Abstract:
An electron emission device comprises an electron emission electrode with a pointed end and a counter electrode positioned opposite to the pointed end, both formed by fine working of a conductive layer laminated on an insulating substrate.
Abstract:
An electron emitter plate (110) for an FED image display has an extraction (gate) electrode (22) spaced by an insulating layer (125) from a cathode electrode including a conductive mesh (18). Hexagonal close-packed arrays (12) of microtips (14) are located in mesh spacings (16), within apertures (26) formed in extraction electrode (22). Microtips (14) are formed on a conductive plate (17) laterally spaced from mesh structure (18) by a resistive layer (15). Insulating layer (125) is etched to connect apertures (26) and place microtips (14) in a common cavity within each mesh spacing (16).
Abstract:
A field emission type cold cathode device has a substrate whose upper surface is conductive, an insulating layer deposited on the conductive surface, a conductive gate layer, and a conical emitter electrode having a sharp apex formed in an opening in the insulating layer and the gate electrode. The insulating layer includes a first insulating film and a second insulating film. The insulating layer in the opening has an exposed surface arranged so that electrons emitted from near an end portion of the first insulating film are kept away from exposed surfaces of the insulating layer. In one form, the exposed surface of the first insulating film is disposed at a level lower than an unexposed surface of the first insulating film thus forming a recess. In another form, the second insulating film exposed in the opening is recessed relative to the first insulating film exposed in the opening.
Abstract:
A method for fabricating a micro-field emission gun including the steps of providing an insulator slab, formed with a penetrating hole acting as a passage of an electron beam, upon a gate electrode of the micro-field emission gun, such that the penetrating hole is aligned with an emitter of the micro-field gun, bonding an insulator slab upon the gate electrode by means of an anodic bonding process, and providing an acceleration electrode on the insulator slab such that the acceleration electrode covers a surface of said insulator slab facing away from said gate electrode, except for a passage of the electron beam.
Abstract:
Described are methods for making, and resultant structures of, a field emission display with soft luminescence and a comfortable image for a viewer of the display. The field emission display is formed with a baseplate and an opposing face plate. Field emission microtips are formed in openings in a conductive and insulating layer on the baseplate. An anode is formed on either the faceplate, or on the conductive layer surrounding each opening. Phosphorescent material is formed over the anode. A blocking layer is formed between the phosphor and the faceplate, such that during operation of the display direct light emission from the phosphor is blocked, resulting in indirect phosphorescence and a more comfortable display image. An optional reflective layer may be added over the conductive layer to increase phosphorescence.
Abstract:
An improved field emission device (200, 800) includes a supporting substrate (210, 810), a conductive layer (215, 815) formed on the supporting substrate (210,810), a dielectric layer (240, 840) formed on the conductive layer (215, 815) and defining an emitter well (260, 860), a charge bleed-off barrier (290, 890)provided on the lateral surfaces (245, 845) of the emitter well, an electron emitter (270, 870) located within the emitter well (260, 860), a gate extraction electrode (250, 850) formed on the dielectric layer (240, 840) and spaced from the electron emitter (270, 870), and an anode (280, 880) spaced from the gate extraction electrode (250, 850).
Abstract:
An electron emitter plate (110) for an FED image display has an extraction (gate) electrode (22) spaced by a dielectric insulating spacer (125) from a cathode electrode including a conductive mesh (18). Arrays (12) of microtips (14) are located in mesh spacings (16), within apertures (26) formed in clusters (23) in extraction electrode (22). Microtips (14) are deposited through the apertures (26). The insulating spacer (125) is etched to undercut electrode (22) to connect apertures, forming a common cavity (141) for microtips (14) within each mesh spacing (16). Support beam structures (143) are deposited onto extraction electrode (22), either separately or simultaneously with formation of the microtips (14). The support beam structures (143) span the cavity (141) to support the extraction electrode (22) above the cathode electrode over cavity (141). The etch-out reduces the dielectric constant factor of gate-to-cathode capacitance in the finished structure. Strengthening the gate (22) with structures (143) enables gate support over the cavity (141).
Abstract:
Holes are formed in a structure (116) by a technique in which a die (118) having openings (119) at desired locations for the holes is first placed over one side of the structure. Fluid pressure is applied to the other side of the structure to cause material to be sheared away from the structure at the desired hole locations, thereby forming the holes. A die (117) having openings (119) at the desired hole locations can also be placed over the side subjected to the fluid pressure to facilitate the hole-formation process. With two such die in place, fluid containing an abrasive material can be passed through unfinished holes to remove rough edges and finish the holes.
Abstract:
A conductive, light-absorbing baseplate for use in a field emission display is disclosed. The interior surface of the baseplate is coated with a praseodymium-manganese oxide layer having a resistivity that does not exceed 1.times.10.sup.5 .OMEGA..multidot.cm. A field emission display is also disclosed which comprises the conductive, light-absorbing baseplate, as well as processes for manufacturing the baseplate, field emission display and the conductive, light-absorbing praseodymium-manganese oxide material used to coat the baseplate.
Abstract:
A field emission cold cathode comprises a conductive substrate, an insulating layer formed on the substrate and having plural cavities each for receiving an emitter, a gate electrode for applying a high electric field to the tips of emitters. An annular portion of the gate electrode each defining an opening overlapping corresponding cavity is located at a distance from the substrate smaller than the distance between another portion of the gate electrode and the substrate. Parasitic capacitance between the gate electrode and the cold cathode including the substrate and the emitter is reduced due to the large distance between the another portion of the gate electrode and the substrate. Between the another portion and the substrate, a second insulating layer or a gap is disposed. The field emission is cold cathode can function in a high frequency range while fabricating conical emitters with a small height due to the small distance between the annular portions and the substrate.