公开(公告)号：US20240305426A1

公开(公告)日：2024-09-12

申请号：US18595401

申请日：2024-03-04

申请人： MediaTek Singapore Pte. Ltd. ,  Shanghai Jiao Tong University

发明人： Aimin Tang ,  Qimin Zhao ,  Wenze Qu ,  Hao Bi ,  Rui Zhang

IPC分类号： H04L5/00

CPC分类号： H04L5/0051 ,  H04L5/0007 ,  H04L5/0094

摘要： In one novel aspect, OFDM RS symbols are configured with zero-power RS occupying either all even subcarrier or all odd subcarriers and the non-zero-power RS occupy all or part of remaining subcarriers. In one embodiment, even component RS symbols and odd component RS symbols are alternatively inserted in data frames with frequency offsets. In one embodiment, the receiver performs a wireless sensing by sampling a final-half duration with phase preprocessing. In one novel aspect, the target distance and velocity are uniquely determined via estimating clustering-range rate during successive CPIs. In one embodiment, the UE performing successive sensing for multiple clusters based on the diamond-shaped RS configuration during N successive CPIs, and a range rate for each cluster, selects a cluster with velocity that matches the calculated range rate, and determines a target distance and velocity based on the selected cluster.

公开(公告)号：US12089254B2

公开(公告)日：2024-09-10

申请号：US18113227

申请日：2023-02-23

申请人： MediaTek Singapore Pte. Ltd.

发明人： Kai Ying Lu ,  Yongho Seok ,  James Chih-Shi Yee ,  Chao-Chun Wang ,  Jianhan Liu

IPC分类号： H04W74/0816 ,  H04L1/00 ,  H04W80/02

CPC分类号： H04W74/0816 ,  H04L1/0068 ,  H04W80/02

摘要： A first station (STA) and a second STA perform bandwidth negotiation with a bandwidth extension indication. Then the first STA and the second STA communicate wirelessly according to the bandwidth negotiation.

公开(公告)号：US20240297120A1

公开(公告)日：2024-09-05

申请号：US18407783

申请日：2024-01-09

申请人： MEDIATEK INC.

发明人： Wei-Yu CHEN ,  Yi-Lin TSAI ,  Nai-Wei LIU ,  Shih-Chin LIN ,  Wen-Sung HSU

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H01L25/16

CPC分类号： H01L23/5381 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/19011 ,  H01L2924/19106

摘要： A semiconductor package structure includes a first redistribution layer, a first semiconductor die, a second semiconductor die, a bridge structure, and a plurality of conductive bumps. The first semiconductor die and the second semiconductor die are disposed over the first redistribution layer. The bridge structure is disposed under the first redistribution layer. The first semiconductor die is electrically coupled to the second semiconductor die through the first redistribution layer and the bridge structure. The conductive bumps are disposed under the first redistribution layer and are coupled to the first redistribution layer. The bridge structure is disposed between at least two of the conductive bumps.

公开(公告)号：US12081120B1

公开(公告)日：2024-09-03

申请号：US18296516

申请日：2023-04-06

申请人： MediaTek Singapore Pte. Ltd.

发明人： Fang He ,  Xming Zhu

IPC分类号： H02M3/07 ,  H02M1/00

CPC分类号： H02M3/071 ,  H02M1/0012

摘要： A negative charge pump (NCP) with high reliability is shown. A first capacitor is coupled between the power terminal and the ground terminal while in the first state and disconnected from the power terminal and the ground terminal while in the second state. A second capacitor is coupled between the ground terminal and the output terminal of the NCP, wherein while in the second state, the second capacitor is further coupled in parallel with the first capacitor. The first capacitor is coupled to the power terminal and the ground terminal while in the first state through a first switch and the second switch, respectively. When switching from the second state to the first state, the first switch is closed before the second switch.

公开(公告)号：US12080614B2

公开(公告)日：2024-09-03

申请号：US17493853

申请日：2021-10-05

申请人： MEDIATEK INC.

发明人： Shih-Chao Chiu ,  Chi-Yuan Chen ,  Wen-Sung Hsu ,  Ya-Jui Hsieh ,  Yao-Pang Hsu ,  Wen-Chun Huang

IPC分类号： H01L23/31 ,  H01L23/40 ,  H01L23/473 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC分类号： H01L23/31 ,  H01L23/4006 ,  H01L23/473 ,  H05K5/0052 ,  H05K5/0221 ,  H05K5/03

摘要： A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.

公开(公告)号：US20240291524A1

公开(公告)日：2024-08-29

申请号：US18398160

申请日：2023-12-28

申请人： MediaTek Inc.

发明人： Cheng-En Hsieh ,  Ming-Hsiang Tseng ,  Kang-Li Wu ,  Shih-Wei Lin ,  Hao-Chih Yu ,  Ching-Yu Kuo ,  Hung-Tao Hsieh

IPC分类号： H04B7/0417

CPC分类号： H04B7/0421

摘要： Techniques pertaining to trigger-based (TB) implicit feedback for implicit beamforming in wireless communications are described. An apparatus (e.g., an access point (AP)) triggers each of one or more stations (STAs) to transmit a respective feedback. The apparatus estimates a respective steering matrix with respect to each of the one or more STAs based on the respective feedback. The apparatus then transmits a respective steered data to each of the one or more STAs based on the respective steering matrix.

公开(公告)号：US20240290780A1

公开(公告)日：2024-08-29

申请号：US18413264

申请日：2024-01-16

申请人： MEDIATEK INC.

发明人： Zheng ZENG ,  Chia-Hsin HU ,  Chen-Ting LENG

IPC分类号： H01L27/06 ,  H01L23/528 ,  H01L29/06 ,  H01L29/417 ,  H01L29/423 ,  H01L29/775 ,  H01L29/94

CPC分类号： H01L27/0629 ,  H01L23/5286 ,  H01L29/0673 ,  H01L29/41733 ,  H01L29/42392 ,  H01L29/775 ,  H01L29/94

摘要： A semiconductor structure is provided. The semiconductor structure includes a semiconductor substrate, first and second well regions, first and second gate-all-around (GAA) field-effect transistor devices and a first dielectric layer. The first and second well regions are arranged in the semiconductor substrate and separated from each other. Top and bottom surfaces of the first and second well regions are aligned with top and bottom surfaces of the semiconductor substrate. The first and second GAA field-effect transistor devices are formed over the first and second well regions. A first gate structure of the first GAA field-effect transistor device is electrically connected to a power supply terminal. The first epitaxial source/drain features of the first GAA field-effect transistor are electrically connected to the second gate structure of the second GAA field-effect transistor. The second epitaxial source/drain features of the second GAA field-effect transistor are electrically connected to a ground terminal.

公开(公告)号：US20240284221A1

公开(公告)日：2024-08-22

申请号：US18426141

申请日：2024-01-29

申请人： MediaTek Inc.

发明人： Chi-Hsuan Hsieh ,  Wei-De Wu

IPC分类号： H04W24/10 ,  H04L5/00

CPC分类号： H04W24/10 ,  H04L5/0048

摘要： Examples pertaining to network energy saving in mobile communications are described. A user equipment (UE) receives a report configuration from a network apparatus. The report configuration includes a list of sub-configurations, and each sub-configuration corresponds to an antenna port subset which indicates one or more enabled or disabled antenna ports of a plurality of antenna ports of the network apparatus. The UE then transmit a measurement report of a channel state information-reference signal (CSI-RS) based on the report configuration.

公开(公告)号：US20240283493A1

公开(公告)日：2024-08-22

申请号：US18440998

申请日：2024-02-14

申请人： MediaTek Inc.

发明人： Chia-Hao Yu ,  Tzu-Han Chou ,  Jiann-Ching Guey ,  Chin-Kuo Jao ,  Parisa Cheraghi ,  Chun-Chia Tsai

IPC分类号： H04B7/0417 ,  H04B7/0452

CPC分类号： H04B7/0417 ,  H04B7/0452

摘要： Various solutions for tiered channel information feedback with respect to user equipment and network apparatus in mobile communications are described. An apparatus may determine a first tier channel state information (CSI) based on a first reference signal resource measurement. The apparatus may report the first tier CSI to a network node. The apparatus may determine a second tier CSI based on the first tier CSI and based on a second reference signal resource measurement. The apparatus may report the second tier CSI to the network node. The second tier CSI may be different from the first tier CSI.

公开(公告)号：US20240276268A1

公开(公告)日：2024-08-15

申请号：US18432249

申请日：2024-02-05

申请人： MediaTek Singapore Pte. Ltd.

发明人： Waseem Hazim Ozan Ozan ,  Tsang-Wei S Aleabe yu ,  Hsuan-Li Lin

IPC分类号： H04W24/10

CPC分类号： H04W24/10

摘要： In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The method may be performed by a UE. In certain configurations, the UE performs a procedure resulting in a status change of a first pre-configured measurement gap (pre-MG) of a pre-MG activation procedure. The UE determines whether the pre-MG activation procedure collides with or is overlapped with an overlapping gap. In response to determining that the pre-MG activation procedure collides with or is overlapped with the overlapping gap, the UE configures a pre-MG activation delay for the first pre-MG after an end of the overlapping gap, and performs the pre-MG activation procedure in the first pre-MG after the pre-MG activation delay.