公开(公告)号：US5837567A

公开(公告)日：1998-11-17

申请号：US829230

申请日：1997-03-31

申请人： Naotaka Tanaka ,  Akihiro Yaguchi ,  Makoto Kitano ,  Tatsuya Nagata ,  Tetsuo Kumazawa ,  Atsushi Nakamura ,  Hiromichi Suzuki ,  Masayoshi Tsugane

发明人： Naotaka Tanaka ,  Akihiro Yaguchi ,  Makoto Kitano ,  Tatsuya Nagata ,  Tetsuo Kumazawa ,  Atsushi Nakamura ,  Hiromichi Suzuki ,  Masayoshi Tsugane

IPC分类号： H01L21/56 ,  H01L23/495 ,  H01L21/44

CPC分类号： H01L23/49558 ,  H01L21/565 ,  H01L23/49541 ,  H01L23/49548 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/181

摘要： A lead frame for use with a plastic encapsulated semiconductor device includes a tab on which the semiconductor chip is mounted, chip pad supporting leads, inner leads to be electrically coupled with the semiconductor chip, outer leads formed in a monoblock structure together with the inner leads, and a frame for supporting the chip pad supporting leads and outer leads. In the lead frame, there is disposed a dam member only between the outer leads. Alternatively, dummy outer leads are formed between the frame and leads adjacent thereto so as to connect the dummy leads to the outer leads by the dam member. The frame is removed after the semiconductor device is assembled.

摘要翻译： 与塑料封装的半导体器件一起使用的引线框架包括其上安装有半导体芯片的突片，芯片焊盘支撑引线，与半导体芯片电耦合的内部引线，与内部引线一起形成为整体结构的外部引线 以及用于支撑芯片焊盘支撑引线和外引线的框架。 在引线框架中，仅在外引线之间设置阻挡构件。 或者，在框架和与其相邻的导线之间形成虚设外引线，以便通过坝构件将虚拟引线连接到外引线。 在组装半导体器件之后移除框架。

公开(公告)号：US5637914A

公开(公告)日：1997-06-10

申请号：US438467

申请日：1995-05-10

申请人： Naotaka Tanaka ,  Akihiro Yaguchi ,  Makoto Kitano ,  Tatsuya Nagata ,  Tetsuo Kumazawa ,  Atsushi Nakamura ,  Hiromichi Suzuki ,  Masayoshi Tsugane

发明人： Naotaka Tanaka ,  Akihiro Yaguchi ,  Makoto Kitano ,  Tatsuya Nagata ,  Tetsuo Kumazawa ,  Atsushi Nakamura ,  Hiromichi Suzuki ,  Masayoshi Tsugane

IPC分类号： H01L21/56 ,  H01L23/495

CPC分类号： H01L23/49558 ,  H01L21/565 ,  H01L23/49541 ,  H01L23/49548 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/181

摘要： A lead frame for use with a plastic encapsulated semiconductor device includes a tab on which the semiconductor chip is mounted, chip pad supporting leads, inner leads to be electrically coupled with the semiconductor chip, outer leads formed in a monoblock structure together with the inner leads, and a frame for supporting the chip pad supporting leads and outer leads. In the lead frame, there is disposed a dam member only between the outer leads. Alternatively, dummy outer leads are formed between the frame and leads adjacent thereto so as to connect the dummy leads to the outer leads by the dam member. The frame is removed after the semiconductor device is assembled.

摘要翻译： 与塑料封装的半导体器件一起使用的引线框架包括其上安装有半导体芯片的突片，芯片焊盘支撑引线，与半导体芯片电耦合的内部引线，与内部引线一起形成为整体结构的外部引线 以及用于支撑芯片焊盘支撑引线和外引线的框架。 在引线框架中，仅在外引线之间设置阻挡构件。 或者，在框架和与其相邻的导线之间形成虚设外引线，以便通过坝构件将虚拟引线连接到外引线。 在组装半导体器件之后移除框架。

公开(公告)号：US20120318231A1

公开(公告)日：2012-12-20

申请号：US13162301

申请日：2011-06-16

申请人： Hiromichi Suzuki

发明人： Hiromichi Suzuki

IPC分类号： F02B67/04 ,  F16H57/08

CPC分类号： F16H55/36 ,  B60K6/00

摘要： A system that automatically stops an engine when the vehicle is stopped and restarts the engine in response to a predetermined condition is disclosed. The system may generally include an engine and a motor for restarting the engine and driving an auxiliary machine when the engine is stopped, and an electrical power source for supplying electrical power to the motor. The motor may be disposed within a crank pulley housing and configured to be connected to a crankshaft. The motor may restart the engine in response to a predetermined condition. The system may include a gear reduction system for amplifying the torque provided by the motor. The motor may drive an auxiliary machine when the engine is stopped. The engine may drive the auxiliary machine when the engine is operating in drive.

摘要翻译： 公开了一种在车辆停止时自动停止发动机并且响应于预定条件重新启动发动机的系统。 该系统通常可以包括用于在发动机停止时重新启动发动机和驱动辅助机器的发动机和马达，以及用于向马达供电的电源。 电动机可以设置在曲柄皮带轮壳体内并且被配置为连接到曲轴。 电机可以响应于预定条件重新启动发动机。 该系统可以包括用于放大由电动机提供的扭矩的齿轮减速系统。 发动机停止时，电机可能会驱动辅机。 当发动机在驱动器中运行时，发动机可以驱动辅助机器。

公开(公告)号：US20120283532A1

公开(公告)日：2012-11-08

申请号：US13509698

申请日：2010-11-11

申请人： Hiromichi Suzuki

发明人： Hiromichi Suzuki

IPC分类号： A61B5/1455 ,  G08B21/18

CPC分类号： A61B5/1455 ,  A61B2560/0276

摘要： Disclosed is a biological optical measurement instrument provided with: a light source unit which has a light-emitting unit that emits light and irradiates the light to an object; a light measurement unit configured to measure passing light at a measurement point of the object: a signal processing unit configured to process hemoglobin information outputted from the light measurement unit and create a light measurement image; and a display unit configured to display the light measurement image, further provided with a measurement/determination unit configured to measure the deterioration state of the light-emitting unit from the light output of the light-emitting unit and an electric current injected into the light-emitting unit and determine the necessity/unnecessity of replacement of the light-emitting unit, wherein the display unit displays information relating to the necessity/unnecessity of replacing the light-emitting unit determined by the measurement/determination unit.

摘要翻译： 本发明公开了一种生物光学测量仪器，其具备：光源单元，其具有发光并将光照射到物体的发光单元; 光测量单元，被配置为测量物体的测量点处的通过光;信号处理单元，被配置为处理从所述光测量单元输出的血红蛋白信息并创建光测量图像; 以及显示单元，被配置为显示所述光测量图像，还具有测量/确定单元，所述测量/确定单元被配置为从所述发光单元的光输出测量所述发光单元的劣化状态和注入到所述光中的电流 确定更换发光单元的必要性/不必要性，其中显示单元显示与由测量/确定单元确定的发光单元的更换的必要性/不必要性有关的信息。

公开(公告)号：US20120175759A1

公开(公告)日：2012-07-12

申请号：US13403616

申请日：2012-02-23

申请人： Susumu Baba ,  Masachika Masuda ,  Hiromichi Suzuki

发明人： Susumu Baba ,  Masachika Masuda ,  Hiromichi Suzuki

IPC分类号： H01L23/495

CPC分类号： H01L23/485 ,  H01L23/36 ,  H01L23/4827 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.

摘要翻译： 本发明提供一种半导体装置用布线装置，半导体装置用复合布线装置以及树脂密封型半导体装置，其能够搭载比常规芯片小的半导体芯片，并以低成本制造。 布线装置将半导体芯片上的电极与外部布线装置连接，并且具有绝缘层，金属基板和铜布线层。 布线装置具有相对于绝缘层设置在铜布线层一侧的半导体芯片支撑部。 铜布线层包括第一端子，第二端子和布线部分。 第一端子与电极连接。 第二端子与外部接线装置连接。 布线部将第一端子与第二端子连接。

公开(公告)号：US20090189263A1

公开(公告)日：2009-07-30

申请号：US12318955

申请日：2009-01-13

申请人： Susumu Baba ,  Masachika Masuda ,  Hiromichi Suzuki

发明人： Susumu Baba ,  Masachika Masuda ,  Hiromichi Suzuki

IPC分类号： H01L23/52 ,  H01L23/498

CPC分类号： H01L23/485 ,  H01L23/36 ,  H01L23/4827 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device electrically connects an electrode provided on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The metal substrate is provided on one side of the insulating layer. The copper wiring layer is provided on another side of the insulating layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode provided on the semiconductor chip. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.

摘要翻译： 本发明提供一种半导体装置用布线装置，半导体装置用复合布线装置以及树脂密封型半导体装置，其能够搭载比常规芯片小的半导体芯片，并以低成本制造。 布线装置将设置在半导体芯片上的电极与外部布线装置电连接，并且具有绝缘层，金属基板和铜布线层。 金属基板设置在绝缘层的一侧。 铜布线层设置在绝缘层的另一侧。 布线装置具有相对于绝缘层设置在铜布线层一侧的半导体芯片支撑部。 铜布线层包括第一端子，第二端子和布线部分。 第一端子与设置在半导体芯片上的电极连接。 第二端子与外部接线装置连接。 布线部将第一端子与第二端子连接。

公开(公告)号：US20090176333A1

公开(公告)日：2009-07-09

申请号：US12400892

申请日：2009-03-10

申请人： Yoshihisa MATSUBARA ,  Hiromichi Suzuki ,  Wahei Kitamura ,  Kosho Akiyama ,  Seiji Kato

发明人： Yoshihisa MATSUBARA ,  Hiromichi Suzuki ,  Wahei Kitamura ,  Kosho Akiyama ,  Seiji Kato

IPC分类号： H01L21/78 ,  H01L21/60

CPC分类号： H01L21/67333 ,  H01L2924/0002 ,  H01L2924/00

摘要： To prevent semiconductor chips from adhering to the trays during transport, a method is employed which transports semiconductor chips in the following state. When trays provided with a plurality of accommodating portions having a recessed cross section for accommodating semiconductor chips on a main surface thereof are stacked in a plurality of stages, the semiconductor chips are accommodated in spaces defined by the accommodating portions formed over the main surface of the lower-stage tray and corresponding accommodating portions formed over the back surface of the upper-stage tray. Here, on bottom surfaces of the accommodating portions formed over the back surface of the upper-stage tray, isolated projections having a height which prevents the projections from coming into contact with the semiconductor chips are arranged in a scattered manner. In this way, it is possible to prevent the semiconductor chips from adhering to the back surface of the upper-stage tray.

摘要翻译： 为了防止半导体芯片在运输期间粘附到托盘，采用以下状态传输半导体芯片的方法。 当具有多个具有用于在其主表面上容纳半导体芯片的凹入截面的容纳部分的托盘被堆叠成多级时，半导体芯片被容纳在形成在主表面上的容纳部分所形成的空间中 下级托盘和形成在上级托盘的后表面上的相应的容纳部分。 这里，在形成在上层托盘的后表面上的容纳部分的底表面上，以散射方式布置具有防止突起与半导体芯片接触的高度的隔离突起。 以这种方式，可以防止半导体芯片粘附到上层托盘的后表面。

公开(公告)号：US20090009401A1

公开(公告)日：2009-01-08

申请号：US11975332

申请日：2007-10-18

申请人： Hiromichi Suzuki ,  Satoshi Mizoguchi ,  Isao Ohba

发明人： Hiromichi Suzuki ,  Satoshi Mizoguchi ,  Isao Ohba

IPC分类号： H01Q9/04

CPC分类号： H01Q7/00 ,  H01Q1/242 ,  H01Q5/371 ,  H01Q5/40 ,  H01Q9/42 ,  H01Q21/28

摘要： An antenna device provided in a radio apparatus having a printed circuit board includes a first antenna element and a second antenna element. The first antenna element is configured to be fed and grounded at a first feed portion and at a first short-circuit portion both on the printed circuit board, respectively. The second antenna element is configured to be fed and grounded at a second feed portion and at a second short-circuit portion both on the printed circuit board, respectively. The second feed portion is located farther from the first feed portion than from the first short-circuit portion, farther than the first short-circuit portion is from the first feed portion, farther from the first short-circuit portion than from the second short-circuit portion, and farther than the second short-circuit portion is from the first short-circuit portion.

摘要翻译： 设置在具有印刷电路板的无线电设备中的天线装置包括第一天线元件和第二天线元件。 第一天线元件被配置为分别在印刷电路板上的第一馈电部分和第一短路部分馈电和接地。 第二天线元件被配置为分别在印刷电路板上的第二馈电部分和第二短路部分馈电和接地。 第二馈电部分比第一短路部分远离第一短路部分，远离第一短路部分比第一短路部分远离第一短路部分远离第一短路部分， 电路部分，并且比第二短路部分更远离第一短路部分。

公开(公告)号：US20080311703A1

公开(公告)日：2008-12-18

申请号：US12194001

申请日：2008-08-19

申请人： Fujio Ito ,  Hiromichi Suzuki ,  Toshio Sasaki

发明人： Fujio Ito ,  Hiromichi Suzuki ,  Toshio Sasaki

IPC分类号： H01L21/82

CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L23/49558 ,  H01L2924/0002 ,  H01L2924/00

摘要： A plurality of inner leads, a plurality of outer leads formed in one with each of the inner lead, a bar lead of the square ring shape arranged inside a plurality of inner leads, a corner part lead which has been arranged between the inner leads of the end portion of the inner lead groups which adjoin among four inner lead groups corresponding to each side of the bar lead, and was connected with the bar lead, and a tape member joined to the tip part of each inner lead, a bar lead, and a corner part lead are included. Since the corner part lead is formed as an object for reinforcement of a frame body between adjoining inner lead groups, the rigidity of the lead frame can be increased.

摘要翻译： 多个内部引线，多个外部引线，每个外部引线与内部引线中的每一个形成一个，方形环形状的引脚布置在多个内部引线内;角部引线，其设置在内部引线之间 所述内引线组的与所述棒引线的每一侧相对应的四个内引线组中相邻的所述内引线组的端部与所述引线连接，以及与所述内引线的前端接合的带部件， 并包括角落部分铅。 由于角部引线形成为在相邻的内引线组之间加强框架体的对象，所以可以提高引线框架的刚性。

公开(公告)号：US07456795B2

公开(公告)日：2008-11-25

申请号：US11819634

申请日：2007-06-28

申请人： Norimichi Chiba ,  Hiromichi Suzuki

发明人： Norimichi Chiba ,  Hiromichi Suzuki

IPC分类号： H01Q1/24

CPC分类号： H01Q1/245 ,  H01Q1/244

摘要： A metal plate in the form of a strip, bent into a bracket shape, is provided on the surface of a circuit board opposite to the surface of the board facing a human body. The proximal end of the metal plate is connected to a ground pattern provided on the circuit board, close to an antenna power supply point, with the longitudinal direction of the plate adjusted parallel to the main polarization direction of an antenna element.

摘要翻译： 在与电路板的面向人体的表面相对的电路板的表面上设置弯曲成支架形状的带状金属板。 金属板的近端连接到设置在电路板上的接地图案，靠近天线电源点，平板的纵向方向平行于天线元件的主极化方向。