Abstract:
A blower fan including a motor having a rotating shaft, a bracket, a fan housing having a cavity, a fan wheel, and fan blades. The motor is disposed on the fan housing via the bracket. An extended portion of the rotating shaft extends into the cavity of the fan housing and connects with the fan wheel. The fan blades are disposed on the rotating shaft and between the motor and the fan housing. On the casing of the motor is disposed with air vents. The bracket forms an annular side wall. A cavity is formed inside the annular side wall. The annular side wall is outfitted with air outlets which are connected with the cavity of the annular side wall and the fan blades are disposed in the cavity.
Abstract:
The present invention provides a device system structure based on hybrid orientation SOI and channel stress and a preparation method thereof. According to the preparation method provided in the present invention, first, a (100)/(110) global hybrid orientation SOI structure is prepared; then, after epitaxially growing a relaxed silicon-germanium layer and strained silicon layer sequentially on the global hybrid orientation SOI structure, an (110) epitaxial pattern window is formed; then, after epitaxially growing a (110) silicon layer and a non-relaxed silicon-germanium layer at the (110) epitaxial pattern window, a surface of the patterned hybrid orientation SOI structure is planarized; then, an isolation structure for isolating devices is formed; and finally, a P-type high-voltage device structure is prepared in a (110) substrate portion, an N-type high-voltage device structure and/or low voltage device structures are prepared in the (100) substrate portion. In this manner, a carrier mobility is improved, Rdson of a high-voltage device is reduced, and performance of devices are improved, thereby facilitating further improvement of integration and reduction of power consumption.
Abstract:
The present invention discloses a method of NiSiGe epitaxial growth by introducing Al interlayer, comprising the deposition of an Al thin film on the surface of SiGe layer, subsequent deposition of a Ni layer on Al thin film and then the annealing process for the reaction between Ni layer and SiGe material of SiGe layer to form NiSiGe material. Due to the barrier effect of Al interlayer, NiSiGe layer features a single crystal structure, a flat interface with SiGe substrate and a thickness of up to 0.3 nm, significantly enhancing interface performance.
Abstract:
An icing detector probe includes three sections arranged sequentially along the direction of air flow, namely, a first section, a second section and a third section. The shape of the outer surface of the first section is suitable for collecting droplets in the air flow. The shape of the outer surface of the second section is suitable for full decelerating and releasing latent heat of large droplets during their movements. The outer surface of the third section is suitable for icing of large droplets. The probe detects icing by distinguishing and identify large droplets icing. The probe effectively detects types of traditional icing, thus being helpful for exact detection of icing thickness. An icing detector including said icing detector probe is also provided.
Abstract:
A Ge and Si hybrid material inversion mode GAA (Gate-All-Around) CMOSFET includes a PMOS region having a first channel, an NMOS region having a second channel and a gate region. The first channel and the second channel have a racetrack-shaped cross section and are formed of n-type Ge and p-type Si, respectively; the surfaces of the first channel and the second channel are substantially surrounded by the gate region; a buried oxide layer is disposed between the PMOS region and the NMOS region and between the PMOS or NMOS region and the Si substrate to isolate them from one another. In an inversion mode, the devices have hybrid material, GAA structure with the racetrack-shaped, high-k gate dielectric layer and metal gate, so as to achieve high carrier mobility, prevent polysilicon gate depletion and short channel effects.
Abstract:
Method and systems for improving resolution of imaging systems, such as a microscope or a medical ultrasonic scanner, are provided. The resolution of the microscope is improved by reducing direct illumination of unrelated regions of an object under examination. According to an aspect of the present invention, a method is provided to reduce the direct illumination of the unrelated regions in a detectable region such as a cone of light that otherwise could generate substantial noises. In another aspect of the invention, a method is provided that focuses the illumination beams such that the width of the projected beam spot is narrowed, preventing the generation of a large amount of noise. In particular, the width of the illumination beam is narrowed such that the size of the projected illumination beam is smaller than the field of view of the microscope. In another aspect of the invention, a system according to the principles of the present invention is provided, wherein the illumination beam of light is such arranged that the overlap of the path of the illumination beam of light and the detectable region is reduced.
Abstract:
A Ge and Si hybrid material inversion mode GAA (Gate-All-Around) CMOSFET includes a PMOS region having a first channel, an NMOS region having a second channel and a gate region. The first channel and the second channel have a racetrack-shaped cross section and are formed of n-type Ge and p-type Si, respectively; the surfaces of the first channel and the second channel are substantially surrounded by the gate region; a buried oxide layer is disposed between the PMOS region and the NMOS region and between the PMOS or NMOS region and the Si substrate to isolate them from one another. In an inversion mode, the devices have hybrid material, GAA structure with the racetrack-shaped, high-k gate dielectric layer and metal gate, so as to achieve high carrier mobility, prevent polysilicon gate depletion and short channel effects.
Abstract:
The instant disclosure provides a push latch having a pivotally mounted blocking hammer including a head with a lever arm extending away from the head to a counter-weight. Under normal operating conditions, the hammer is held in an inert/balanced condition. Under such normal conditions, a portion of the hammer head may be in periodic contact with a resin of tacky character defining a bumper to aid in dampening vibration. Upon the occurrence of a high impact force, the rotational force provided by the counterweight is sufficient to cause the hammer to rotate into blocking relation relative to the latching mechanism so as to prevent unlatching. In the rotated condition, the counterweight may be in contact with an optional resin of tacky character defining a bumper to reduce rebound action.
Abstract:
A silicon/germanium (SiGe) heterojunction Tunnel Field Effect Transistor (TFET) and a preparation method thereof are provided, in which a source region of a device is manufactured on a silicon germanium (SiGe) or Ge region, and a drain region of the device is manufactured in a Si region, thereby obtaining a high ON-state current while ensuring a low OFF-state current. Local Ge oxidization and concentration technique is used to implement a Silicon Germanium On Insulator (SGOI) or Germanium On Insulator (GOI) with a high Ge content in some area. In the SGOI or GOI with a high Ge content, the Ge content is controllable from 50% to 100%. In addition, the film thickness is controllable from 5 nm to 20 nm, facilitating the implementation of the device process. During the oxidization and concentration process of the SiGe or Ge and Si, a SiGe heterojunction structure with a gradient Ge content is formed between the SiGe or Ge and Si, thereby eliminating defects. The preparation method according to the present invention has a simple process, which is compatible with the CMOS process and is applicable to mass industrial production.
Abstract:
The instant disclosure provides a push latch having a pivotally mounted blocking hammer including a head with a lever arm extending away from the head to a counter-weight. Under normal operating conditions, the hammer is held in an inert/balanced condition. Under such normal conditions, a portion of the hammer head may be in periodic contact with a resin of tacky character defining a bumper to aid in dampening vibration. Upon the occurrence of a high impact force, the rotational force provided by the counterweight is sufficient to cause the hammer to rotate into blocking relation relative to the latching mechanism so as to prevent unlatching. In the rotated condition, the counterweight may be in contact with an optional resin of tacky character defining a bumper to reduce rebound action.