Low temperature oxidizing method of making a layered superlattice material
    21.
    发明授权
    Low temperature oxidizing method of making a layered superlattice material 有权
    制作层状超晶格材料的低温氧化法

    公开(公告)号:US06582972B1

    公开(公告)日:2003-06-24

    申请号:US09544697

    申请日:2000-04-07

    IPC分类号: H01G2100

    摘要: A thin film of precursor for forming a layered superlattice material is applied to an integrated circuit substrate, then a strong oxidizing agent is applied at low temperature in a range of from 100° C. to 300° C. to the precursor thin film, thereby forming a metal oxide thin film. The strong oxidizing agent may be liquid or gaseous. An example of a liquid strong oxidizing agent is hydrogen peroxide. An example of a gaseous strong oxidizing agent is ozone. The metal oxide thin film is crystallized by annealing at elevated temperature in a range of from 500° C. to 700° C., preferably not exceeding 650° C., for a time period in a range of from 30 minutes to two hours. Annealing is conducted in an oxygen-containing atmosphere, preferably including water vapor. Treatment by ultraviolet (UV) radiation may precede annealing. RTP in a range of from 500° C. to 700° C. may precede annealing.

    摘要翻译: 将用于形成层状超晶格材料的前体薄膜施加到集成电路基板上,然后在100℃至300℃的低温下向前体薄膜施加强氧化剂,由此 形成金属氧化物薄膜。 强氧化剂可以是液体或气体。 液体强氧化剂的实例是过氧化氢。 气态强氧化剂的实例是臭氧。 金属氧化物薄膜通过在500℃至700℃,优选不超过650℃的范围内的升高温度退火30分钟至2小时的时间段而结晶。 退火在含氧气氛中进行,优选包括水蒸气。 紫外线(UV)辐射处理可能退火之前。 可以在退火之前从500℃到700℃的范围内的RTP。