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    Lamp having improved insulation of the circuit unit
    2.
    发明授权
    Lamp having improved insulation of the circuit unit 有权
    灯具具有改善电路单元的绝缘

    公开(公告)号：US08981636B2

    公开(公告)日：2015-03-17

    申请号：US14234187

    申请日：2012-02-03

    申请人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Yoshinori Kakuno ,  Masahiro Miki ,  Hideo Nagai ,  Takaari Uemoto

    发明人： Tsugihiro Matsuda ,  Nobuyoshi Takeuchi ,  Yoshinori Kakuno ,  Masahiro Miki ,  Hideo Nagai ,  Takaari Uemoto

    IPC分类号： F21K99/00 ,  F21V23/00

    CPC分类号： F21K9/1355 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21K9/90 ,  F21V19/003 ,  F21V23/006 ,  F21V29/15 ,  F21V29/507 ,  F21Y2115/10

    摘要： In a lamp: an LED module and a circuit unit for lighting are housed within an envelope composed of a globe and a case; the LED module is attached to an end of an extension member that extends from a mount, which closes an opening at one end of the case, into the globe; the circuit unit is mounted inside the case; an insulation member disposed inside the case ensures insulation between the mount, which is made of metal, and the circuit unit; the insulation member has a bottomed cylinder portion inserted into the mount, and a protrusion portion formed on an outer circumference of the based cylinder portion that protrudes toward an inner surface of the mount; and the insulation member is attached to the mount by the protrusion portion pressing against the inner surface of the mount.

    摘要翻译： 在灯中：用于照明的LED模块和电路单元容纳在由球体和壳体组成的信封内; LED模块附接到延伸构件的端部，该延伸构件从将壳体的一端封闭开口的安装件延伸到球体中; 电路单元安装在壳体内; 设置在壳体内的绝缘构件确保由金属制成的安装座与电路单元之间的绝缘; 所述绝缘构件具有插入所述安装件中的有底圆筒部，以及形成在所述基座筒部的外周上朝向所述安装件的内表面突出的突出部; 并且所述绝缘构件通过所述突出部分抵靠所述安装件的内表面附接到所述安装件。

    ILLUMINATING LIGHT SOURCE AND ILLUMINATING DEVICE
    3.
    发明申请
    ILLUMINATING LIGHT SOURCE AND ILLUMINATING DEVICE 审中-公开
    照明光源和照明装置

    公开(公告)号：US20130229794A1

    公开(公告)日：2013-09-05

    申请号：US13884699

    申请日：2011-12-16

    申请人： Masahiro Miki ,  Hideo Nagai ,  Takaari Uemoto ,  Mitsuko Shuto ,  Makoto Inoue

    发明人： Masahiro Miki ,  Hideo Nagai ,  Takaari Uemoto ,  Mitsuko Shuto ,  Makoto Inoue

    IPC分类号： F21V15/01

    CPC分类号： F21V15/01 ,  F21K9/232 ,  F21K9/27 ,  F21K9/66 ,  F21S8/026 ,  F21S8/031 ,  F21V3/00 ,  F21V15/00 ,  F21Y2115/10

    摘要： Provided is a light source including a light-emitting element, an outer shell that houses therein the light-emitting element, and a base that is provided at the outer shell and receives power from the outside to cause the light-emitting element to emit light. The outer shell is electrically-insulative and light-transmissive. On at least part of the outer surface or the inner surface of the outer shell, an electrically-conductive member is provided. The electrically-conductive member is electrically connected to a grounding terminal of the lighting fixture. According to this structure, an electric charge stored on the outer surface can be discharged to the outside from the lighting fixture. This prevents the attachment of dust to the outer shell, and keeps the luminous flux close to the initial level for a long time period and reduces the amount of maintenance.

    摘要翻译： 本发明提供一种光源，其包括发光元件，容纳发光元件的外壳，以及设置在外壳上并从外部供电以使发光元件发光的基座 。 外壳是电绝缘和透光的。 在外壳的外表面或内表面的至少一部分上，设置有导电构件。 导电构件电连接到照明器具的接地端子。 根据该结构，存储在外表面上的电荷可以从照明器材排出到外部。 这防止灰尘附着在外壳上，并且使光束长时间保持接近初始水平并减少维护量。

    LIGHT SOURCE DEVICE
    4.
    发明申请
    LIGHT SOURCE DEVICE 审中-公开
    光源设备

    公开(公告)号：US20130170206A1

    公开(公告)日：2013-07-04

    申请号：US13822145

    申请日：2011-09-09

    申请人： Toshiaki Isogai ,  Yasuhisa Ueda ,  Kazushige Sugita ,  Hideo Nagai ,  Takaari Uemoto ,  Masahiro Miki

    发明人： Toshiaki Isogai ,  Yasuhisa Ueda ,  Kazushige Sugita ,  Hideo Nagai ,  Takaari Uemoto ,  Masahiro Miki

    IPC分类号： F21V13/04 ,  F21V7/04

    CPC分类号： F21V13/04 ,  F21K9/232 ,  F21K9/238 ,  F21K9/27 ,  F21K9/60 ,  F21K9/64 ,  F21K9/69 ,  F21V3/00 ,  F21V5/041 ,  F21V7/0033 ,  F21V7/04 ,  F21V13/02 ,  F21V23/002 ,  F21V23/004 ,  F21V23/006 ,  F21Y2115/10

    摘要： A light source device is provided such that light emerges mainly from the axially central section of an outer tube and is configured to minimize the risk of thermal damage to electronic components of a circuit unit. The device includes: a semiconductor light-emitting element as a light source; a circuit unit driving the semiconductor light-emitting element to emit light; and an envelope formed from an outer tube and a power connector, the envelope housing the semiconductor light-emitting element and the circuit unit. A light diffuser having a reflective outer surface to diffuse incident light is disposed at least partially in the axially central section of the outer tube. The semiconductor light-emitting element is disposed on a side of the light diffuser at which the power connector is located and in an orientation that its main emission direction points toward the light diffuser.

    摘要翻译： 提供光源装置，使得主要从外管的轴向中心部分出射，并且被配置为使对电路单元的电子部件的热损伤的风险最小化。 该装置包括：作为光源的半导体发光元件; 驱动半导体发光元件发光的电路单元; 以及由外管和电源连接器形成的封套，所述封套容纳所述半导体发光元件和所述电路单元。 具有反射外表面以扩散入射光的光扩散器至少部分设置在外管的轴向中心部分中。 半导体发光元件设置在电源连接器所在的光扩散器的一侧，并且以其主发射方向指向光扩散器的方向设置。

    Bulb-type lamp and lighting device
    6.
    发明授权
    Bulb-type lamp and lighting device 失效
    灯泡型灯具及照明装置

    公开(公告)号：US08439527B2

    公开(公告)日：2013-05-14

    申请号：US13243517

    申请日：2011-09-23

    申请人： Kenzi Takahasi ,  Yasushige Tomiyoshi ,  Satoshi Shida ,  Tatsumi Setomoto ,  Akira Taniuchi ,  Takaari Uemoto ,  Hideo Nagai

    发明人： Kenzi Takahasi ,  Yasushige Tomiyoshi ,  Satoshi Shida ,  Tatsumi Setomoto ,  Akira Taniuchi ,  Takaari Uemoto ,  Hideo Nagai

    IPC分类号： F21V7/00

    CPC分类号： F21V23/009 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21S8/026 ,  F21V3/00 ,  F21V23/002 ,  F21V23/006 ,  F21V29/507 ,  F21V29/70 ,  F21Y2115/10

    摘要： Provided is a bulb-type lamp including a lightweight housing with great handleability. An LED light bulb comprises: an LED module on which LEDs are mounted; a cylindrically-shaped case having openings at both ends, which are first and second ends; a mount member on a front surface of which the LED module is mounted, the mount member closing a corresponding one of the openings of the case by being in contact with an inner circumferential surface of the first end of the case; a base member attached to the second end of the case; and a lighting circuit that is disposed inside the case. A wall thickness of the case is in a range of 200 μm to 500 μm inclusive, and the wall thickness of at least one portion of the case decreases from the first end toward the second end of the case.

    摘要翻译： 提供一种灯泡型灯，其包括具有很大可操作性的轻质外壳。 LED灯泡包括：安装有LED的LED模块; 在两端具有开口的圆筒状壳体，其为第一端和第二端; 安装构件，其表面上安装有LED模块，所述安装构件通过与所述壳体的第一端的内周面接触而封闭所述壳体的相应一个开口; 附接到所述壳体的第二端的基部构件; 以及设置在壳体内的照明电路。 壳体的壁厚在200μm〜500μm的范围内，壳体的至少一部分的壁厚从壳体的第一端朝向第二端部减小。

    Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same
    7.
    发明授权
    Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same 有权
    半导体发光器件及其制造方法以及使用其的照明装置及显示装置

    公开(公告)号：US08237173B2

    公开(公告)日：2012-08-07

    申请号：US12639375

    申请日：2009-12-16

    申请人： Hideo Nagai

    发明人： Hideo Nagai

    IPC分类号： H01L27/15

    CPC分类号： H01L27/156 ,  H01L23/16 ,  H01L25/0753 ,  H01L33/20 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00

    摘要： The present invention aims to provide a semiconductor light emitting device that may be firmly attached to a substrate with maintaining excellent light emitting efficiency, and a manufacturing method of the same, and a lighting apparatus and a display apparatus using the same. In order to achieve the above object, the semiconductor light emitting device according to the present invention includes a luminous layer, a light transmission layer disposed over a main surface of the luminous layer, and having depressions on a surface facing away from the luminous layer, and a transmission membrane disposed on the light transmission layer so as to follow contours of the depressions, and light from the luminous layer is irradiated so as to pass through the light transmission layer and the transmission membrane.

    摘要翻译： 本发明的目的在于提供一种能够以保持良好的发光效率牢固地附着到基板的半导体发光器件及其制造方法，以及使用该半导体发光器件的照明装置和显示装置。 为了实现上述目的，根据本发明的半导体发光器件包括发光层，设置在发光层的主表面上的透光层，并且在背离发光层的表面上具有凹陷， 以及设置在光透射层上以便跟随凹陷的轮廓的透射膜，并且照射来自发光层的光以穿过透光层和透射膜。

    BULB-SHAPED LAMP AND LIGHTING DEVICE
    9.
    发明申请
    BULB-SHAPED LAMP AND LIGHTING DEVICE 有权
    BULB型灯和照明设备

    公开(公告)号：US20120002421A1

    公开(公告)日：2012-01-05

    申请号：US13222373

    申请日：2011-08-31

    申请人： Kenzi Takahasi ,  Yasushige Tomiyoshi ,  Takaari Uemoto ,  Hideo Nagai ,  Mamoru Takeda ,  Yoshio Manabe

    发明人： Kenzi Takahasi ,  Yasushige Tomiyoshi ,  Takaari Uemoto ,  Hideo Nagai ,  Mamoru Takeda ,  Yoshio Manabe

    IPC分类号： F21V21/00 ,  F21V29/00

    CPC分类号： F21V23/009 ,  F21K9/23 ,  F21K9/233 ,  F21S8/026 ,  F21V3/00 ,  F21V23/002 ,  F21V29/15 ,  F21V29/83 ,  F21V29/89 ,  F21Y2115/10

    摘要： A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5≦S1/S2≦3.0, is satisfied where S1 denotes an area of a portion of the mount member in contact with the case and S2 denotes an area of the portion of the mount member in contact with a substrate of the LED module.

    摘要翻译： 一种具有散热和尺寸/重量减轻性能以及在照明电路上具有较低热负荷的灯泡式灯。 LED模块安装在具有基座构件的壳体中以允许散热。 LED安装构件封闭壳体的另一端并允许热传导到壳体。 照明电路经由基座部件接收电力。 照明电路设置在电路保持器内。 在电路架与壳体和安装构件之间存在空气空间。 照明电路由电路座与空气空间隔离。 满足关系0.5＆nlE; S1 / S2＆nlE; 3.0，其中S1表示与壳体接触的安装构件的一部分的面积，S2表示安装构件与LED的基板接触的部分的面积 模块。

    ILLUMINATION DEVICE
    10.
    发明申请
    ILLUMINATION DEVICE 失效
    照明装置

    公开(公告)号：US20110273895A1

    公开(公告)日：2011-11-10

    申请号：US13144681

    申请日：2010-09-28

    申请人： Takaari Uemoto ,  Yasuyuki Ueda ,  Mitsuko Shuto ,  Masahiro Miki ,  Makoto Inoue ,  Hideo Nagai ,  Kenji Takahashi ,  Takeshi Saito

    发明人： Takaari Uemoto ,  Yasuyuki Ueda ,  Mitsuko Shuto ,  Masahiro Miki ,  Makoto Inoue ,  Hideo Nagai ,  Kenji Takahashi ,  Takeshi Saito

    IPC分类号： F21S8/00

    CPC分类号： F21V23/009 ,  F21K9/232 ,  F21V19/0055 ,  F21Y2115/10

    摘要： A mount member (5) has a contact surface (27a) touching the bottom surface of an LED module (3) and protrusions (5a) protruding from the periphery of the contact surface (27a) in the thickness direction of the LED module (3) and regulating sliding motions thereof. A fixing member (6) made of a resilient, plate-like member comprises an opposing pair of flat portions (43) near the contact surface (27a) of the mount member (5) and flat tabs (44) projecting from the flat portions (43) toward the contact surface (27a) touching the upper surface of a substrate (17). The flat portions (43) of the fixing member (6) are fastened to be lower than the top surface of the substrate (17) of the LED module (3). Thus, elastically deformed areas extending from the fastened parts of the flat portions (43) through the flat tabs (44) press the substrate (17) into the mount member (5).

    摘要翻译： 安装构件（5）具有接触LED模块（3）的底面的接触表面（27a）和在LED模块（3）的厚度方向上从接触表面（27a）的周边突出的突起（5a） ）并调节其滑动运动。 由弹性的板状构件制成的固定构件（6）包括在安装构件（5）的接触表面（27a）附近的相对的一对平坦部分（43）和从平坦部分突出的平坦突片（44） （43）朝向接触基板（17）的上表面的接触表面（27a）。 固定部件（6）的平坦部（43）被固定成比LED模块（3）的基板（17）的上表面低。 因此，从扁平部分43的紧固部分延伸穿过平板突起44的弹性变形区域将基板17压入安装部件5。