanishi ,  Takatoshi Mitsushima ,  Manabu Morita

    发明人： Takeshi Nishiguchi ,  Kenji Kato ,  Takayuki Fujita ,  Shigetoshi Negishi ,  Kunio Tanaka ,  Takashi Nakanishi ,  Takatoshi Mitsushima ,  Manabu Morita

    IPC分类号： H05K13/00 ,  H05K13/02 ,  B67D5/06

    CPC分类号： H05K13/028 ,  H05K13/0084

    摘要： A chip-type electronic part storage casing includes a storage portion for storing chip-type electronic parts in a loose condition; an opening formed in a lower surface of the storage portion for discharging the electronic parts; a shutter for opening and closing the opening; and a scatter prevention member within the storage portion for preventing the electronic parts from being scattered in the storage portion. Additionally, a supply cassette includes a hopper provided at a lower portion thereof and having a storage portion for storing chip-type electronic parts charged therein through an opening in an upper surface thereof, a central portion of the storage portion being recessed to provide an inclined surface for gathering the electronic parts; an interrupting plate mounted within the storage portion in an inclined manner, a gap for allowing the passage of the electronic parts therethrough formed between one end of said interrupting plate and the inclined surface of the storage portion; a discharge pipe for discharging the electronic parts, the discharge pipe extending from the exterior of the hopper through a lower surface of the hopper to the storage portion, and being connected to the storage portion; a slide pipe slidably fitted on an outer periphery of the discharge pipe; and engagement ribs formed on the upper surface of the storage portion. A chip-type electronic part storage casing is further connected to an upper portion of the hopper through the engagement ribs.

    摘要翻译： PCT No.PCT / JP95 / 00201 Sec。 371 1995年10月13日第 102（e）日期1995年10月13日PCT 1995年2月14日提交PCT公布。 出版物WO95 / 22242 日期：1995年8月17日芯片型电子部件存储壳体包括用于在松散状态下存储芯片型电子部件的存储部分; 在所述收纳部的下表面形成的开口，用于排出所述电子部件; 用于打开和关闭开口的快门; 以及在所述存储部分内的用于防止所述电子部件在所述存储部分中散射的散射防止部件。 此外，供给盒包括设置在其下部的料斗，并且具有用于储存通过其上表面中的开口装入其中的芯片型电子部件的存储部分，存储部分的中心部分被凹入以提供倾斜 用于收集电子部件的表面; 以倾斜的方式安装在存储部分内的中断板，用于允许电子部件通过的间隙，形成在所述中断板的一端和存储部分的倾斜表面之间; 用于排出电子部件的排出管，排出管从料斗的外部通过料斗的下表面延伸到储存部分，并连接到储存部分; 可滑动地安装在排出管的外周上的滑动管; 以及形成在存储部分的上表面上的接合肋。 芯片型电子部件存放壳体还通过接合肋连接到料斗的上部。

    Structure of chip component feeder
    22.
    发明授权
    Structure of chip component feeder 失效
    芯片组件馈线结构

    公开(公告)号：US5730317A

    公开(公告)日：1998-03-24

    申请号：US490709

    申请日：1995-06-15

    申请人： Takatoshi Mitsushima ,  Kunio Tanaka ,  Tomitatsu Soga ,  Takashi Nakanishi ,  Takashi Matsushima ,  Manabu Morita

    发明人： Takatoshi Mitsushima ,  Kunio Tanaka ,  Tomitatsu Soga ,  Takashi Nakanishi ,  Takashi Matsushima ,  Manabu Morita

    IPC分类号： B23P19/00 ,  B65G11/20 ,  H05K13/02 ,  B65G59/00

    CPC分类号： H05K13/021

    摘要： A chip component feeder is provided which includes a chip component storage box, a pick-up slider, a first feeding unit, and a second feeding unit. The pick-up slider slides to enter an outlet of the chip component storage box for picking up chip components and leads them to a feeding path formed in the first feeding unit communicating with the second feeding unit. The feeding path of the first feeding unit has a rectangular cross section suitable for the chip components of rectangular shape as well as square or circular shape.

    摘要翻译： 提供一种芯片部件供给器，其包括芯片部件存储盒，拾取滑块，第一馈送单元和第二馈送单元。 拾取滑块滑动进入芯片部件存储箱的出口，用于拾取芯片部件并将其引导到与第二进给单元连通的第一进给单元中形成的进给路径。 第一馈送单元的馈送路径具有矩形横截面，适合于矩形形状以及正方形或圆形的芯片组件。

    Method of monitoring machining load using variable alarm threshold
    23.
    发明授权
    Method of monitoring machining load using variable alarm threshold 失效
    使用可变报警阈值监测加工负载的方法

    公开(公告)号：US5631851A

    公开(公告)日：1997-05-20

    申请号：US332402

    申请日：1994-10-31

    申请人： Kunio Tanaka ,  Yasushi Onishi ,  Koji Sato

    发明人： Kunio Tanaka ,  Yasushi Onishi ,  Koji Sato

    IPC分类号： B23Q17/09 ,  G05B19/18 ,  G05B19/4062 ,  G05B23/02 ,  G06F19/00

    CPC分类号： G05B19/4062 ,  G05B2219/34451 ,  G05B2219/34457 ,  G05B2219/37525 ,  G05B2219/50073 ,  G05B2219/50197

    摘要： A method of monitoring machining load on a numerically controlled machine tool in such a way that incorrect judgment due to variations in machining load which are caused according to the machining conditions is made less frequent. The method is started by performing plural trial cutting operations. A signal indicating the machining load during these trial cutting operations is sampled and thus, sampling data is obtained. Reference data about the machining load and its variance are calculated from the sampling data and loaded in a reference data table. A threshold value according to variations in the sampling data is established, using the value of the variance. A load monitor means compares the reference data with data about the machining load obtained from actual measurements whenever each interval of time elapses. A decision is made as to whether the difference exceeds the threshold value. In this way, the machining load is monitored.

    摘要翻译： 在数控机床上监视加工负荷的方法，使得由于根据加工条件引起的加工负载变化的不正确判断的频率较低。 通过进行多次试验切割操作来开始该方法。 在这些试验切割操作期间指示加工负载的信号被采样，因此获得采样数据。 根据采样数据计算关于加工负载及其变化的参考数据，并加载到参考数据表中。 使用方差的值建立​​根据采样数据的变化的阈值。 负载监控装置将每个时间间隔的参考数据与实际测量值获得的加工负载数据进行比较。 决定差值是否超过阈值。 以这种方式，监视加工负载。

    Laser sputtering apparatus
    24.
    发明授权
    Laser sputtering apparatus 失效
    激光溅射装置

    公开(公告)号：US5017277A

    公开(公告)日：1991-05-21

    申请号：US376087

    申请日：1989-07-06

    申请人： Yoshikazu Yoshida ,  Kunio Tanaka ,  Yukio Nishikawa ,  Yusuke Takada

    发明人： Yoshikazu Yoshida ,  Kunio Tanaka ,  Yukio Nishikawa ,  Yusuke Takada

    IPC分类号： C23C14/28

    CPC分类号： C23C14/28

    摘要： A laser sputtering apparatus has a vacuum chamber, a target holder installed in the vacuum chamber, arranged to oppose the target in the vacuum chamber, a substrate mounted on the substrate support, and a laser beam source which emits laser beams onto the target through a window provided in the vacuum chamber wall, providing a laser sputtering apparatus that supplies dielectric thin films with a high permittivity and a high withstanding voltage.

    摘要翻译： 激光溅射装置具有真空室，设置在真空室中的目标保持器，与真空室中的目标物相对，安装在基板支撑体上的基板和激光束源，该激光束源通过 提供真空室壁中的窗口，提供了提供具有高介电常数和高耐压的电介质薄膜的激光溅射装置。

    High speed programmable controller for executing an instruction formed by a ladder
    25.
    发明授权
    High speed programmable controller for executing an instruction formed by a ladder 失效
    高速可编程控制器，用于执行梯形图形成的指令

    公开(公告)号：US4982358A

    公开(公告)日：1991-01-01

    申请号：US274150

    申请日：1988-11-09

    申请人： Kunio Tanaka ,  Nobuyuki Kiya ,  Kimio Maeda ,  Yoshiharu Saiki

    发明人： Kunio Tanaka ,  Nobuyuki Kiya ,  Kimio Maeda ,  Yoshiharu Saiki

    IPC分类号： G05B19/05 ,  G05B19/414

    CPC分类号： G05B19/4147 ,  G05B19/05

    摘要： A programmable controller according to the present invention has memory means (P) for registering any functional instruction. On the basis of a functional instruction stored in the memory means, an individual functional instruction (Func) is repeatedly output to a machine tool. When the format of a functional instruction changes due to a difference in input conditions, input condition (B, C) data are created as a ladder and, by executing a single fixed input condition (A), the lead address of an area storing the parameter of the individual functional instruction is called and output, whereby a functional instruction of a unified format is executed.

    摘要翻译： PCT No.PCT / JP88 / 00419 Sec。 371日期：1988年11月9日 102（e）日期1988年11月9日PCT提交1988年4月27日PCT公布。 第WO88 / 08558号公报 日本11月3日，根据本发明的可编程控制器具有用于登记任何功能指令的存储装置（P）。 基于存储在存储装置中的功能指令，将单独的功能指令（Func）重复地输出到机床。 当功能指令的格式由于输入条件的差异而改变时，输入条件（B，C）数据被创建为梯形图，并且通过执行单个固定输入条件（A），存储 调用和输出各个功能指令的参数，由此执行统一格式的功能指令。

    Numerical control data creation method
    27.
    发明授权
    Numerical control data creation method 失效
    数控数据创建方法

    公开(公告)号：US4835700A

    公开(公告)日：1989-05-30

    申请号：US76210

    申请日：1987-06-30

    申请人： Kunio Tanaka ,  Yasushi Onishi

    发明人： Kunio Tanaka ,  Yasushi Onishi

    IPC分类号： G05B19/4093

    CPC分类号： G05B19/40937 ,  G05B2219/36296 ,  G05B2219/36298 ,  Y02P90/265

    摘要： A machining process sequence defined by machining definition steps is displayed on a display screen in the form of a flowchart (FLC). In subsequently performed processing for automatically deciding a machining process sequence, the machining process sequence is revised in such a manner that machining processes (e.g. 01/01. 02/01, 03/01), the order of which must not be changed, are arranged in a serial machining sequence and machining processes (e.g. 02/01, 02/02, 02/03, 02/04, 02/05), the order of which may be changed, are arranged in parallel. NC data are created on the basis of the revised machining process sequence.

    Surface cutting method
    28.
    发明授权
    Surface cutting method 失效
    表面切割方法

    公开(公告)号：US4764878A

    公开(公告)日：1988-08-16

    申请号：US43350

    申请日：1987-03-17

    申请人： Kunio Tanaka ,  Yasushi Onishi

    发明人： Kunio Tanaka ,  Yasushi Onishi

    IPC分类号： B23Q15/00 ,  G05B19/4093 ,  G05B19/41 ,  G05B19/00

    CPC分类号： G05B19/41 ,  G05B2219/49381

    摘要： The invention relates to a surface cutting method for back-and-forth surface cutting of the interior of an area (AR) bounded by a closed curve.The surface cutting method includes repeating the following steps:a step of obtaining points of intersection P.sub.i, Q.sub.i between an i-th cutting path (PT.sub.i) and an offset curve offset (OFC') by (T+C+R) to the outer side of the closed curve, as well as points of intersection P.sub.i+1, Q.sub.i+1 between the offset curve and an (i+1)th cutting path (PT.sub.i+1), where T, C and R represent excess thickness, amount of clearance and tool radius, respectively;a step of obtaining a coordinate value, in the cutting path direction, of an outermost point R.sub.i on the offset curve (OFC') between the points of intersection Q.sub.i, Q.sub.i+1, where Q.sub.i is a point of intersection on a cutting end point side of the i-th cutting path (PT.sub.i) and Q.sub.i+1 is a point of intersection on a cutting starting point side of the (i+1)th cutting path (PT.sub.i+1);a step of performing surface cutting by moving a tool along the i-th cutting path until a coordinate value of the position of the tool in the cutting path direction coincides with the coordinate value of the point R.sub.i in the cutting path direction; anda step of moving the tool at a cutting velocity to the next (i+1)th cutting path (PT.sub.i+1) in a shift direction.

    摘要翻译： PCT No.PCT / JP86 / 00380 Sec。 371日期1987年3月17日 102（e）1987年3月17日PCT PCT 1986年7月21日PCT公布。 出版物WO87 / 日本1987年1月29日。本发明涉及一种用闭合曲线界定的区域（AR）的内部进行前后面切割的表面切割方法。 表面切割方法包括重复以下步骤：将第i个切割路径（PTi）和偏移曲线偏移（OFC'）之间的交点Pi，Qi与（T + C + R）之间的点相对于外部 闭合曲线侧，以及偏移曲线与第（i + 1）切割路径（PTi + 1）之间的交点Pi + 1，Qi + 1，其中T，C和R表示多余的厚度， 的间隙和刀具半径; 获得交点Qi，Qi + 1之间的偏移曲线（OFC'）上的最外点Ri的坐标值在切割路径方向上​​的坐标值的步骤，其中Qi是切割终点上的交点 第i切割路径（PTi）的侧面和第一+ 1是第（i + 1）切割路径（PTi + 1）的切割起点侧的交点; 通过沿着第i切割路径移动刀具直到刀具在切割路径方向上​​的位置的坐标值与切割路径方向上​​的点Ri的坐标值一致来进行表面切割的步骤; 以及将刀具以切割速度移动到在移动方向上的下一（i + 1）切割路径（PTi + 1）的步骤。

    Surface cutting method
    29.
    发明授权
    Surface cutting method 失效
    表面切割方法

    公开(公告)号：US4764877A

    公开(公告)日：1988-08-16

    申请号：US43349

    申请日：1987-03-17

    申请人： Kunio Tanaka ,  Yasushi Onishi

    发明人： Kunio Tanaka ,  Yasushi Onishi

    IPC分类号： B23Q15/00 ,  C07C259/06 ,  G05B19/4093 ,  G05B19/41 ,  G05B19/00

    CPC分类号： G05B19/41 ,  G05B2219/49381 ,  G05B2219/49392

    摘要： The present invention relates to a surface cutting method for cutting a surface within an area (AR) bounded by a predetermined closed curve (CCL) by moving a tool (TL) along a cutting path (PT.sub.i) in a predetermined direction (direction of arrow A) to cut the surface within the area, thenceforth moving the tool along an adjacent cutting path (PT.sub.i+1), obtained by a shift of a predetermined amount, to cut the surface, and repeating these surface cutting operations.The surface cutting method includes obtaining an offset curve (OFC) offset by a predetermined amount to the outer side of the closed curve (CCL), obtaining width W, in the shift direction (direction of arrow B), of the area bounded by the offset curve (OFC), finding, from among lengths of line segments obtained by dividing the width W into n equal parts, a length closest to a predetermined maximum cut-in amount without exceeding the same, adopting this length as an actual cut-in amount P, and performing surface cutting by shifting the tool (TL) by the cut-in amount P in the shift direction after the end of surface cutting along the cutting path PT.sub.i, and thereafter moving the tool along the adjacent cutting path PT.sub.i+1. A cutting starting point (P.sub.i) and cutting end point (Q.sub.i) of each cutting path are provided on an offset curve (OFC') offset by a predetermined amount to the outer side of the closed curve (CCL) specifying the area.

    摘要翻译： PCT No.PCT / JP86 / 00381 Sec。 371日期1987年3月17日 102（e）1987年3月17日PCT PCT 1986年7月21日PCT公布。 公开号WO87 / 00475 日本1987年1月29日。本发明涉及一种用于通过沿着切割路径（PTi）移动工具（TL）来切割由预定闭合曲线（CCL）界定的区域（AR）内的表面的表面切割方法 沿着预定方向（箭头A的方向）切割该区域内的表面，然后沿着通过预定量的偏移获得的相邻切割路径（PTi + 1）移动工具，以切割表面，并重复这些表面 切割作业。 表面切割方法包括获得偏移到闭合曲线（CCL）的外侧预定量的偏移曲线（OFC），获得沿着移动方向（箭头B的方向）的宽度W 偏移曲线（OFC），从宽度W分为n个相等部分获得的线段长度中，找出最接近预定最大切入量的长度，而不超过相同的长度，采用该长度作为实际切入 量P，并且通过沿着切割路径PTi在表面切割结束之后沿着移动方向移动刀具（TL）进行表面切割，然后沿着相邻切割路径PTi + 1移动刀具 。 每个切割路径的切割起始点（Pi）和切割终点（Qi）被设置在偏移预定量的偏移曲线（OFC'）上，以与指定该区域的闭合曲线（CCL）的外侧相对。