公开(公告)号：US09263374B2

公开(公告)日：2016-02-16

申请号：US13230128

申请日：2011-09-12

申请人： Masachika Masuda ,  Koji Tomita ,  Tadashi Okamoto ,  Yasunori Tanaka ,  Hiroshi Ohsawa ,  Kazuyuki Miyano ,  Atsushi Kurahashi ,  Hiromichi Suzuki

发明人： Masachika Masuda ,  Koji Tomita ,  Tadashi Okamoto ,  Yasunori Tanaka ,  Hiroshi Ohsawa ,  Kazuyuki Miyano ,  Atsushi Kurahashi ,  Hiromichi Suzuki

IPC分类号： H01L29/72 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/36 ,  H01L25/10 ,  H01L23/00

CPC分类号： H01L23/49548 ,  H01L21/4832 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49503 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/105 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48639 ,  H01L2224/48664 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/834 ,  H01L2224/85005 ,  H01L2224/85439 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01026

摘要： A semiconductor device includes, a lead frame having a die pad and a plurality of leads each disposed around the die pad, a semiconductor element rested on the die pad of the lead frame, and bonding wires for electrically interconnecting the lead of the lead frame and the semiconductor element. The lead frame, the semiconductor element, and the bonding wires are sealed with a sealing resin section. The sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region. Thickness of the central region is greater than that of the marginal region.

摘要翻译： 一种半导体器件包括：具有管芯焊盘的引线框架和设置在管芯焊盘周围的多个引线;保持在引线框架的管芯焊盘上的半导体元件和用于将引线框架的引线电连接的接合线和 半导体元件。 引线框架，半导体元件和接合线用密封树脂部分密封。 密封树脂部分包括设置在半导体器件上方和周围的中心区域和设置在中心区域周边的边缘区域。 中部地区的厚度大于边缘地区的厚度。

公开(公告)号：US20130211218A1

公开(公告)日：2013-08-15

申请号：US13880744

申请日：2011-11-02

申请人： Hiromichi Suzuki

发明人： Hiromichi Suzuki

IPC分类号： A61B5/1455

CPC分类号： A61B5/14552 ,  A61B5/14546 ,  A61B5/1455 ,  A61B2560/0252 ,  A61B2560/0437 ,  G01J3/10 ,  G01J3/28 ,  G01J3/42 ,  G01N21/359 ,  G01N2021/3133 ,  G01N2021/3144 ,  G01N2021/3155

摘要： A biological optical measurement instrument includes a single temperature sensor that detects a radiation temperature from a plurality of light emitting elements that emit light of a predetermined wavelength, and an absorption coefficient correcting unit that corrects an absorption coefficient value of a notable substance inside the object on the basis of the radiation temperature detected by the temperature sensor, referring to data indicating a correspondence relationship between a temperature obtained in advance for each emitted light of the plurality of light emitting elements and an absorption coefficient value that varies according to the temperature.

摘要翻译： 一种生物光学测量仪器，包括从发出预定波长的光的多个发光元件检测辐射温度的单一温度传感器，以及将物体内的显着物质的吸收系数值校正为吸收系数值的吸收系数校正单元， 以温度传感器检测出的辐射温度为基础，参照表示多个发光元件的每个发光的预先获得的温度与根据温度变化的吸收系数值之间的对应关系的数据。

公开(公告)号：US20130162051A1

公开(公告)日：2013-06-27

申请号：US13608464

申请日：2012-09-10

申请人： Saori Michihata ,  Kaoru Haruyama ,  Hiromichi Suzuki

发明人： Saori Michihata ,  Kaoru Haruyama ,  Hiromichi Suzuki

IPC分类号： H02J17/00

CPC分类号： H02J50/12 ,  H02J5/005 ,  H02J50/40 ,  H02J50/80

摘要： According to one embodiment, a power transfer system includes a power transmission apparatus and a power reception apparatus. The power transmission apparatus has a power transmission module, and a first wireless communication device configured to transmit physical profile information of the power transmission apparatus. The power reception apparatus has a power reception module, a second wireless communication device configured to receive the physical profile information, and a controller. Wireless power transfer is conducted between the power transmission module and the power reception module. The controller is configured to cross-check a physical profile of a power signal of the wireless power transfer received by the power reception module with the physical profile information and identify the first wireless communication device based on a result of the cross-check.

摘要翻译： 根据一个实施例，电力传输系统包括电力传输装置和电力接收装置。 电力传输装置具有电力传输模块和被配置为发送电力传输装置的物理配置文件信息的第一无线通信装置。 电力接收装置具有电力接收模块，被配置为接收物理配置文件信息的第二无线通信装置和控制器。 在电力传输模块和电力接收模块之间进行无线电力传输。 控制器被配置为利用物理配置文件信息来交叉检查由电力接收模块接收的无线电力传输的电力信号的物理配置文件，并且基于交叉检查的结果识别第一无线通信设备。

公开(公告)号：US20120313381A1

公开(公告)日：2012-12-13

申请号：US13158848

申请日：2011-06-13

申请人： Joaquin A. Pelaez ,  Brian Reynolds ,  Kevin Ireland ,  Hiromichi Suzuki

发明人： Joaquin A. Pelaez ,  Brian Reynolds ,  Kevin Ireland ,  Hiromichi Suzuki

IPC分类号： F02N11/08

CPC分类号： F02N11/0862 ,  F02N11/087

摘要： A starter circuit includes a battery, a starter electrically coupled with the battery, a relay disposed between the battery and the starter, and a starter switch mounted remotely from the starter. The starter includes a switch assembly and a starter motor. The switch assembly includes an actuator and a start signal switch. The relay is configured to operate to provide current to the switch assembly to close the start signal switch in response to a received signal. The starter switch closes in response to the start signal switch being closed, whereby the battery delivers current to the starter motor when the starter switch is closed. A starter unit is also disclosed.

摘要翻译： 起动器电路包括电池，与电池电耦合的起动器，设置在电池和起动器之间的继电器以及远离起动器安装的起动开关。 起动器包括开关组件和起动电动机。 开关组件包括致动器和启动信号开关。 继电器被配置为操作以响应于接收到的信号向开关组件提供电流以关闭起始信号开关。 启动器开关响应于启动信号开关关闭而关闭，由此当起动器开关闭合时，电池将电流输送到起动电动机。 还公开了一个启动器单元。

公开(公告)号：US08165316B2

公开(公告)日：2012-04-24

申请号：US12364617

申请日：2009-02-03

申请人： Hiromichi Suzuki ,  Masao Teshima ,  Koichi Sato ,  Hiroshi Shimasaki ,  Satoshi Mizoguchi ,  Takashi Amano

发明人： Hiromichi Suzuki ,  Masao Teshima ,  Koichi Sato ,  Hiroshi Shimasaki ,  Satoshi Mizoguchi ,  Takashi Amano

IPC分类号： H01B15/00 ,  G08B19/00

CPC分类号： H04M1/03 ,  H04M1/60 ,  H04M1/72519 ,  H04M2250/12 ,  H04M2250/22

摘要： According to an aspect of the invention, a portable terminal includes: a first audio input-output unit and a second audio input-output unit configured to receive audio when a mode is set as an input mode and output audio when the mode is set as an output mode; and a setting unit configured to set the respective modes of the first audio input-output unit and the second audio input-output unit.

摘要翻译： 根据本发明的一个方面，便携式终端包括：第一音频输入 - 输出单元和第二音频输入 - 输出单元，被配置为当模式被设置为输入模式时接收音频，并且当模式被设置为 输出模式; 以及设置单元，被配置为设置第一音频输入输出单元和第二音频输入 - 输出单元的各个模式。

公开(公告)号：US08148804B2

公开(公告)日：2012-04-03

申请号：US12318955

申请日：2009-01-13

申请人： Susumu Baba ,  Masachika Masuda ,  Hiromichi Suzuki

发明人： Susumu Baba ,  Masachika Masuda ,  Hiromichi Suzuki

IPC分类号： H01L23/52 ,  H01L23/498

CPC分类号： H01L23/485 ,  H01L23/36 ,  H01L23/4827 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49883 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device electrically connects an electrode provided on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The metal substrate is provided on one side of the insulating layer. The copper wiring layer is provided on another side of the insulating layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode provided on the semiconductor chip. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.

摘要翻译： 本发明提供一种半导体装置用布线装置，半导体装置用复合布线装置以及树脂密封型半导体装置，其能够搭载比常规芯片小的半导体芯片，并以低成本制造。 布线装置将设置在半导体芯片上的电极与外部布线装置电连接，并且具有绝缘层，金属基板和铜布线层。 金属基板设置在绝缘层的一侧。 铜布线层设置在绝缘层的另一侧。 布线装置具有相对于绝缘层设置在铜布线层一侧的半导体芯片支撑部。 铜布线层包括第一端子，第二端子和布线部分。 第一端子与设置在半导体芯片上的电极连接。 第二端子与外部接线装置连接。 布线部将第一端子与第二端子连接。

公开(公告)号：US20120074544A1

公开(公告)日：2012-03-29

申请号：US13230128

申请日：2011-09-12

申请人： Masachika MASUDA ,  Koji TOMITA ,  Tadashi OKAMOTO ,  Yasunori TANAKA ,  Hiroshi OHSAWA ,  Kazuyuki MIYANO ,  Atsushi KURAHASHI ,  Hiromichi SUZUKI

发明人： Masachika MASUDA ,  Koji TOMITA ,  Tadashi OKAMOTO ,  Yasunori TANAKA ,  Hiroshi OHSAWA ,  Kazuyuki MIYANO ,  Atsushi KURAHASHI ,  Hiromichi SUZUKI

IPC分类号： H01L23/495

CPC分类号： H01L23/49548 ,  H01L21/4832 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49503 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/105 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48639 ,  H01L2224/48664 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/834 ,  H01L2224/85005 ,  H01L2224/85439 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01026

摘要： A semiconductor device includes, a lead frame having a die pad and a plurality of leads each disposed around the die pad, a semiconductor element rested on the die pad of the lead frame, and bonding wires for electrically interconnecting the lead of the lead frame and the semiconductor element. The lead frame, the semiconductor element, and the bonding wires are sealed with a sealing resin section. The sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region. Thickness of the central region is greater than that of the marginal region.

摘要翻译： 一种半导体器件包括：具有管芯焊盘的引线框架和设置在管芯焊盘周围的多个引线;保持在引线框架的管芯焊盘上的半导体元件和用于将引线框架的引线电连接的接合线和 半导体元件。 引线框架，半导体元件和接合线用密封树脂部分密封。 密封树脂部分包括设置在半导体器件上方和周围的中心区域和设置在中心区域周边的边缘区域。 中部地区的厚度大于边缘地区的厚度。

公开(公告)号：US07998795B2

公开(公告)日：2011-08-16

申请号：US12817832

申请日：2010-06-17

申请人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

发明人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L24/85 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/06153 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/78743 ,  H01L2224/85148 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing a semiconductor device includes mounting a first chip over a first area of a chip mounting section of a lead frame and mounting a second chip over a second area of the chip mounting section, wherein the second area is adjacent to the first area via the slit. The chip mounting section is disposed on a flat heating jig. First pads of the first chip are connected with second pads of the second chip via first wires, respectively, and the first pads are connected with leads of the lead frame via second wires, respectively. the first chip, the second chip, the first wires and the second wires are sealed with a resin such that a part of each of the leads is exposed from the resin, and each of the leads is then separated from the lead frame.

摘要翻译： 一种制造半导体器件的方法，包括将第一芯片安装在引线框架的芯片安装部分的第一区域上，并将第二芯片安装在芯片安装部分的第二区域上，其中第二区域与第一区域相邻 通过狭缝。 芯片安装部分设置在平坦的加热夹具上。 第一芯片的第一焊盘分别经由第一焊盘与第二焊盘的第二焊盘连接，并且第一焊盘分别经由第二焊盘与引线框架的引线连接。 第一芯片，第二芯片，第一线和第二线被树脂密封，使得每个引线的一部分从树脂露出，并且每个引线然后与引线框架分离。

公开(公告)号：US20110006410A1

公开(公告)日：2011-01-13

申请号：US12701053

申请日：2010-02-05

申请人： Susumu Baba ,  Masachika Masuda ,  Hiromichi Suzuki

发明人： Susumu Baba ,  Masachika Masuda ,  Hiromichi Suzuki

IPC分类号： H01L23/495

CPC分类号： H01L24/49 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49568 ,  H01L24/16 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48647 ,  H01L2224/48847 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/85447 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： A semiconductor composite wiring assembly includes a wiring assembly and a lead frame. A copper wiring layer of the wiring assembly includes first terminals, second terminals, and wiring sections connecting the terminals. The second terminals and the lead frame are electrically connected by connecting members. The lead frame includes a die pad for mounting the wiring assembly, and lead sections located at outer positions. The die pad includes a central area in which a semiconductor chip is mounted via the wiring assembly, and a peripheral area connected to the central area with spaces formed therebetween that serve as resin-seal inflow spaces. The wiring assembly is positioned over the central area and the peripheral area so as to cover the central area completely and the peripheral area partially, and at least the central area and the peripheral area of the die pad are glued to the wiring assembly by resin paste.

摘要翻译： 半导体复合布线组件包括布线组件和引线框架。 布线组件的铜布线层包括第一端子，第二端子和连接端子的布线部分。 第二端子和引线框架通过连接构件电连接。 引线框架包括用于安装布线组件的管芯焊盘和位于外部位置的引线部分。 芯片焊盘包括通过布线组件安装半导体芯片的中心区域和连接到中心区域的周边区域，其间形成有用作树脂密封流入空间的空间。 布线组件位于中心区域和外围区域之上，以完全覆盖中心区域和周边区域，并且至少芯片垫的中心区域和周边区域通过树脂浆料粘合到布线组件 。

公开(公告)号：US07772044B2

公开(公告)日：2010-08-10

申请号：US12263696

申请日：2008-11-03

申请人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

发明人： Fujio Ito ,  Hiromichi Suzuki ,  Akihiko Kameoka ,  Noriaki Sakamoto

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L24/85 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/06153 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/78743 ,  H01L2224/85148 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing a semiconductor device includes mounting a first chip over a first area of a chip mounting section of a lead frame and mounting a second chip over a second area of the chip mounting section, wherein the second area is adjacent to the first area via the slit. The chip mounting section is disposed on a flat heating jig. First pads of the first chip are connected with second pads of the second chip via first wires, respectively, and the first pads are connected with leads of the lead frame via second wires, respectively. the first chip, the second chip, the first wires and the second wires are sealed with a resin such that a part of each of the leads is exposed from the resin, and each of the leads is then separated from the lead frame.

摘要翻译： 一种制造半导体器件的方法，包括将第一芯片安装在引线框架的芯片安装部分的第一区域上，并将第二芯片安装在芯片安装部分的第二区域上，其中第二区域与第一区域相邻 通过狭缝。 芯片安装部分设置在平坦的加热夹具上。 第一芯片的第一焊盘分别经由第一焊盘与第二焊盘的第二焊盘连接，并且第一焊盘分别经由第二焊盘与引线框架的引线连接。 第一芯片，第二芯片，第一线和第二线被树脂密封，使得每个引线的一部分从树脂露出，并且每个引线然后与引线框架分离。