公开(公告)号：US06553657B2

公开(公告)日：2003-04-29

申请号：US10277872

申请日：2002-10-23

申请人： Yoshinori Miyaki ,  Hiromichi Suzuki

发明人： Yoshinori Miyaki ,  Hiromichi Suzuki

IPC分类号： H01R4300

CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49121 ,  Y10T29/49146 ,  Y10T29/49171 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： In order to suppress defective lead forming and defective mounting, a semiconductor device comprises a sealing body which has a square planar shape, a semiconductor chip which lies within the sealing body, and a plurality of leads which are electrically connected with electrodes of the semiconductor chip, which extend inside and outside the sealing body and which are arrayed along latera of the sealing body, wherein an outer lead portion of each of the leads is such that a root part which protrudes out of the sealing body is formed at a lead width being equal to or greater than a lead thickness, and that a mounting part which joins to the root part through an intermediate part is formed at a lead width being less than the lead thickness.

摘要翻译： 为了抑制铅的形成不良和安装不良，半导体装置包括具有正方形平面形状的密封体，位于密封体内的半导体芯片，以及与半导体芯片的电极电连接的多个引线 其在密封体的内部和外部延伸并且沿着密封体的后端排列，其中每个引线的外引线部分使得从引线宽度形成从密封体突出的根部， 等于或大于引线厚度，并且通过中间部分连接到根部的安装部分形成为小于引线厚度的引线宽度。

公开(公告)号：US5637914A

公开(公告)日：1997-06-10

申请号：US438467

申请日：1995-05-10

申请人： Naotaka Tanaka ,  Akihiro Yaguchi ,  Makoto Kitano ,  Tatsuya Nagata ,  Tetsuo Kumazawa ,  Atsushi Nakamura ,  Hiromichi Suzuki ,  Masayoshi Tsugane

发明人： Naotaka Tanaka ,  Akihiro Yaguchi ,  Makoto Kitano ,  Tatsuya Nagata ,  Tetsuo Kumazawa ,  Atsushi Nakamura ,  Hiromichi Suzuki ,  Masayoshi Tsugane

IPC分类号： H01L21/56 ,  H01L23/495

CPC分类号： H01L23/49558 ,  H01L21/565 ,  H01L23/49541 ,  H01L23/49548 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/181

摘要： A lead frame for use with a plastic encapsulated semiconductor device includes a tab on which the semiconductor chip is mounted, chip pad supporting leads, inner leads to be electrically coupled with the semiconductor chip, outer leads formed in a monoblock structure together with the inner leads, and a frame for supporting the chip pad supporting leads and outer leads. In the lead frame, there is disposed a dam member only between the outer leads. Alternatively, dummy outer leads are formed between the frame and leads adjacent thereto so as to connect the dummy leads to the outer leads by the dam member. The frame is removed after the semiconductor device is assembled.

摘要翻译： 与塑料封装的半导体器件一起使用的引线框架包括其上安装有半导体芯片的突片，芯片焊盘支撑引线，与半导体芯片电耦合的内部引线，与内部引线一起形成为整体结构的外部引线 以及用于支撑芯片焊盘支撑引线和外引线的框架。 在引线框架中，仅在外引线之间设置阻挡构件。 或者，在框架和与其相邻的导线之间形成虚设外引线，以便通过坝构件将虚拟引线连接到外引线。 在组装半导体器件之后移除框架。

公开(公告)号：US5250839A

公开(公告)日：1993-10-05

申请号：US765146

申请日：1991-09-25

申请人： Kazunori Katoh ,  Yuji Yamaguchi ,  Hiromichi Suzuki ,  Takayuki Okinaga ,  Takashi Emata ,  Osamu Horiuchi

发明人： Kazunori Katoh ,  Yuji Yamaguchi ,  Hiromichi Suzuki ,  Takayuki Okinaga ,  Takashi Emata ,  Osamu Horiuchi

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/50

CPC分类号： H01L23/49544 ,  H01L23/49527 ,  H01L23/49534 ,  H01L23/49558 ,  H01L2924/0002

摘要： A multi-layer leadframe according to this invention is formed by laminating on a leadframe body an insulating layer and an electrically conductive layer in this order. The electrically conductive plate includes a planar portion and a given number of terminal portions extending therefrom, said planar portion extending across said insulating layer laminated on said leadframe body. The planar portion is made thinner than the terminal portions. A thin portion of this planar portion is formed by an etching technique, and at least a part of the terminal portions of the electrically conductive plate is fixedly connected with an inner lead of the leadframe body.

摘要翻译： 根据本发明的多层引线框架依次层压在引线框体上绝缘层和导电层。 导电板包括平面部分和从其延伸的给定数量的端子部分，所述平面部分延伸穿过层压在所述引线框体上的所述绝缘层。 平面部分比端子部分薄。 通过蚀刻技术形成该平面部分的一部分，并且导电板的端子部分的至少一部分与引线框体的内引线固定连接。

公开(公告)号：US5032895A

公开(公告)日：1991-07-16

申请号：US510844

申请日：1990-04-18

申请人： Osamu Horiuchi ,  Gen Murakami ,  Hiromichi Suzuki ,  Hajime Hasebe ,  Kanji Otsuka ,  Yuuji Shirai ,  Takayuki Okinaga ,  Takashi Emata

发明人： Osamu Horiuchi ,  Gen Murakami ,  Hiromichi Suzuki ,  Hajime Hasebe ,  Kanji Otsuka ,  Yuuji Shirai ,  Takayuki Okinaga ,  Takashi Emata

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L23/498

CPC分类号： H01L23/49527 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49861 ,  H01L24/49 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107

摘要： A semiconductor device comprising the fact that a semiconductor pellet is arranged on a substantially central part of a film base in which a metal plate is overlaid with an insulating member, while inner leads are arranged on a peripheral part of the film base in a state in which they are electrically isolated from the metal plate of the film base, and that external terminals for a power source among external terminals of the semiconductor pellet and middle parts of the metal plate of the film base, and inner leads for the power source among the inner leads and peripheral parts of the metal plate are electrically connected by pieces of bonding wire, respectively.

摘要翻译： 一种半导体器件，包括半导体芯片布置在薄膜基座的大致中央部分，其中金属板覆盖有绝缘构件，而内部引线以薄膜基底的周边部分布置在 它们与膜基底的金属板电隔离，并且在半导体芯片的外部端子和膜基底的金属板的中间部分之间的电源的外部端子和用于电源的内部引线 金属板的内部引线和外围部分分别通过接合线电连接。

公开(公告)号：US08768420B2

公开(公告)日：2014-07-01

申请号：US12206913

申请日：2008-09-09

申请人： Hiromichi Suzuki ,  Isao Ohba

发明人： Hiromichi Suzuki ,  Isao Ohba

IPC分类号： H04W88/02

CPC分类号： H04M1/0212 ,  H01Q1/243 ,  H04M1/0222

摘要： A mobile terminal includes a first antenna configured to receive power from the first circuit board housed in the first housing, a second antenna configured to receive power from the second circuit board housed in the second housing, a first signal cable configured to electrically connect the first circuit board to the second circuit board and transmit a signal between the first circuit board and the second circuit board, and a second signal cable configured to electrically connect the first circuit board to the second circuit board and bypasses a board current flowing through the first signal cable from the first circuit board to the second antenna during operation of the second antenna.

摘要翻译： 移动终端包括被配置为从容纳在第一壳体中的第一电路板接收电力的第一天线，被配置为从容纳在第二壳体中的第二电路板接收电力的第二天线，被配置为将第一天线 电路板连接到第二电路板并且在第一电路板和第二电路板之间传输信号，以及第二信号电缆，其被配置为将第一电路板电连接到第二电路板并绕过流过第一信号的电路板电流 在第二天线的操作期间从第一电路板到第二天线的电缆。

公开(公告)号：US08450556B2

公开(公告)日：2013-05-28

申请号：US12675500

申请日：2008-04-30

申请人： Takanobu Miyamoto ,  Takeshi Miyamura ,  Taeko Kanai ,  Aya Yoshimoto ,  Soichi Fujita ,  Hiromichi Suzuki ,  Wataru Saka ,  Shinobu Takei

发明人： Takanobu Miyamoto ,  Takeshi Miyamura ,  Taeko Kanai ,  Aya Yoshimoto ,  Soichi Fujita ,  Hiromichi Suzuki ,  Wataru Saka ,  Shinobu Takei

IPC分类号： A61F13/20

CPC分类号： B32B3/30 ,  A61F13/51104 ,  A61F13/51305 ,  B32B3/26 ,  B32B5/024 ,  B32B5/26 ,  B32B7/02 ,  B32B2262/0253 ,  B32B2262/0276 ,  B32B2262/12 ,  B32B2307/72 ,  B32B2307/726 ,  B32B2307/7265 ,  B32B2555/02 ,  D04H1/559 ,  D04H1/76 ,  Y10T428/24562 ,  Y10T428/24603

摘要： A shaped sheet, comprising: a plurality of protrusions (3) on one surface side of the shaped sheet formed of fibers; and connecting portions (5) for being barriers and connecting the protrusions (3) to one another, wherein the connecting portion (5) has a fiber density higher than a fiber density of the protrusion (3).

摘要翻译： 一种成形片，包括：在由纤维形成的成形片的一个表面侧上的多个突起（3） 和连接部分（5），用于阻挡并将突起（3）彼此连接，其中连接部分（5）的纤维密度高于突起（3）的纤维密度。

公开(公告)号：US07785986B2

公开(公告)日：2010-08-31

申请号：US12400892

申请日：2009-03-10

申请人： Yoshihisa Matsubara ,  Hiromichi Suzuki ,  Wahei Kitamura ,  Kosho Akiyama ,  Seiji Kato

发明人： Yoshihisa Matsubara ,  Hiromichi Suzuki ,  Wahei Kitamura ,  Kosho Akiyama ,  Seiji Kato

IPC分类号： H01L21/30 ,  H01L23/34

CPC分类号： H01L21/67333 ,  H01L2924/0002 ,  H01L2924/00

摘要： To prevent semiconductor chips from adhering to the trays during transport, a method is employed which transports semiconductor chips in the following state. When trays provided with a plurality of accommodating portions having a recessed cross section for accommodating semiconductor chips on a main surface thereof are stacked in a plurality of stages, the semiconductor chips are accommodated in spaces defined by the accommodating portions formed over the main surface of the lower-stage tray and corresponding accommodating portions formed over the back surface of the upper-stage tray. Here, on bottom surfaces of the accommodating portions formed over the back surface of the upper-stage tray, isolated projections having a height which prevents the projections from coming into contact with the semiconductor chips are arranged in a scattered manner. In this way, it is possible to prevent the semiconductor chips from adhering to the back surface of the upper-stage tray.

摘要翻译： 为了防止半导体芯片在运输期间粘附到托盘，采用以下状态传输半导体芯片的方法。 当具有多个具有用于在其主表面上容纳半导体芯片的凹入截面的容纳部分的托盘被堆叠成多级时，半导体芯片被容纳在形成在主表面上的容纳部分所形成的空间中 下级托盘和形成在上级托盘的后表面上的相应的容纳部分。 这里，在形成在上层托盘的后表面上的容纳部分的底表面上，以散射方式布置具有防止突起与半导体芯片接触的高度的隔离突起。 以这种方式，可以防止半导体芯片粘附到上层托盘的后表面。

公开(公告)号：US07701401B2

公开(公告)日：2010-04-20

申请号：US11975332

申请日：2007-10-18

申请人： Hiromichi Suzuki ,  Satoshi Mizoguchi ,  Isao Ohba

发明人： Hiromichi Suzuki ,  Satoshi Mizoguchi ,  Isao Ohba

IPC分类号： H01Q1/24

CPC分类号： H01Q7/00 ,  H01Q1/242 ,  H01Q5/371 ,  H01Q5/40 ,  H01Q9/42 ,  H01Q21/28

摘要： An antenna device provided in a radio apparatus having a printed circuit board includes a first antenna element and a second antenna element. The first antenna element is configured to be fed and grounded at a first feed portion and at a first short-circuit portion both on the printed circuit board, respectively. The second antenna element is configured to be fed and grounded at a second feed portion and at a second short-circuit portion both on the printed circuit board, respectively. The second feed portion is located farther from the first feed portion than from the first short-circuit portion, farther than the first short-circuit portion is from the first feed portion, farther from the first short-circuit portion than from the second short-circuit portion, and farther than the second short-circuit portion is from the first short-circuit portion.

摘要翻译： 设置在具有印刷电路板的无线电设备中的天线装置包括第一天线元件和第二天线元件。 第一天线元件被配置为分别在印刷电路板上的第一馈电部分和第一短路部分馈电和接地。 第二天线元件被配置为分别在印刷电路板上的第二馈电部分和第二短路部分馈电和接地。 第二馈电部分比第一短路部分远离第一短路部分，远离第一短路部分比第一短路部分远离第一短路部分远离第一短路部分， 电路部分，并且比第二短路部分更远离第一短路部分。

公开(公告)号：US20100051700A1

公开(公告)日：2010-03-04

申请号：US12356690

申请日：2009-01-21

申请人： Takashi MINEMURA ,  Hiroshi WATANABE ,  Akihiro TSUJIMURA ,  Hiromichi SUZUKI

发明人： Takashi MINEMURA ,  Hiroshi WATANABE ,  Akihiro TSUJIMURA ,  Hiromichi SUZUKI

IPC分类号： G06K19/06

CPC分类号： G06K19/07749 ,  H01Q1/2216

摘要： A radio apparatus configured to perform contactless communication with an external device having a first antenna, upon being arranged opposite the external device, is provided. The radio apparatus includes a case, a second antenna and a conductive element. The case has an outer face arranged opposite the external device upon the radio apparatus being arranged opposite the external device. The second antenna is provided in the case, and at least partially arranged parallel to the outer face. The conductive element is arranged close to and electrically coupled with the first antenna, upon the case being positioned opposite the external device so that the contactless communication may be performed.

摘要翻译： 一种无线电设备，被配置为在与外部设备相对布置时，与具有第一天线的外部设备进行非接触式通信。 无线电设备包括壳体，第二天线和导电元件。 在无线电设备被布置成与外部设备相对的情况下，壳体具有与外部设备相对的外表面。 第二天线设置在壳体中，并且至少部分地平行于外表面布置。 当壳体与外部设备相对定位时，导电元件被布置成靠近并与第一天线电耦合，使得可以执行非接触通信。

公开(公告)号：US07554497B2

公开(公告)日：2009-06-30

申请号：US11900219

申请日：2007-09-11

申请人： Isao Ohba ,  Hiromichi Suzuki

发明人： Isao Ohba ,  Hiromichi Suzuki

IPC分类号： H01Q1/24 ,  H01Q1/38

CPC分类号： H01Q1/243 ,  H01Q21/28 ,  H01Q21/29 ,  H04B7/0814

摘要： According to an aspect of the invention, there is provided an antenna device housed within a wireless device, including: a first case and a second case at least partly overlapping with each other, the first and second cases electrically connected with each other and slidable to open and close the antenna device; a first board housed within the first case; a second board housed within the second case; a first unbalanced antenna element connected to a first feeding point located in a vicinity of a first edge departing from the second case among edges of the first board when the first case and the second case are slid in a direction to open the wireless device; and a second unbalanced antenna element being connected to a second feeding point located in a vicinity of a second edge substantially perpendicular to the first edge among edges of the second board.

摘要翻译： 根据本发明的一个方面，提供了一种容纳在无线设备内的天线装置，包括：第一壳体和至少部分地彼此重叠的第二壳体，第一壳体和第二壳体彼此电连接并可滑动到 打开和关闭天线设备; 在第一种情况下容纳的第一板; 第二个板容纳在第二个壳体内; 第一不平衡天线元件，当第一壳体和第二壳体沿打开无线装置的方向滑动时，连接到位于第一边缘附近的第一边缘附近的第一不平衡天线元件; 以及第二不平衡天线元件，其连接到位于所述第二板的边缘之间的与所述第一边缘基本垂直的第二边缘附近的第二馈电点。