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公开(公告)号：US20210285897A1
公开(公告)日：2021-09-16
申请号：US17193219
申请日：2021-03-05
IPC分类号： G01N23/046 , G01N23/083
摘要： A radiation detector module includes a frame, a module circuit board connected to the frame, detector units that each include radiation sensors disposed above the frame and electrically connected to the module circuit board, and an optically and infrared radiation opaque, X-ray transparent, electrically insulating detector shield covering a top surface and at least one side surface of the radiation sensors.
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公开(公告)号：US11105938B2
公开(公告)日：2021-08-31
申请号：US16894063
申请日：2020-06-05
发明人： Bernard Harris , Krzysztof Iniewski
IPC分类号： G01T1/24
摘要： Various aspects include circuits and methods for use in X-ray detectors for obtaining time information regarding when an indication of an X-ray photon's energy, such as a CSA output voltage, and using the time information to obtain temporal-spectral data regarding an X-ray photon detection. The temporal-spectral data may be used to determine the X-ray photon's energy, to detect and account for multiple X-ray photon detection events (“pile ups”), and/or accommodating detection events in which charge is shared between two pixel detectors.
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公开(公告)号：US11067707B2
公开(公告)日：2021-07-20
申请号：US15972717
申请日：2018-05-07
摘要： A radiation detector unit includes an interposer, at least one radiation sensor bonded to a front side of an interposer, an application-specific integrated chip (ASIC) bonded to a backside of the interposer, a carrier board bonded to the backside of the interposer and located on a backside of the ASIC, and at least one flex cable assembly attached to a respective side of the carrier board.
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公开(公告)号：US20210121143A1
公开(公告)日：2021-04-29
申请号：US17019750
申请日：2020-09-14
IPC分类号： A61B6/00 , G01N23/046
摘要： Various aspects include methods for use in X-ray detectors for adjusting count measurements from pixel detectors within a pixelated detector module to correct for the effects of pileup events that occur when more than one photon is absorbed in a pixel detector during a deadtime of the detector system. In various embodiments, count measurements may be obtained at two different X-ray tube currents, from which the detector system deadtime may be calculated based on the two count measurements and a ratio of the two X-ray tube currents. Using the calculated deadtime, a pileup correction factor may be determined appropriate for the behavior of the detector system in response to pileup events. The pileup correction factor may be applied to pixel detector count values after the counts have been corrected for pixel-to-pixel differences using a flat field correction.
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公开(公告)号：US10983372B2
公开(公告)日：2021-04-20
申请号：US16035801
申请日：2018-07-16
IPC分类号： G02F1/03 , H01L33/32 , H01L33/50 , H01L33/44 , H01L21/02 , H01L31/0216 , H01L33/36 , G02F1/015 , H01L31/0232 , G02F2/02 , H01L33/00 , G02F1/00 , G02F1/35 , G02F1/355 , H01L33/02 , H01L31/02 , H01L31/0224 , H01L27/146 , G02F1/01 , G02F1/017
摘要： An electro-optic modulator includes a doped semiconductor crystal having a crystallographic surface having an amplitude modulation orientation, a first metal electrode located on a first surface of the doped semiconductor crystal, a second metal electrode located on a second surface of the doped semiconductor crystal, and accumulation space charge regions located within surface regions of the doped semiconductor crystal that are proximal to the first metal electrode and the second metal electrode and including excess charge carriers of a same type as majority charge carriers of the doped semiconductor crystal.
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26.发明申请SIDE SHIELDING CATHODE DESIGN FOR A RADIATION DETECTOR WITH IMPROVED EFFICIENCY 审中-公开具有改进效率的辐射探测器的侧面遮蔽阴极设计公开(公告)号：US20120267737A1
公开(公告)日：2012-10-25
申请号：US13451670
申请日：2012-04-20
申请人： Henry Chen , Salah Awadalla , Pramodha Marthandam
发明人： Henry Chen , Salah Awadalla , Pramodha Marthandam
CPC分类号： H01L31/085 , H01L27/14683 , H01L31/0224 , H01L31/1828 , Y02E10/543
摘要： A radiation detector includes a semiconductor substrate which contains front and rear major surfaces and at least one side surface, a guard ring and a plurality of anode electrode pixels located over the rear surface of the semiconductor substrate, where each anode electrode pixel is formed between adjacent pixel separation regions, a side insulating layer formed on the at least one side surface of the semiconductor substrate, a cathode electrode located over the front major surface of the semiconductor substrate, and an electrically conductive cathode extension formed over at least a portion of side insulating layer, where the cathode extension contacts an edge of the cathode electrode. Further embodiments include various methods of making such semiconductor radiation detector.
摘要翻译： 辐射检测器包括半导体衬底，其包含前后主表面和至少一个侧表面，保护环和位于半导体衬底的后表面上方的多个阳极电极像素，其中每个阳极电极像素形成在相邻 像素分离区域，形成在半导体衬底的至少一个侧表面上的侧绝缘层，位于半导体衬底的前主表面上方的阴极电极和形成在侧绝缘层的至少一部分侧壁上的导电阴极延伸部 其中阴极延伸部接触阴极电极的边缘。 另外的实施例包括制造这种半导体辐射检测器的各种方法。
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27.发明授权Method of making segmented contacts for radiation detectors using direct photolithography 有权使用直接光刻法制造辐射探测器的分段触点的方法公开(公告)号：US07728304B2
公开(公告)日：2010-06-01
申请号：US11633091
申请日：2006-12-04
申请人： Henry Chen , Serguei Roupassov , Salah Awadalla
发明人： Henry Chen , Serguei Roupassov , Salah Awadalla
IPC分类号： H01L27/146
CPC分类号： G01T1/2928 , H01L27/14676 , H01L27/14696 , H01L31/085 , H01L31/1828 , H01L2924/0002 , Y02E10/543 , Y02P70/521 , H01L2924/00
摘要： A method is provided for fabricating contacts on semiconductor substrates by direct lithography that results in durable adhesion of the electrodes, increased interpixel resistance and the electrodes which act as a blocking contact, thereby providing for improved energy resolution in a resultant radiation detector.
摘要翻译： 提供了一种用于通过直接光刻制造半导体衬底上的接触的方法，其导致电极的耐久粘附，增加的间隙电阻和用作阻塞接触的电极，从而提供在所得到的辐射检测器中改善的能量分辨率。
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28.发明授权Cold-walled vessel process for compounding, homogenizing and consolidating semiconductor compounds 有权用于混合，均化和固结半导体化合物的冷壁容器工艺公开(公告)号：US07427382B2
公开(公告)日：2008-09-23
申请号：US11471734
申请日：2006-06-21
CPC分类号： C01B19/007 , C01B19/002 , H01L21/02562 , H01L21/02628
摘要： A method is provided for compounding, homogenizing and consolidating compounds. In one embodiment, the charge components are mixed in a controlled addition process, then the newly-formed compound is heated to become totally molten, followed by a rapid quench at room temperature. In an alternate embodiment, the components are supplied with an excess of one component acting as a solvent, heated to dissolve additional components, and then the solvent is separated from the compound to produce homogeneous consolidated compounds. The methods herein are advantageously applied to provide an economical and fast process for producing CdTe, CdZnTe and ZnTe compounds.
摘要翻译： 提供了用于混合，均化和固结化合物的方法。 在一个实施方案中，电荷成分在受控的加成过程中混合，然后将新形成的化合物加热至完全熔融，然后在室温下快速骤冷。 在一个替代实施方案中，向组分供应过量的一种作为溶剂的组分，加热以溶解另外的组分，然后将溶剂与化合物分离以产生均匀的固化化合物。 本文的方法有利地用于提供用于生产CdTe，CdZnTe和ZnTe化合物的经济且快速的方法。
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29.发明申请Cold-walled vessel process for compounding, homogenizing and consolidating semiconductor compounds 有权用于混合，均化和固结半导体化合物的冷壁容器工艺公开(公告)号：US20070036700A1
公开(公告)日：2007-02-15
申请号：US11471734
申请日：2006-06-21
申请人： Robert Redden , Weidong Huang , Troy Hasanen
发明人： Robert Redden , Weidong Huang , Troy Hasanen
IPC分类号： C01G11/00
CPC分类号： C01B19/007 , C01B19/002 , H01L21/02562 , H01L21/02628
摘要： A method is provided for compounding, homogenizing and consolidating compounds. In one embodiment, the charge components are mixed in a controlled addition process, then the newly-formed compound is heated to become totally molten, followed by a rapid quench at room temperature. In an alternate embodiment, the components are supplied with an excess of one component acting as a solvent, heated to dissolve additional components, and then the solvent is separated from the compound to produce homogeneous consolidated compounds. The methods herein are advantageously applied to provide an economical and fast process for producing CdTe, CdZnTe and ZnTe compounds.
摘要翻译： 提供了用于混合，均化和固结化合物的方法。 在一个实施方案中，电荷成分在受控的加成过程中混合，然后将新形成的化合物加热至完全熔融，然后在室温下快速骤冷。 在一个替代实施方案中，向组分供应过量的一种作为溶剂的组分，加热以溶解另外的组分，然后将溶剂与化合物分离以产生均匀的固化化合物。 本文的方法有利地用于提供用于生产CdTe，CdZnTe和ZnTe化合物的经济且快速的方法。
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公开(公告)号：US20240085577A1
公开(公告)日：2024-03-14
申请号：US18462859
申请日：2023-09-07
CPC分类号： G01T1/243 , G01T1/247 , G06F15/7807
摘要： An X-ray detector module of a multi-module X-ray detector array having a local processing unit configured to provide real-time control and computational capabilities at the x-ray detector module. In various embodiments, by providing these capabilities in the detector module itself, as opposed to a component located downstream of the detector module, there may be an immediate cost reduction, opportunities to include additional features, and performance improvement opportunities not otherwise practical to implement in conventional X-ray imaging systems.
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