公开(公告)号：US20030094586A1

公开(公告)日：2003-05-22

申请号：US10295621

申请日：2002-11-15

发明人： Toshirou Kurosawa ,  Yuzo Katsuki ,  Jun Takebayashi

IPC分类号： G01N021/86

CPC分类号： G01N21/9501 ,  G01N2021/8825

摘要： A low-cost defect inspection machine for semiconductor wafers that can detect various defects has been disclosed and comprises an optical system that projects a pattern image, an image sensor and a processing circuit that processes the image signal and detects defect portions, wherein the optical system comprises an objective lens, a bright field illumination system that has a semi-transparent mirror and irradiates a specimen through the objective lens with the illumination light reflected by the semi-transparent mirror in the range that includes the optical axis of the objective lens, and a dark field illumination system that has a reflecting mirror provided in the portion except for the projection path of the objective lens and irradiates a specimen through the objective lens with the illumination light reflected by the reflecting mirror.

摘要翻译： 已经公开了一种可以检测各种缺陷的用于半导体晶片的低成本缺陷检查机，并且包括投射图案的光学系统，图像传感器和处理图像信号并检测缺陷部分的处理电路，其中光学系统 包括物镜，具有半透明反射镜的亮场照明系统，并且通过半透射反射镜在包含物镜的光轴的范围内由半透射镜反射的照明光照射到物镜上的样本，以及 具有设置在物镜的投影路径以外的部分的反射镜的暗场照明系统，通过反射镜反射的照明光使物镜照射到物镜上。

公开(公告)号：US20030057381A1

公开(公告)日：2003-03-27

申请号：US10227190

申请日：2002-08-22

发明人： Noriyuki Hirayanagi

IPC分类号： G01N021/86

CPC分类号： B82Y10/00 ,  B82Y40/00 ,  H01J37/3045 ,  H01J37/3174 ,  H01J2237/3175

摘要： Methods and apparatus for alignment of masks and wafers in charged-particle-beam (CPB) pattern-transfer use optical position sensors to determine the positions of a mask or a mask stage with respect to an axis of a CPB optical system. The optical position sensor uses optical reference marks provided on the mask or mask stage. Determination of the position of the mask of the mask stage permits a coarse alignment of the mask or the mask stage. CPB reference marks are provided on masks, mask stages, wafers, and wafer stages, permitting alignment of the mask stage or the mask with respect to the wafer stage or wafer, respectively, using the charged particle beam. The charged particle beam is scanned with respect to the wafer or wafer-stage CPB reference marks to determine a deflection corresponding to an alignment of the CPB reference marks of the mask and wafer (or mask stage and wafer stage). Use of the charged particle beam for such alignment permits a fine alignment.

摘要翻译： 用于使带电粒子束（CPB）图案转印中的掩模和晶片对准的方法和装置使用光学位置传感器来确定掩模或掩模台相对于CPB光学系统的轴的位置。 光学位置传感器使用设在掩模或掩模台上的光学参考标记。 确定掩模台的掩模的位置允许掩模或掩模台的粗略对准。 CPB参考标记提供在掩模，掩模级，晶片和晶片级上，允许使用带电粒子束分别使掩模级或掩模相对于晶片级或晶片对准。 相对于晶片或晶片级CPB参考标记扫描带电粒子束，以确定对应于掩模和晶片（或掩模台和晶片台）的CPB参考标记的对准的偏转。 使用带电粒子束进行这种对准允许精细对准。

公开(公告)号：US20030025091A1

公开(公告)日：2003-02-06

申请号：US10188798

申请日：2002-07-05

申请人： Seiko Epson Corporation

发明人： Tsuyoshi Kaneko

IPC分类号： G01N021/00 ,  G01V008/00 ,  G01N021/86

CPC分类号： G01N21/55 ,  H01S5/0014 ,  H01S5/18311

摘要： The present invention is a method of inspecting a surface-emitting semiconductor laser in which a resonator is formed in a vertical direction on a semiconductor substrate. The surface-emitting semiconductor laser to be inspected includes a pillar portion in at least part of the resonator, and this pillar portion includes an oxidized current blocking layer. The oxidized current blocking layer includes an oxide aperture, and an oxidized portion formed around the oxide aperture. The surface-emitting semiconductor laser is irradiated with laser light in a direction perpendicular to a surface of the semiconductor substrate from the side on which the pillar portion is disposed, and the shape of the oxide aperture is measured based on the amount of reflected light at the oxidized current blocking layer.

摘要翻译： 本发明是一种在半导体衬底上检查在垂直方向上形成谐振器的表面发射半导体激光器的方法。 待检查的表面发射半导体激光器包括在谐振器的至少一部分中的柱部分，并且该柱部分包括氧化电流阻挡层。 氧化电流阻挡层包括氧化物孔和形成在氧化物孔周围的氧化部分。 表面发射半导体激光器从设置有柱部的一侧沿与半导体衬底的表面垂直的方向照射激光，并且基于反射光的反射光量来测量氧化物孔的形状 氧化电流阻挡层。

公开(公告)号：US20030025090A1

公开(公告)日：2003-02-06

申请号：US10200772

申请日：2002-07-24

申请人： Canon Kabushiki Kaisha

发明人： Hisanori Iwasaki

IPC分类号： G01N021/86 ,  G01V008/00

CPC分类号： B65H7/14 ,  B65H2511/51 ,  B65H2515/60 ,  B65H2553/412 ,  B65H2553/414 ,  B65H2220/03 ,  B65H2220/01

摘要： A sheet detecting device has a light emitting and receiving unit having a light emitting element for emitting detection light and a light receiving element for receiving the detection light, and a reflecting member for reflecting the detection light emitted from the light emitting element and making the reflected light incident to the light receiving element, and is constructed in a configuration wherein the light emitting and receiving unit and the reflecting member are placed with a sheet transport path between. The sheet detecting device is configured to detect a sheet on the basis of interruption of the detection light by the sheet transported through the sheet transport path. The sheet detecting device has an emission slit which restricts the detection light emitted from the light emitting element and which is arranged so as to be longitudinal along a sheet transport direction, and a reception slit which restricts the detection light incident to the light receiving element and which is arranged so as to be longitudinal along a direction intersecting with the sheet transport direction.

摘要翻译： 片材检测装置具有发光和接收单元，其具有用于发射检测光的发光元件和用于接收检测光的光接收元件，以及用于反射从发光元件发射的检测光并使其反射的反射部件 入射到光接收元件的光，并且被构造成其中发光和接收单元和反射部件之间具有片材传送路径的配置。 片材检测装置被配置为基于通过片材传送路径传送的片材的检测光的中断来检测片材。 片材检测装置具有发光狭缝，其限制从发光元件发射的检测光，其沿着纸张传送方向被纵向排列;以及接收狭缝，其限制入射到光接收元件的检测光和 其沿着与纸张输送方向相交的方向纵向排列。

公开(公告)号：US20030011786A1

公开(公告)日：2003-01-16

申请号：US09956835

申请日：2001-09-20

发明人： Ady Levy ,  Kyle A. Brown ,  Mehrdad Nikoonahad ,  Gary Bultman ,  Dan Wack ,  John Fielden

IPC分类号： G01R031/26 ,  H01L021/66 ,  G01N021/86 ,  G01B011/30

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/55 ,  G01N21/636 ,  G01N21/64 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  Y10T117/1004 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, overlay and flatness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于覆盖和平坦度。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US20030001118A1

公开(公告)日：2003-01-02

申请号：US10225141

申请日：2002-08-22

申请人： Shinko Electric Co., Ltd.

发明人： Masanao Murata

IPC分类号： G01N021/86 ,  G01V008/00

CPC分类号： H01L21/67259

摘要： This invention has as an object thereof to provide an overhead-traveling carrying apparatus which is capable of inexpensively incorporating countermeasures for detecting the presence of an obstacle such as a human being or a carelessly placed object during the lowering of an object to be carried onto the load port of a semiconductor manufacturing device prior to the contact of the obstacle with the object to be carried, thereby avoiding such contact. A structure is adopted in which obstacle detecting sensors which scan the raising and lowering path between a carriage and the load port of each semiconductor manufacturing apparatus, and which detect the presence of obstacles, are provided on the carriage with attached hoist.

摘要翻译： 本发明的目的在于提供一种架空行进式运载装置，其能够廉价地结合对象物，以便在将待运送物体降低到对象物上时，检测出诸如人或障碍物等障碍物的存在 在障碍物与待携带物体接触之前，半导体制造装置的负载端口，从而避免这种接触。 采用这样的结构，其中，在具有附带的起重机的滑架上设置有扫描每个半导体制造装置的托架和负载端口之间的升降路径并且检测障碍物的存在的障碍物检测传感器。

公开(公告)号：US20020190230A1

公开(公告)日：2002-12-19

申请号：US10144238

申请日：2002-05-10

申请人： Canadian Space Agency

发明人： Robert Dworkowski ,  Peter Wojcik

IPC分类号： G01V008/00 ,  G01N021/86

CPC分类号： B23K26/048 ,  B25J9/1694 ,  G01S17/46 ,  G05B2219/37423 ,  G05B2219/40562 ,  G05B2219/40623

摘要： A distance tracking control system, for use with a working member such as a robotic head, includes a non-contact distance sensor for sensing a distance of the working member from a surface. An actuator is provided for making positional adjustments of the working member in response to changes in the distance sensed by the non-contact distance sensor. A controller is connected to the distance sensor and the actuator. The controller receives data from the non-contact distance sensor and then sends signals to the actuator to make positional adjustments of the working member.

摘要翻译： 与诸如机器人头的工作构件一起使用的距离跟踪控制系统包括用于感测工作构件与表面的距离的非接触式距离传感器。 提供致动器，用于响应于由非接触式距离传感器感测到的距离的变化来对工作构件进行位置调整。 控制器连接到距离传感器和执行器。 控制器从非接触式距离传感器接收数据，然后向致动器发送信号，对工作部件进行位置调整。

公开(公告)号：US20020180961A1

公开(公告)日：2002-12-05

申请号：US09956850

申请日：2001-09-20

发明人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

IPC分类号： G01B011/30 ,  G01N021/86 ,  H01L021/66 ,  G01N021/00 ,  G01R031/26

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, an adhesion characteristic and a thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于粘附特性和厚度。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US20020162976A1

公开(公告)日：2002-11-07

申请号：US10098016

申请日：2002-03-13

发明人： Holger Birk ,  Johann Engelhardt

IPC分类号： G01N021/86

CPC分类号： G02B7/003

摘要： A device (70) is disclosed for adjusting a light beam (1) in an optical system (100), whereby the optical system (100) defines an optical axis (60). The device (70) for adjusting comprises means for coupling-in (3) of the light beam into a housing part (80) of the device (70). The means for coupling-in (3) determines a coupling-in point (3a) and a coupled in light beam (9). At a least first and a second photo detector (10, 22) are arranged in different in distances to the coupling-in point (3a). In the coupled in light beam (9) at least one beam splitter (36) is provided, which directs the coupled in light beam (9) on at least one of the photo detectors (10, 22).

摘要翻译： 公开了一种用于调整光学系统（100）中的光束（1）的装置（70），由此光学系统（100）限定光轴（60）。 用于调节的装置（70）包括用于将光束耦合入（3）入装置（70）的壳体部分（80）的装置。 用于耦合（3）的装置确定耦合入点（3a）和耦合在光束（9）中。 至少第一和第二光电检测器（10,22）被布置成与耦合入点（3a）不同的距离。 在耦合在光束（9）中，提供了至少一个分束器（36），其将耦合到光束（9）中的至少一个光电检测器（10,22）引导。

公开(公告)号：US20020158214A1

公开(公告)日：2002-10-31

申请号：US09860420

申请日：2001-05-18

发明人： Shun-Li Lin ,  Tsung-Hsien Wu

IPC分类号： G01N021/86

CPC分类号： G03F7/70441

摘要： An optical proximity correction method for producing a rectangular contact. The method includes representing the rectangular contact pattern required by an integrated circuit by a pair of connected hammerhead patterns and serif patterns at the inner straight corners of the hammerhead patterns. By varying the width of the connecting section of the hammerhead patterns, an optimal aspect ratio for the rectangular pattern is obtained.

摘要翻译： 一种用于产生矩形接触的光学邻近校正方法。 该方法包括通过在锤头图案的内直角处的一对连接的锤头图案和衬线图案来表示集成电路所需的矩形接触图案。 通过改变锤头图案的连接部分的宽度，获得矩形图案的最佳纵横比。