公开(公告)号：US20070166936A1

公开(公告)日：2007-07-19

申请号：US11307008

申请日：2006-01-19

Applicant: Po-Chao Tsao ,  Yi-Yiing Chiang ,  Chang-Chi Huang ,  Hsin-Hui Hsu ,  Ming-Tsung Chen ,  Chien-Ting Lin

Inventor： Po-Chao Tsao ,  Yi-Yiing Chiang ,  Chang-Chi Huang ,  Hsin-Hui Hsu ,  Ming-Tsung Chen ,  Chien-Ting Lin

IPC: H01L21/336

CPC classification number: H01L21/26506 ,  H01L21/28518 ,  H01L21/823814 ,  H01L21/823835 ,  H01L29/665 ,  H01L29/6659

Abstract: A salicide process is described, wherein a substrate with an NMOS transistor and a PMOS transistor thereon is provided. A mask layer is formed over the substrate covering the PMOS transistor but exposing the NMOS transistor, and then a pre-amorphization implantation (PAI) step is conducted to the substrate using the mask layer as a mask. After the mask layer is removed, a salicide layer is formed on the NMOS transistor and the PMOS transistor.

Abstract translation: 描述了自对准硅化物工艺，其中提供了具有NMOS晶体管和PMOS晶体管的衬底。 在覆盖PMOS晶体管的衬底上形成掩模层，但暴露NMOS晶体管，然后使用掩模层作为掩模将前非晶化注入（PAI）步骤传导到衬底。 在去除掩模层之后，在NMOS晶体管和PMOS晶体管上形成自对准硅层。

公开(公告)号：US06294415B1

公开(公告)日：2001-09-25

申请号：US09558220

申请日：2000-04-26

Applicant: Hua-Chou Tseng ,  Chien-Ting Lin

Inventor： Hua-Chou Tseng ,  Chien-Ting Lin

IPC: H01L21336

CPC classification number: H01L29/6653 ,  H01L21/22 ,  H01L21/26506 ,  H01L29/665 ,  H01L29/6656 ,  H01L29/6659

Abstract: An improved method of fabricating a MOS transistor on a semiconductor wafer is disclosed. A pre-amorphization implant (PAI) process is used to dope the silicon substrate adjacent to the gate. The dopants formed in the silicon substrate during the first ion implantation process are driven into the substrate to form the HDD via a salicide process. A conventional annealing process is skipped in the present invention, which significantly reduces the thermal budget of the manufacturing process.

Abstract translation: 公开了一种在半导体晶片上制造MOS晶体管的改进方法。 使用预非晶化植入（PAI）工艺来掺杂与栅极相邻的硅衬底。 在第一离子注入工艺期间在硅衬底中形成的掺杂剂被驱动到衬底中，以通过自对准硅化物工艺形成HDD。 在本发明中跳过了传统的退火过程，这显着降低了制造过程的热预算。

公开(公告)号：US20230003251A1

公开(公告)日：2023-01-05

申请号：US17941460

申请日：2022-09-09

Applicant: CHIEN-TING LIN

Inventor： CHIEN-TING LIN

IPC: F16C11/10 ,  F16C11/06

Abstract: A ball head includes: a main body provided with ball body and fastener accommodating portions adjacent to each other in an up-and-down direction; a ball body provided with a threaded rod extending outward therefrom; and a fastener. The ball body and fastener accommodating portions are respectively formed with openings respectively extending upward and downward and having diameters respectively smaller than the diameters thereof, and communicated with an external space through a notch of the main body, wherein a fixing assembly is disposed at the notch. The notch can be expanded, such that the fastener and the ball body are respectively placed into the fastener and ball body accommodating portions. The notch can be further contracted by locking the fixing assembly tight and thus the ball body is non-rotatable, while the notch can also be expanded by loosening the fixing assembly and thus the ball body is rotatable.

公开(公告)号：US20220316693A1

公开(公告)日：2022-10-06

申请号：US17216779

申请日：2021-03-30

Applicant: CHIEN-TING LIN

Inventor： CHIEN-TING LIN

IPC: F21V29/77

Abstract: Provided is an LED lamp heat dissipation structure, including: a metal plate and an LED lamp substrate. The metal plate has a first predetermined shape portion, wherein a center of the metal plate is defined to have a second predetermined shape portion, an outer edge of the metal plate is formed to be a tapered portion with outward corrugations and with a center at the second predetermined shape portion, the tapered portion has a predetermined inclination angle with respect to the second predetermined shape portion, two surfaces of the second predetermined are defined as an inner surface and an outer surface, respectively, and the tapered portion surrounds the inner surface to define an inner space. The LED lamp substrate is closely attached to the inner surface. The heat generated from the LED lamp substrate can be efficiently transferred to an ambient air through the LED lamp heat dissipation structure.

公开(公告)号：US11415247B2

公开(公告)日：2022-08-16

申请号：US16184687

申请日：2018-11-08

Applicant: Chien-Ting Lin

Inventor： Chien-Ting Lin

IPC: F16L15/00 ,  F16B17/00 ,  F16B9/00 ,  F16L13/14 ,  F16L55/11 ,  F16B7/10

Abstract: An in-tube fixing assembly includes a primary tube having an inner space and an inner wall; a fixing member inserted into the inner space from an opened end of the primary tube and provided with at least one through hole at an appropriate position; and at least one screw member, a diameter of the screw member gradually decreasing from the operation end to the insertion end, wherein the screw member is inserted into the through hole in a direction from the opened end to the inner space of the primary tube, the insertion end of the screw member abuts against the inner wall of the primary tube to form a small recess thereon that are complementary to a shape of the screw member.

公开(公告)号：US10995897B2

公开(公告)日：2021-05-04

申请号：US16596970

申请日：2019-10-09

Applicant: Chien-Ting Lin

Inventor： Chien-Ting Lin

IPC: F16M11/04

Abstract: A composite stand stud includes a body portion, a screw and a tubular member. The body portion includes a support platform, a support body, and a connecting portion. A diameter of the support platform is larger than a diameter of the support body, and two ends of the support body are respectively connected to the support platform and the connecting portion. A diameter of the screw is smaller than a diameter of the support body, and one end of the screw is defined as an embedded end disposed in the connecting portion of the body portion, and the other end thereof is defined as a penetrating end penetrating from a center of the support platform to an outside of the body portion. The screw and the support platform are perpendicular to each other. The tubular member is wrapped around an outer edge of the support body.

公开(公告)号：USD897828S1

公开(公告)日：2020-10-06

申请号：US29647808

申请日：2018-05-16

Applicant: Chien-Ting Lin

Designer： Chien-Ting Lin

公开(公告)号：US09464650B2

公开(公告)日：2016-10-11

申请号：US14990521

申请日：2016-01-07

Applicant: Chien-Ting Lin

Inventor： Chien-Ting Lin

IPC: F16B7/14

CPC classification number: F16B7/1418

Abstract: A fastening device for mounting on a tube includes: a tubular sleeve member adapted to be sleeved around the tube, defining a reception space to snugly receiving the tube and a notch for access into the reception space and having an inner wall surface defining the reception space and formed with a press element; and a fixing element mounted on the sleeve member at the notch such that tightening of the fixing element relative to the sleeve member results in pressing of the press element against the tube to deform the tube to possess an outwardly minor protrusion for abutting against the fixing element, which creates an inwardly dented minor recess on its outer wall surface of the tube.

Abstract translation: 用于安装在管上的紧固装置包括：管状套筒构件，其适于围绕管套管，限定用于紧密地接收管的接收空间和用于进入接收空间的凹口，并具有限定接收空间的内壁表面 并形成有压力元件; 以及固定元件，其在凹口处安装在套筒构件上，使得固定元件相对于套筒构件的紧固导致压力元件压靠在管上以使管变形以具有用于抵靠固定元件的向外的小突起 ，其在其外壁表面上产生向内凹入的小凹部。

公开(公告)号：US09151472B2

公开(公告)日：2015-10-06

申请号：US14139788

申请日：2013-12-23

Applicant: Chien-Ting Lin

Inventor： Chien-Ting Lin

IPC: F21V1/06 ,  F21V15/01 ,  F21V7/22

CPC classification number: F21V15/01 ,  F21V7/16 ,  F21V7/22 ,  F21W2131/406

Abstract: A light cover capable of adjusting the amount of light emitted is provided in the present invention. The light cover includes a cloth, a supporting frame and a binding member. The supporting frame includes three/four intersecting elastic supporting rods. A light emitting opening and a triangular/square mounting portion are formed by assembling the cloth with the three/four intersecting elastic supporting rods. The binding member is assembled with both ends of each of the three/four elastic supporting rods. By tightening the binding member around the ends of the three/four elastic supporting rods, the three/four intersecting elastic supporting rods are bent into different curvatures, thereby adjusting the size of the light emitting opening.

Abstract translation: 本发明提供了能够调节发光量的灯罩。 灯罩包括布，支撑框架和装订构件。 支撑框架包括三个/四个相交的弹性支撑杆。 通过将布与三个/四个相交的弹性支撑棒组装来形成发光开口和三角/正方形安装部。 装订构件与三/四个弹性支撑杆中的每一个的两端组装。 通过在三/四个弹性支撑杆的端部周围紧固装订构件，将三个/四个相交的弹性支撑杆弯曲成不同的曲率，从而调节发光开口的尺寸。

公开(公告)号：US08877623B2

公开(公告)日：2014-11-04

申请号：US13471128

申请日：2012-05-14

Applicant: Shih-Hung Tsai ,  Ssu-I Fu ,  Ying-Tsung Chen ,  Chih-Wei Chen ,  Chien-Ting Lin ,  Wen-Tai Chiang

Inventor： Shih-Hung Tsai ,  Ssu-I Fu ,  Ying-Tsung Chen ,  Chih-Wei Chen ,  Chien-Ting Lin ,  Wen-Tai Chiang

IPC: H01L21/3205

CPC classification number: H01L29/6681 ,  H01L21/28088 ,  H01L21/28114 ,  H01L21/28194 ,  H01L21/28202 ,  H01L21/283 ,  H01L21/76224 ,  H01L29/513 ,  H01L29/517 ,  H01L29/66545 ,  H01L29/785

Abstract: A method of forming a semiconductor device is provided. A first interfacial material layer is formed by a deposition process on a substrate. A dummy gate material layer is formed on the first interfacial material layer. The dummy gate material layer and the first interfacial material layer are patterned to form a stacked structure. An interlayer dielectric (ILD) layer is formed to cover the stacked structure. A portion of the ILD layer is removed to expose a top of the stacked structure. The stacked structure is removed to form a trench in the ILD layer. A second interfacial layer and a first high-k layer are conformally formed at least on a surface of the trench. A composite metal layer is formed to at least fill up the trench.

Abstract translation: 提供一种形成半导体器件的方法。 通过在衬底上的沉积工艺形成第一界面材料层。 在第一界面材料层上形成虚拟栅极材料层。 将虚拟栅材料层和第一界面材料层图案化以形成堆叠结构。 形成层间电介质（ILD）层以覆盖层叠结构。 去除ILD层的一部分以露出堆叠结构的顶部。 去除层叠结构以在ILD层中形成沟槽。 至少在沟槽的表面上共形地形成第二界面层和第一高k层。 复合金属层形成为至少填充沟槽。