公开(公告)号：US20020005166A1

公开(公告)日：2002-01-17

申请号：US09899192

申请日：2001-07-06

Inventor： Takashi Kisaichi

IPC: C23F001/02 ,  B05C013/00

CPC classification number: H01L21/68721 ,  Y10T279/23

Abstract: The placement of a wafer can be performed with good positional precision, and the positioning of wafer clamps during maintenance is facilitated. A tapered recess is formed in that portion of the wafer support on which a wafer is placed. When a wafer is placed in the recess, the sloped surface inside this recess comes into contact with the edge of the wafer from beneath the wafer. The wafer is supported in a specific attitude by the sloped surface inside this recess.

Abstract translation: 可以以良好的位置精度执行晶片的放置，并且便于维护期间晶片夹的定位。 在其上放置晶片的晶片载体的该部分中形成锥形凹部。 当晶片放置在凹槽中时，该凹槽内的倾斜表面从晶片下方与晶片的边缘接触。 晶片以特定的姿态由该凹槽内的倾斜表面支撑。

公开(公告)号：US20010027746A1

公开(公告)日：2001-10-11

申请号：US09797240

申请日：2001-03-01

Inventor： Seiichi Tobisawa

IPC: B05C001/00 ,  B05C013/00

CPC classification number: B05C5/0254

Abstract: An extruding coating method comprises steps of feeding a coating liquid into a coating liquid reservoir section provided with a slit having a slit width; and extruding the coating liquid through the slit so as to conduct coating, wherein the coating liquid is extruded through the slit by pushing the coating liquid in the coating liquid reservoir toward all over the slit width by a piston.

Abstract translation: 挤压涂布方法包括以下步骤：将涂布液供给到具有狭缝宽度的狭缝的涂液储存部中; 并且通过狭缝挤出涂布液以进行涂布，其中通过活塞将所述涂布液体涂覆在所述狭缝宽度上的方式将所述涂布液向所述狭缝挤出。

公开(公告)号：US20010009692A1

公开(公告)日：2001-07-26

申请号：US09728707

申请日：2000-12-01

Applicant: Murata Manufacturing Co., Ltd

Inventor： Shizuharu Watanabe

IPC: B05D001/02 ,  B05C013/00 ,  B05C011/02 ,  B05D003/02 ,  B05D003/12 ,  B05D001/36

CPC classification number: H01F41/0246 ,  B05B13/0257 ,  C23C4/00 ,  C23C24/04 ,  C23D5/00 ,  H01F41/046

Abstract: Methods and apparatuses for efficiently forming a homogeneous glass layer having uniform thickness and a homogeneous metal layer having uniform thickness are provided. A workpiece is accommodated in a screened container which is rotatable in a predetermined direction. The workpiece in the container is sprayed with an atomized glass slurry or an atomized metal slurry while the container is rotated in order to form a green glass layer or a green metal layer on the workpiece. Simultaneously, hot air is supplied to the workpiece so as to dry the green glass layer or the green metal layer. Thus, the workpiece, typically a ferrite core, can be provided with a homogeneous layer having a uniform thickness. A method for manufacturing an electronic component using the above-described methods and apparatuses is also provided.

Abstract translation: 提供了用于有效地形成具有均匀厚度的均匀玻璃层和均匀厚度均匀的金属层的方法和装置。 工件被容纳在可沿预定方向旋转的屏蔽容器中。 当容器旋转以在工件上形成绿色玻璃层或绿色金属层时，容器中的工件被喷射有雾化玻璃浆料或雾化金属浆料。 同时，向工件供应热空气以使绿色玻璃层或绿色金属层干燥。 因此，工件（通常为铁氧体磁芯）可以具有均匀厚度的均匀层。 还提供了使用上述方法和装置制造电子部件的方法。

公开(公告)号：US20010009135A1

公开(公告)日：2001-07-26

申请号：US09816389

申请日：2001-03-26

Inventor： Keizo Hasebe ,  Shuuichi Nishikido ,  Nobuo Konishi ,  Takayuki Toshima ,  Kazutoshi Yoshioka

IPC: B05C011/02 ,  B05C013/00

CPC classification number: G03F7/162 ,  B05C11/08

Abstract: A solvent of a resist solution is dropped from a solvent supply nozzle onto the surface of a semiconductor wafer held by a spin chuck. The semiconductor wafer is rotated by the spin chuck to spread the resist solution over the entire surface of the semiconductor wafer W. Simultaneously, the resist solution is dropped from a resist solution supply nozzle onto the semiconductor wafer and spread following the solvent. During the processing, the processing space is isolated from the outer atmosphere by closing a lid of a processing vessel and a sprayed solvent is supplied into the processing space. The processing space is thus filled with the mist of solvent. In the processing space supplied with the solvent, evaporation of the solvent from the resist solution is suppressed. A film of the resist solution is formed with a uniform film thickness to the edge of the semiconductor wafer W.

公开(公告)号：US20010007243A1

公开(公告)日：2001-07-12

申请号：US09756340

申请日：2001-01-08

Applicant: SAMSUNG ELECTRONIC CO., LTD.

Inventor： Sung-Koog Oh ,  Man-Seok Seo ,  Kyeong-Sup Kim

IPC: B05C011/00 ,  B05C013/00

CPC classification number: C03C25/12

Abstract: Disclosed is an optical fiber coating device for coating the outer circumference of the optical fiber with the coating material, in which the coating device is provided with and a gas provider for providing an environmental gas within the coating device, and a cooler for cooling down the environmental gas provided to the coater from the gas provider.

Abstract translation: 本发明公开了一种光纤涂敷装置，其特征在于，所述光纤涂布装置具有涂布装置和所述涂料装置内的环境气体用气体供给装置， 气体供应商提供给涂布机的环境气体。

公开(公告)号：US20040261698A1

公开(公告)日：2004-12-30

申请号：US10894897

申请日：2004-07-19

Inventor： Wouter E. Roorda ,  Stephen D. Pacetti

IPC: B05C013/00 ,  B05C003/00

CPC classification number: B05B13/0257

Abstract: An apparatus for coating stent is disclosed. The apparatus can be used to coat multiple stents or a large number of stents simultaneously. The apparatus includes a chamber that can be rotated or tumbled during the application of a coating substance to the stents.

Abstract translation: 公开了一种用于涂层支架的设备。 该装置可用于同时涂覆多个支架或大量支架。 该装置包括在将涂层物质施加到支架时能够旋转或翻滚的室。

公开(公告)号：US20030213431A1

公开(公告)日：2003-11-20

申请号：US10417460

申请日：2003-04-16

Applicant: Dainippon Screen Mfg. Co., Ltd.

Inventor： Yoshiteru Fukutomi ,  Kenji Sugimoto ,  Takashi Ito ,  Takeo Okamoto ,  Yukihiko Inagaki ,  Katsushi Yoshioka ,  Tsuyoshi Mitsuhashi

IPC: B05C013/00

CPC classification number: H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67276 ,  H01L21/67778 ,  Y10S414/135

Abstract: A substrate treating apparatus disclosed herein realizes improved throughput. The substrate treating apparatus according to this invention includes an antireflection film forming block, a resist film forming block and a developing block arranged in juxtaposition. Each block includes chemical treating modules, heat-treating modules and a single main transport mechanism. The main transport mechanism transports substrates within each block. Transfer of the substrates between adjacent blocks is carried out through substrate rests. The main transport mechanism of each block is not affected by movement of the main transport mechanisms of the adjoining blocks. Consequently, the substrates may be transported efficiently to improve the throughput of the substrate treating apparatus.

Abstract translation: 本文公开的基板处理装置实现了改善的生产量。 根据本发明的基板处理装置包括并列布置的防反射膜形成块，抗蚀剂膜形成块和显影块。 每个块包括化学处理模块，热处理模块和单个主要输送机构。 主要运输机构在每个区块内运输基材。 通过基板支架进行相邻块之间的基板的转移。 每个块的主要运输机构不受邻接块主运输机构的运动的影响。 因此，可以有效地输送基板，以提高基板处理装置的通过量。

公开(公告)号：US20030213430A1

公开(公告)日：2003-11-20

申请号：US10437384

申请日：2003-05-14

Applicant: FUJI PHOTO FILM CO., LTD.

Inventor： Hiromichi Ito

IPC: B05C013/00

CPC classification number: G11B15/43 ,  B65H18/103 ,  B65H23/26 ,  B65H35/02 ,  B65H2220/09 ,  B65H2301/4148 ,  B65H2403/7241 ,  B65H2701/378

Abstract: The magnetic tape manufacturing apparatus draws out a wide web-like magnetic tape material wound in roll form from the delivery side, slits the magnetic tape material into a plurality of narrow magnetic tapes by use of a slitter while transporting the magnetic tape material, and winds the narrow magnetic tapes on cores on the winding side through a tape transporting device. In the tape transporting device, roller members supporting the narrow magnetic tapes are mounted on supporting shafts, respectively, and an eddy current type clutch is internally mounted on at least one of the supporting shafts so that the eddy current type clutch controls rotation of the one of supporting shafts to control tension of the narrow magnetic tape supported on the roller member mounted on the one of supporting shafts. Hence, by making the tension of the individual magnetic tapes uniform, productivity and product quality can be stabilized and improved and yield can also be improved.

Abstract translation: 磁带制造装置从输送侧抽出卷绕成卷状的宽幅网状磁带材料，在输送磁带材料的同时，利用分切机将磁带材料切断成多个窄磁带， 通过带传送装置在卷绕侧的芯上的窄磁带。 在磁带传送装置中，支撑窄磁带的滚子部件分别安装在支撑轴上，并且涡流式离合器内部安装在至少一个支撑轴上，使得涡流型离合器控制一个 的支撑轴以控制支撑在安装在一个支撑轴上的辊构件上的窄磁带的张力。 因此，通过使单个磁带的张力均匀，可以稳定和提高生产率和产品质量，并且还可以提高产量。

公开(公告)号：US20030178146A1

公开(公告)日：2003-09-25

申请号：US10388968

申请日：2003-03-13

Inventor： Sam Kao

IPC: H01L021/306 ,  C23C016/00 ,  B05C013/00

CPC classification number: H01L21/6838 ,  H01J2237/2001

Abstract: An article (e.g. a semiconductor wafer) is held in an article holder by means of a number of gas flows emitted from gas vortex chambers. Some of the gas flows act to cool an adjacent article portion more than the other gas flows. For example, some of the vortex chambers emit more gas per unit of time than the other chambers. More cooling is provided to those portions of the article which are heated more during processing. Greater temperature uniformity can be achieved.

公开(公告)号：US20030136341A1

公开(公告)日：2003-07-24

申请号：US10341162

申请日：2003-01-13

Inventor： Sung-Min Na

IPC: B05C013/00

CPC classification number: H01L21/68742

Abstract: A wafer lift pin assembly of an apparatus for manufacturing a semiconductor device comprises a lower lift pin being driven up and down by an external driving means; a lower lift pin guide leading the lower lift pin to move up and down; an upper lift pin contacting the lower lift pin, the upper lift pin being driven up and down by the lower lift pin; and an upper lift pin guide leading the upper lift pin to move up and down.

Abstract translation: 一种用于制造半导体器件的装置的晶片提升销组件包括通过外部驱动装置上下驱动的下升降销; 下部升降销引导件引导下部升降销上下移动; 上提升销接触下提升销，上提升销由下提升销上下驱动; 以及上升针销，引导上升降销向上下移动。