Optical device with low-loss thermally tunable closed-curve optical waveguide

    公开(公告)号:US11555964B1

    公开(公告)日:2023-01-17

    申请号:US17363846

    申请日:2021-06-30

    Abstract: Disclosed is a photonic structure and associated method. The structure includes a closed-curve waveguide having a first height, as measured from the top surface of an insulator layer, and an outer curved sidewall that extends essentially vertically the full first height (e.g., to minimize signal loss). The structure includes a closed-curve thermal coupler and a heating element. The closed-curve thermal coupler is thermally coupled to and laterally surrounded by the closed-curve waveguide and has a second height that is less than the first height. In some embodiments, the closed-curve waveguide and the closed-curve thermal coupler are continuous portions of the same semiconductor layer having different thicknesses. The heating element is thermally coupled to the closed-curve thermal coupler and thereby indirectly thermally coupled to the closed-curve waveguide. Thus, the heating element is usable for thermally tuning the closed-curve waveguide via the closed-curve thermal coupler to minimize any temperature-dependent resonance shift (TDRS).

    EDGE COUPLERS WITH METAMATERIAL RIB FEATURES

    公开(公告)号:US20230009597A1

    公开(公告)日:2023-01-12

    申请号:US17369253

    申请日:2021-07-07

    Inventor: Yusheng Bian

    Abstract: Structures for an edge coupler and methods of fabricating a structure for an edge coupler. A waveguide core includes a waveguide core section that has a first notched sidewall, a second notched sidewall, and an end surface connecting the first notched sidewall to the second notched sidewall. Segments are positioned with a spaced arrangement adjacent to the end surface of the waveguide core section, and a slab layer is adjoined to the segments, the first notched sidewall of the waveguide core section, the second notched sidewall of the waveguide core section, and the end surface of the waveguide core section. The segments and the waveguide core section have a first thickness, and the slab layer has a second thickness that is less than the first thickness.

    Waveguide crossings including a segmented waveguide section

    公开(公告)号:US11467341B2

    公开(公告)日:2022-10-11

    申请号:US17094105

    申请日:2020-11-10

    Inventor: Yusheng Bian

    Abstract: Structures with waveguide cores in multiple levels and methods of fabricating a structure that includes waveguide cores in multiple levels. The structure includes a first waveguide core and a second waveguide core positioned in a different level than the first waveguide core. The first waveguide core includes a longitudinal axis and a plurality of segments having a spaced arrangement along the longitudinal axis. The second waveguide core is aligned to extend across the plurality of segments of the first waveguide core.

    PHOTONICS INTEGRATED CIRCUIT WITH SILICON NITRIDE WAVEGUIDE EDGE COUPLER

    公开(公告)号:US20220268994A1

    公开(公告)日:2022-08-25

    申请号:US17179532

    申请日:2021-02-19

    Abstract: A photonics integrated circuit includes a semiconductor substrate; a buried insulator layer positioned over the semiconductor substrate; and a back-end-of-line (BEOL) insulator stack over a first portion of the buried insulator layer. In addition, the PIC includes a silicon nitride (SiN) waveguide edge coupler positioned in a first region over the buried insulator layer and at least partially under the BEOL insulator stack. An oxide layer extends over a side of the BEOL insulator stack. The SiN waveguide edge coupler provides better power handling and fabrication tolerance than silicon waveguide edge couplers, despite the location under various BEOL layers. The PIC can also include silicon waveguide edger coupler(s).

    Electro-optic modulators with stacked layers

    公开(公告)号:US11415821B2

    公开(公告)日:2022-08-16

    申请号:US16868631

    申请日:2020-05-07

    Abstract: Structures for an electro-optic modulator and methods of fabricating a structure for an electro-optic modulator. The electro-optic modulator has a layer stack arranged over a section of a waveguide core. The layer stack includes a first layer, a second layer, and a third layer. The first layer, the second layer, and the third layer are each composed of either copper or indium-tin oxide.

    Enlarged waveguide for photonic integrated circuit without impacting interconnect layers

    公开(公告)号:US11409037B2

    公开(公告)日:2022-08-09

    申请号:US17082291

    申请日:2020-10-28

    Abstract: Structures and methods implement an enlarged waveguide. The structure may include a semiconductor-on-insulator (SOI) substrate including a semiconductor-on-insulator (SOI) layer over a buried insulator layer over a semiconductor substrate. An inter-level dielectric (ILD) layer is over the SOI substrate. A first waveguide has a lower surface extending at least partially into the buried insulator layer, which allows vertical enlargement of the waveguide, without increasing the thickness of the ILD layer or increasing the length of interconnects to other devices. The enlarged waveguide may include nitride, and can be implemented with other conventional silicon and nitride waveguides.

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