摘要:
Metal organic precursor compounds are dissolved in an organic solvent to form a nonaqueous liquid precursor. The liquid precursor is applied to the inner envelope surface of a fluorescent lamp and heated to form a metal oxide thin film layer. The metal oxide thin film layer may be a conductor, a protective layer or provide other functions. The films have a thickness of from 20 nm to 500 nm. A conductive layer comprising tin-antimony oxide with niobium dopant may be fabricated to have a differential resistivity profile by selecting a combination of precursor composition and annealing temperatures.
摘要:
A thin film of ferroelectric layered superlattice material in a flat panel display device is energized to selectively influence the display image. In one embodiment, a voltage pulse causes the layered superlattice material to emit electrons that impinge upon a phosphor, causing the phosphor to emit light. In another embodiment, an electric potential creates a remanent polarization in the layered superlattice material, which exerts an electric field in liquid crystal layer, thereby influencing the transmissivity of light through the liquid crystal. The layered superlattice material is a metal oxide formed using an inventive liquid precursor containing an alkoxycarboxylate. The thin film thickness is preferably in the range 50-140 nm, so that polarizabilty and transparency of the thin film is enhanced. A display element may comprise a varistor device to prevent cross-talk between pixels and to enable sudden polarization switching. A functional gradient in the ferroelectric thin film enhances electron emission. Two ferroelectric elements, one on either side of the phosphor may be used to enhance luminescence. A phosphor can be sandwiched between a dielectric and a ferroelectric to enhance emission.
摘要:
A new method (P200) is provided for making magnesium oxide layers (122) in plasma displays (100). A magnesium carboxylate liquid precursor solution is applied to a display panel (102), dried, and annealed to yield a solid magnesium oxide layer (122) having excellent electro-optical performance.
摘要:
A pair of field-effect transistors (hereinafter referred to as FETs) of p-channel type and n-channel type, respectively, both to be electrically actuated in a depletion mode, are formed on a single semiconductor substrate, for instance, a single silicon substrate, and both sources or both drains are connected to each other, or the source of one FET and the drain of the other FET are connected to each other, whereby the pair of FETs are series-connected, and the gate electrode of each FET is connected to the drain electrode or the source electrode that is not series connected in the above-mentioned way, respectively, of the other FET. The device is characterized in that each FET has each back-gate electrode region behind the channel. Preferably, such back-gate regions are high-doped diffused regions.When a voltage of specified range is applied across both non-series-connected electrodes, i.e., the two external terminals, the resulting voltage-current characteristic presents a so-called dynatron-type characteristic, producing a negative-resistance phenomenon over a fairly wide range of applied voltage. Since this device is, as seen from outside as one device, a two-terminal device constituted on a single substrate comprising FETs with back-gate electrode, it is not only fit to be highly integrated but also able to produce a state of virtually zero value of cut-off current. Consequently, this device can be utilized for switching, memorization, large amplitude oscillation, and other various uses, with low Vth2 value.
摘要:
In the process of forming a thermal oxide film or heat treatment of an oxide film in making a semiconductor device comprising a compound semiconductor of arsenic, the semiconductor is handled in an atmosphere containing arsenic oxide vapor in order to prevent evaporation of the arsenic tri-oxide in the thermal oxidation film or the oxide film under heat treatment, thereby to form a thermal oxide film having good chemical stability and good electrical characteristics, or to improve the oxide film so as to have good chemical stability and good electrical characteristics.
摘要:
Across a D.C. power source 1, a load 2, a switching element 4, such as a transistor having a control electrode c (base), and a voltage detection means 5, such as a resistor, are connected in series, and a known negative resistance device 6, having two terminals 31 and 32, is connected by its one terminal 32 to said control electrode c of the switching element 4 and by its other terminal 31 to one end of said series resistor 5 which one end is opposite to that connected to said switching element (4), wherein said negative resistance device 6 comprises, as shown in FIG 2, known complementary connection of a depletion mode n-channel field-effect transistor (FET) and a depletion mode p-channel FET. The FETs are connected from source to source, and from the gate of each to the drain of the other so that when an overcurrent to the load 2 or an overvoltage at the voltage source 1 occurs, voltage across said resistor 5 exceeds a preset value, the negative resistance device 6 is cut-off, thereby cutting off the switching element 4.
摘要:
A dual gate Schottky barrier gate GaAs FET with improved cross-modulation characteristics when used in a UHF gain controlling tuner, having a value of 40 mA or smaller of a drain to source saturation current, the improvement of the FET is that length of a second gate which is disposed between a first gate and a drain is 1.5 .mu.m or longer.
摘要:
A negative resistance device formed by series-connection of a complementary pair of insulated gate type FETs (field effect transistors), the source of the FETs being connected to each other and the gates of each of the FETs being connected to the respective drain of the other FET at least one FET having a double layered gate insulation film under the gate electrode, thereby forming a non-volatile memory element. The negative resistance device acquires or loses negative resistance characteristics by responding to signals to the gates, thereby memorizing the signals and resulting in a highly efficient memory which requires little power in writing-in, erasing and memory-holding.
摘要:
A method of manufacturing a junction field effect transistor wherein after a P type pre-diffused layer is formed in an N type region constituting a back gate region of a junction field effect transistor, arsenic is selectively diffused into the P type pre-diffused layer to form a gate region with a simultaneous drive-in step for the P type pre-diffused layer in order to obtain a thin channel by utilizing the pull-in effect.
摘要:
A novel self-align type method of making an FET with a very short gate length and a good high frequency characteristic, and a low noise characteristic, the method comprising the steps of:forming on a silicon epitaxial layer (13) of n-type conductivity a doped oxide film (14) containing boron as an impurity to give p-type conductivity,forming a mask (15a, 16a) containing Si.sub.3 N.sub.4 film and having a width larger than that of a gate region (19) to be formed on said n-type epitaxial layer (13),etching said doped oxide film (14) by utilizing said mask (15a, 16a) as an etching mask to expose surface of said silicon crystal layer (13) in a manner that sides of the part of said doped oxide film (14) covered by said mask (15, 16a) are side-etched by a predetermined width,ion-implanting an impurity of said first conductivity type into said n-type epitaxial layer (13) by utilizing said mask as implanting mask, andcarrying out a heat treating thereby diffusing said second conductivity type impurity from said doped oxide film (14) retained only under said mask into said n-type epitaxial layer (13) to form said gate region (19) and driving said ion-implanted first conductivity type impurity into said silicon crystal layer (13) to form a source region (17) and a drain region (18).
摘要翻译:一种制造具有非常短的栅极长度和良好的高频特性以及低噪声特性的FET的新型自对准型方法,该方法包括以下步骤:在n型硅外延层(13)上形成 电导率为含有硼作为杂质的掺杂氧化物膜(14)以产生p型导电性,形成包含Si 3 N 4膜的掩模(15a,16a),其宽度大于所述栅极区域(19)的宽度 通过利用所述掩模(15a,16a)作为蚀刻掩模蚀刻所述掺杂氧化物膜(14),以使得所述硅晶体层(13)的所述一部分的侧面 将由所述掩模(15,16a)覆盖的所述掺杂氧化物膜(14)以预定宽度进行侧蚀刻,通过利用所述掩模将所述第一导电类型的杂质离子注入所述n型外延层(13) 植入掩模,并进行热处理,从而扩散所述第二导电型不动杆 将所述掺杂氧化物膜(14)保留在所述掩模内的所述n型外延层(13)中以形成所述栅极区域(19)并将所述离子注入的第一导电类型杂质驱动到所述硅晶体层(13)中, 以形成源极区(17)和漏极区(18)。