公开(公告)号：US20100319882A1

公开(公告)日：2010-12-23

申请号：US12649617

申请日：2009-12-30

Applicant: Ke-Chin LEE ,  Shu-Lung Chung

Inventor： Ke-Chin LEE ,  Shu-Lung Chung

IPC: F28D15/04 ,  B21D53/02

CPC classification number: F28D15/046 ,  Y10T29/4935 ,  Y10T29/49353

Abstract: An ultra-thin heat pipe and a manufacturing method thereof are provided. The ultra-thin heat pipe includes a flat pipe body and a powder-sintered portion. The flat pipe body has an internal wall, a first groove set and a second groove set, wherein the first groove set and the second groove set are disposed on the internal wall and spaced apart from each other, and each groove of the first groove set and the second groove set is extended along an extension direction of the flat pipe body. The powder-sintered portion is disposed within the flat pipe body and connects both the first groove set and the second groove set for forming at least one vapor channel with the internal wall.

Abstract translation: 提供了一种超薄热管及其制造方法。 超薄热管包括扁平管体和粉末烧结部分。 扁平管体具有内壁，第一凹槽组和第二凹槽组，其中第一凹槽组和第二凹槽组设置在内壁上并彼此间隔开，并且第一凹槽组的每个凹槽 并且所述第二槽组沿着所述扁平管体的延伸方向延伸。 粉末烧结部分设置在扁平管体内，并将第一沟槽组和第二沟槽组两者与内壁连接起来形成至少一个蒸气通道。

公开(公告)号：US20100181593A1

公开(公告)日：2010-07-22

申请号：US12588125

申请日：2009-10-06

Applicant: Ke-Chin Lee

Inventor： Ke-Chin Lee

IPC: H01L33/00

CPC classification number: H01L33/642 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A LED chip package including a two-phase-flow heat transfer device, at least one LED chip, a metal lead frame and a package material. The two-phase-flow heat transfer device has at least one flat surface. The LED chip is directly or indirectly bonded or adhered to the flat surface of the two-phase-flow heat transfer device. Heat generated by the LED chip can be easily conducted away from the LED chip by the two-phase-flow heat transfer device such as a heat pipe, a vapor chamber and the like so as to prevent heat from accumulating in the LED chip thereby extending the service duration of the LED chip and to prevent the LED chip from deterioration of the light emitting performance caused by the accumulation of heat.

Abstract translation: 一种LED芯片封装，包括两相流传热装置，至少一个LED芯片，金属引线框架和封装材料。 两相流传热装置具有至少一个平坦表面。 LED芯片直接或间接地结合或粘合到两相流动传热装置的平坦表面上。 由LED芯片产生的热量可以通过诸如热管，蒸气室等的两相流传热装置容易地从LED芯片导出，以防止热量积聚在LED芯片中从而延伸 LED芯片的使用持续时间，并防止LED芯片由于热量积聚而引起的发光性能的恶化。

公开(公告)号：US20230091157A1

公开(公告)日：2023-03-23

申请号：US17996110

申请日：2020-04-17

Applicant: Ke Chin LEE

Inventor： Ke Chin LEE

IPC: F28D15/04 ,  H05K7/20 ,  F28D15/02

Abstract: The present invention is related to a laminated thin heat dissipation device mainly comprising an upper plate, at least one first layer plate, at least one second layer plate, a lower plate and a working fluid, the first, second layer plates having at least one first, second hollow slots respectively, wherein the upper plate, the first layer plate, the second layer plate and the lower plate are laminated to form a hollow body, the first hollow slot and the second hollow slot are communicated with each other and form an enclosed chamber, the enclosed chamber includes at least one first fluid channel and at least one second fluid channel, the enclosed chamber of the hollow body is filled with the working fluid, the first fluid channel serves as a vapor flow path, and the second fluid channel serves as a condensed fluid flow path.

公开(公告)号：US09255743B2

公开(公告)日：2016-02-09

申请号：US13184835

申请日：2011-07-18

Applicant: Ke-chin Lee ,  Shu-Lung Chung ,  Hung-Chieh Chen

Inventor： Ke-chin Lee ,  Shu-Lung Chung ,  Hung-Chieh Chen

IPC: F28D15/00 ,  F28D15/02 ,  F28D15/04 ,  F21V29/00 ,  F21V29/70 ,  F21V29/74 ,  F21V29/77 ,  F28F1/20 ,  F21Y101/02

CPC classification number: F21V29/77 ,  F21V29/2212 ,  F21V29/70 ,  F21V29/74 ,  F21V29/773 ,  F21Y2115/10 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/046 ,  F28F1/20

Abstract: A high-power heat dissipation module for cooling down electronic components comprises a heat exchange element with a sealed cavity, in which a powder sintering portion and a working liquid is provided. The heat exchange element further has a flat section for mounting the electronic component, and a fixing structure. The heat dissipation module further comprises a heat sink with a central hole portion and a heat dissipation structure around the central hole portion. The heat generated by the electronic component is transferred to the heat sink by the heat exchange element, and then quickly dissipated into the air surrounding by the heat dissipation structure. The heat dissipation modules can handle the heat dissipation task for the electronic components with a power of 100 Watts or more and are suitable for cooling high-power electronic components.

Abstract translation: 用于冷却电子部件的高功率散热模块包括具有密封空腔的热交换元件，其中设置有粉末烧结部分和工作液体。 热交换元件还具有用于安装电子部件的平坦部分和固定结构。 散热模块还包括具有中心孔部分的散热器和围绕中心孔部分的散热结构。 由电子部件产生的热量通过热交换元件传递到散热器，然后快速耗散到由散热结构围绕的空气中。 散热模块可以处理功率为100瓦或更高的电子部件的散热任务，适用于冷却大功率电子部件。

公开(公告)号：US08602587B2

公开(公告)日：2013-12-10

申请号：US13105171

申请日：2011-05-11

Applicant: Ke-chin Lee ,  Shih-chiang Lin

Inventor： Ke-chin Lee ,  Shih-chiang Lin

IPC: F21S4/00

CPC classification number: H05B33/0803 ,  F21K9/275 ,  F21K9/60 ,  F21V3/02 ,  F21V29/506 ,  F21V29/74 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2107/00 ,  F21Y2113/00 ,  F21Y2115/10

Abstract: An LED lamp tube comprises a tube body, at least one circuit board inside the tube body, at lease one LED module on the circuit board, and electrical connectors at the ends of the tube, wherein the tube body is an integrally formed hollow tube, and has at least one group of supporting and positioning ribs on the inner wall thereof along the length direction; the circuit board is fixed by the supporting and positioning ribs; the LED lamp tube disclosed by the present invention has a firm assembly structure with less thermal deformation, and more particularly just like the conventional fluorescent tubes it has a wide light-emitting angle, thereby providing better illumination effects.

Abstract translation: LED灯管包括管体，管体内的至少一个电路板，电路板上的至少一个LED模块和管端部处的电连接器，其中管体是整体形成的中空管， 并且在其内壁上沿长度方向具有至少一组支撑和定位肋; 电路板由支撑和定位肋固定; 本发明公开的LED灯管具有较少热变形的组装结构，更特别地，与现有的荧光灯一样，具有宽的发光角度，从而提供更好的照明效果。

公开(公告)号：US08590601B2

公开(公告)日：2013-11-26

申请号：US12461560

申请日：2009-08-17

Applicant: Ke-Chin Lee

Inventor： Ke-Chin Lee

IPC: F28D15/00

CPC classification number: F28D15/046 ,  F28F2255/18

Abstract: A sintered heat pipe having a metal tube of which an inner wall is formed with a plurality of capillary grooves extending in a longitudinal direction; and a sintered powder layer partially covering the capillary grooves. The sintered powder layer is circumferentially sintered onto the inner wall of the tube. The capillary grooves extend from one end of the metal tube but do not extend to the other end of the metal tube, leaving a section of the metal tube uncovered. The sintered powder layer extends from the other end of the metal tube but does not extend to the one end of the metal tube so as to cover the section of the metal tube uncovered by the capillary grooves.

Abstract translation: 一种烧结热管，其金属管的内壁形成有沿长度方向延伸的多个毛细管槽; 以及部分地覆盖毛细管槽的烧结粉末层。 烧结粉末层周向烧结到管的内壁上。 毛细管槽从金属管的一端延伸，但不延伸到金属管的另一端，留下金属管的一部分未被覆盖。 烧结粉末层从金属管的另一端延伸，但不延伸到金属管的一端，以覆盖未被毛细管槽覆盖的金属管的部分。

公开(公告)号：US08590154B2

公开(公告)日：2013-11-26

申请号：US13090712

申请日：2011-04-20

Applicant: Ke-chin Lee

Inventor： Ke-chin Lee

IPC: B21D53/02

CPC classification number: F28D15/0233 ,  B23P2700/09 ,  F28D15/0283 ,  F28D15/046 ,  F28F2240/00 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  Y10T29/4998 ,  H01L2924/00

Abstract: A vapor chamber manufacturing method, comprises steps of material preparation, powder filling and sintering, pre-punching, supporting structure infilling, the first pressing, the first sealing, fluid injection, and vacuum processing; a sealing structure comprises a semi-finished vapor chamber with a vacuum cavity, a fluid injection port positioned on one side of the vapor chamber, and a supporting structure filled in the vacuum cavity and supporting the shape of the vapor chamber, wherein the fluid injection port is formed of one portion of one side of the vapor chamber by pressing and sealing, no fine metal pipe as fluid injection port is required herein; after the step of fluid injection, an integrated step of vacuum pumping, pressing and sealing is conducted within a vacuum chamber, to provide the product with higher performance and lower rejection rate.

Abstract translation: 蒸气室制造方法，包括材料制备，粉末填充和烧结步骤，预冲压，支撑结构灌注，第一次压制，第一次密封，流体注入和真空处理; 密封结构包括具有真空腔的半成品蒸气室，位于蒸气室一侧的流体注入口和填充在真空腔中并支撑蒸气室形状的支撑结构，其中流体注入 端口由蒸汽室的一侧的一部分通过加压和密封而形成，在此不需要作为流体注入口的细金属管; 在流体注射步骤之后，在真空室内进行真空泵送，压制和密封的一体化步骤，为产品提供更高的性能和更低的排除率。

公开(公告)号：USD666344S1

公开(公告)日：2012-08-28

申请号：US29396658

申请日：2011-07-05

Applicant: Ke-chin Lee

Designer： Ke-chin Lee

公开(公告)号：US20120043884A1

公开(公告)日：2012-02-23

申请号：US13105171

申请日：2011-05-11

Applicant: Ke-chin Lee ,  Shih-chiang Lin

Inventor： Ke-chin Lee ,  Shih-chiang Lin

IPC: H01K1/62 ,  F21V21/00

CPC classification number: H05B33/0803 ,  F21K9/275 ,  F21K9/60 ,  F21V3/02 ,  F21V29/506 ,  F21V29/74 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2107/00 ,  F21Y2113/00 ,  F21Y2115/10

Abstract: An LED lamp tube comprises a tube body, at least one circuit board inside the tube body, at lease one LED module on the circuit board, and electrical connectors at the ends of the tube, wherein the tube body is an integrally formed hollow tube, and has at least one group of supporting and positioning ribs on the inner wall thereof along the length direction; the circuit board is fixed by the supporting and positioning ribs; the LED lamp tube disclosed by the present invention has a firm assembly structure with less thermal deformation, and more particularly just like the conventional fluorescent tubes it has a wide light-emitting angle, thereby providing better illumination effects.

Abstract translation: LED灯管包括管体，管体内的至少一个电路板，电路板上的至少一个LED模块和管端部处的电连接器，其中管体是一体形成的中空管， 并且在其内壁上沿长度方向具有至少一组支撑和定位肋; 电路板由支撑和定位肋固定; 本发明公开的LED灯管具有较少热变形的组装结构，更特别地，与现有的荧光灯一样，具有宽的发光角度，从而提供更好的照明效果。

公开(公告)号：US20120033425A1

公开(公告)日：2012-02-09

申请号：US13264383

申请日：2010-02-11

Applicant: Ke-chin Lee

Inventor： Ke-chin Lee

IPC: F21V29/00 ,  F21S4/00 ,  F21V21/00

CPC classification number: F21V29/51 ,  F21K9/23 ,  F21V19/00 ,  F21V21/116 ,  F21V29/02 ,  F21V29/77 ,  F21V29/83 ,  F21W2131/103 ,  F21Y2115/10

Abstract: The present invention discloses a street lamp fixing device, comprising a LED module, a heat dissipation device, a lamp holder, a metal plate and a connector, wherein the heat dissipation device has a lamp holder mounting recess cooperated with the metal plate for locking the lamp holder. Moreover, the present invention further discloses an LED street lamp with natural convection devices, which accelerate the airflow within the street lamp to a faster speed to enhance heat exchange, whereby the lifespan of the LED street lamp is extended and the weight and size of the street lamp are reduced.

Abstract translation: 本发明公开了一种路灯固定装置，包括LED模块，散热装置，灯座，金属板和连接器，其中散热装置具有与金属板配合的灯座安装凹部，用于锁定 灯具支架。 此外，本发明还公开了一种具有自然对流装置的LED路灯，其将路灯内的气流加速到更快的速度以增强热交换，从而LED路灯的寿命延长，并且重量和尺寸 路灯减少。