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    FOLDING PERAMBULATOR
    31.
    发明申请
    FOLDING PERAMBULATOR 有权
    折叠PERAMBULATOR

    公开(公告)号：US20120049485A1

    公开(公告)日：2012-03-01

    申请号：US12869574

    申请日：2010-08-26

    Applicant: Michael LIN

    Inventor： Michael LIN

    IPC: B62B7/06

    CPC classification number: B62B7/068 ,  B62B7/08 ,  B62B2205/02

    Abstract: A folding perambulator of the present invention includes four struts, two sliding members, a fore double bar linkage, an aft double bar linkage and two linking bars. The sliding members are slidably disposed on one of the struts separately. The aft double bar linkage includes two aft bars. The fore double bar linkage includes two fore bars. The aft bars, the fore bars and the linking bars are separately pivotally connected one of the sliding member to one of the struts. As such, users may fold or unfold the folding perambulator easily by moving the sliding members.

    Abstract translation: 本发明的折叠式折叠器包括四个支柱，两个滑动构件，前部双杆连杆，后部双杆连杆和两个连杆。 滑动构件分别可滑动地设置在一个支柱上。 后双杆联动装置包括两个尾杆。 前双杆连杆包括两个前杆。 后杆，前杆和连接杆将滑动构件中的一个单独枢转地连接到支柱中的一个。 因此，用户可以通过移动滑动构件来容易地折叠或展开折叠折页机。

    Multi-Interface aware scenario execution environment
    34.
    发明授权
    Multi-Interface aware scenario execution environment 有权
    多界面感知场景执行环境

    公开(公告)号：US07546586B2

    公开(公告)日：2009-06-09

    申请号：US11059113

    申请日：2005-02-15

    Applicant: Amit Amit ,  Marcelo V. Vago ,  YiCheng Michael Lin

    Inventor： Amit Amit ,  Marcelo V. Vago ,  YiCheng Michael Lin

    IPC: G06F9/44

    CPC classification number: G09B7/00

    Abstract: A scenario execution environment (SEE) may include one or more action layers. Each action layer may be associated with one or more SEE actions. Each SEE action may be associated with one or more action layers. SEE code may specify one or more SEE actions. The SEE code may be parsed for the SEE actions. Each SEE action may be dispatched to each associated action layer. The action layer interface may include a start scenario element, an end scenario element and a run action element. The start scenario element may inform the action layer that one or more scenarios of the scenario execution environment are commencing. The end scenario element may inform the action layer that one or more scenarios are concluding. The run action element may instruct the action layer to carry out one or more SEE actions associated with one or more scenarios.

    Abstract translation: 场景执行环境（SEE）可以包括一个或多个动作层。 每个动作层可以与一个或多个SEE动作相关联。 每个SEE动作可以与一个或多个动作层相关联。 SEE代码可以指定一个或多个SEE动作。 可以为SEE操作解析SEE代码。 可以将每个SEE动作分派到每个关联的动作层。 动作层接口可以包括起始脚本元素，结束脚本元素和运行动作元素。 启动场景元素可以向操作层通知场景执行环境的一个或多个场景正在开始。 结束场景元素可以通知动作层一个或多个场景正在结束。 运行动作元素可以指示动作层执行与一个或多个场景相关联的一个或多个SEE动作。

    Internally disposed cooling device for electronic apparatus
    36.
    发明授权
    Internally disposed cooling device for electronic apparatus 失效
    内置电子设备冷却装置

    公开(公告)号：US07190576B2

    公开(公告)日：2007-03-13

    申请号：US10871595

    申请日：2004-06-21

    Applicant: Jack Wang ,  Charles Ma ,  Michael Lin

    Inventor： Jack Wang ,  Charles Ma ,  Michael Lin

    IPC: H05K7/20 ,  H01L23/38 ,  F25B21/02

    CPC classification number: G06F1/20 ,  F25B21/02 ,  F25B2321/0251 ,  Y10S257/93

    Abstract: An internally disposed cooling device is provided. The cooling device includes a cooling member and a docket member. The cooling member includes a first cooling unit, a second unit and a cryogenic element. The cryogenic element has a cold surface that contacts the first cooling unit, and a hot surface that contacts the second cooling unit. Since the cold surface of the cryogenic element has a temperature much lower than that of the room temperature, the first cooling unit can thus produce cold and dry air to cool down the electronic apparatus. Meanwhile, the second cooling unit is employed to dissipate heat generated from the cryogenic element.

    Abstract translation: 提供内部设置的冷却装置。 冷却装置包括冷却部件和副部件。 冷却构件包括第一冷却单元，第二单元和低温元件。 低温元件具有接触第一冷却单元的冷表面和接触第二冷却单元的热表面。 由于低温元件的冷表面的温度远低于室温的温度，因此第一冷却单元可以产生冷和干燥的空气来冷却电子设备。 同时，第二冷却单元用于散发由低温元件产生的热量。

    Light guide plate with diffusion dots having scattering particles and surface light source unit incorporating the light guide plate
    37.
    发明授权
    Light guide plate with diffusion dots having scattering particles and surface light source unit incorporating the light guide plate 失效
    具有散射点的导光板和具有导光板的表面光源单元

    公开(公告)号：US07085460B2

    公开(公告)日：2006-08-01

    申请号：US10745218

    申请日：2003-12-22

    Applicant: Charles Leu ,  Ga-lane Chen ,  Michael Lin ,  Ming-Hsuan Liu ,  Tai-Cheng Yu

    Inventor： Charles Leu ,  Ga-lane Chen ,  Michael Lin ,  Ming-Hsuan Liu ,  Tai-Cheng Yu

    IPC: G02B6/04

    CPC classification number: G02B6/0043 ,  Y10S385/901

    Abstract: A surface light source unit (2) includes a light source (21), a light guide plate (22), a reflective plate (23) and a diffusing plate (24). The light guide plate includes a light incidence surface (221) adjacent to the light source for receiving light beams, an emission surface (222) for emitting the light beams, a light reflection surface (223) opposite to the emission surface and a plurality of diffusion dots (224) formed on the light reflection surface. The diffusion dots contain a plurality of light scattering particles (225) having substantially global surfaces. The surface light source unit provides high uniform illumination for a liquid crystal display panel.

    Abstract translation: 表面光源单元（2）包括光源（21），导光板（22），反射板（23）和漫射板（24）。 所述导光板包括与用于接收光束的光源相邻的光入射表面（221），用于发射光束的发射表面（222），与发射表面相对的光反射表面（223）和多个 扩散点（224）形成在光反射表面上。 扩散点包含具有基本全局表面的多个光散射粒子（225）。 表面光源单元为液晶显示面板提供高均匀照明。

    Heat dissipating device having improved fastening structure
    38.
    发明授权
    Heat dissipating device having improved fastening structure 失效
    具有改进的紧固结构的散热装置

    公开(公告)号：US07019979B2

    公开(公告)日：2006-03-28

    申请号：US10717447

    申请日：2003-11-21

    Applicant: Jack Wang ,  Cheng-Hua Cheng ,  Michael Lin ,  Charles Ma

    Inventor： Jack Wang ,  Cheng-Hua Cheng ,  Michael Lin ,  Charles Ma

    IPC: H05K7/20

    CPC classification number: H01L23/4006 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A fastening structure provided by the present invention is used to fastening a heat dissipating device with a printed circuit board in which a plurality of holes is formed. The fastening structure has a back plate disposed underneath the printed circuit board and a plurality of fitting columns, wherein the back plate is perforated with a plurality of holes and each of the fitting columns has an elongate hollow tube and an insertion member projecting from a periphery of one end of the hollow tube. The hollow tube has a threaded internal sidewall and the insertion member has a shape conformal to the respective holes at which the fitting columns are fixed to the back plate.

    Abstract translation: 由本发明提供的紧固结构用于将散热装置与其中形成有多个孔的印刷电路板进行紧固。 紧固结构具有设置在印刷电路板下面的背板和多个配合柱，其中背板穿孔有多个孔，并且每个配合柱具有细长的中空管和从周边突出的插入构件 的中空管的一端。 中空管具有带螺纹的内侧壁，并且插入构件具有与配合柱固定到背板的相应孔相符的形状。

    Thermoelectric heat dissipation device and method for fabricating the same
    39.
    发明申请
    Thermoelectric heat dissipation device and method for fabricating the same 审中-公开
    热电散热装置及其制造方法

    公开(公告)号：US20060005944A1

    公开(公告)日：2006-01-12

    申请号：US10883707

    申请日：2004-07-06

    Applicant: Jack Wang ,  Michael Lin ,  Charles Ma

    Inventor： Jack Wang ,  Michael Lin ,  Charles Ma

    IPC: F28F7/00

    CPC classification number: H01L35/32

    Abstract: A method for fabricating a thermoelectric heat dissipation device including the steps of providing a base plate, a thermoelectric semiconductive element connected to the base plate and a heat sink in form of plates or fins with one surface coated an electric insulation coating and patterned conductive lines, and adhering the heat sink to the thermoelectric semiconductive element. Accrodingly, the thermoelectric heat dissipation device is provided including the theremoelectric semiconductive element as a cryogenic chip and the heat sink. The cooling surface of the cryogenic chip is directly electrically connected to the heat sink which is in form of plates or fins, and the other surface of the cryogenic chip is adhered to the base plate. The base plate of the device is utilized to connect with the surface of an electronic component for heat transfer.

    Abstract translation: 一种用于制造热电散热装置的方法，包括以下步骤：提供基板，连接到基板的热电半导体元件和板或翅片形式的散热器，其中一个表面涂覆有电绝缘涂层和图案化的导线， 并将散热器粘附到热电半导体元件上。 特别地，热电散热装置包括作为低温芯片的热电半导体元件和散热器。 低温芯片的冷却表面直接电连接到板状或散热片形式的散热器，低温芯片的另一表面粘附在基板上。 该装置的基板用于与用于传热的电子部件的表面连接。

    Internally disposed cooling device for electronic apparatus
    40.
    发明申请
    Internally disposed cooling device for electronic apparatus 失效
    内置电子设备冷却装置

    公开(公告)号：US20050281016A1

    公开(公告)日：2005-12-22

    申请号：US10871595

    申请日：2004-06-21

    Applicant: Jack Wang ,  Charles Ma ,  Michael Lin

    Inventor： Jack Wang ,  Charles Ma ,  Michael Lin

    IPC: F25B21/02 ,  F25D23/12 ,  G06F1/20 ,  H05K7/02 ,  H05K7/04 ,  H05K7/20

    CPC classification number: G06F1/20 ,  F25B21/02 ,  F25B2321/0251 ,  Y10S257/93

    Abstract: An internally disposed cooling device is provided. The cooling device includes a cooling member and a docket member. The cooling member includes a first cooling unit, a second unit and a cryogenic element. The cryogenic element has a cold surface that contacts the first cooling unit, and a hot surface that contacts the second cooling unit. Since the cold surface of the cryogenic element has a temperature much lower than that of the room temperature, the first cooling unit can thus produce cold and dry air to cool down the electronic apparatus. Meanwhile, the second cooling unit is employed to dissipate heat generated from the cryogenic element.

    Abstract translation: 提供内部设置的冷却装置。 冷却装置包括冷却部件和副部件。 冷却构件包括第一冷却单元，第二单元和低温元件。 低温元件具有接触第一冷却单元的冷表面和接触第二冷却单元的热表面。 由于低温元件的冷表面的温度远低于室温的温度，因此第一冷却单元可以产生冷和干燥空气来冷却电子设备。 同时，第二冷却单元用于散发由低温元件产生的热量。

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