Abstract:
A method of manufacturing a semiconductor device includes a monocrystalline semiconductor layer of one conductivity type with a first insulating film covering the semiconductor layer. An aperture is selectively formed in the first insulating film to expose a part of the semiconductor layer. A first polycrystalline semiconductor film of an opposite conductivity type is formed on the first insulating film and has an overhang portion projecting over the aperture from an edge of the first insulating film defining the aperture. A second polycrystalline semiconductor film and a monocrystalline semiconductor film of the opposite conductivity type are grown simultaneously on a bottom surface of the overhang portion of the first polycrystalline semiconductor film and on the part of the monocrystalline semiconductor layer respectively until monocrystalline semiconductor film is in contact with the second polycrystalline semiconductor film, with a second insulating film selectively formed on the monocrystalline semiconductor film with leaving a part thereof to be exposed.
Abstract:
Provided is a liquid crystal display device includes an optical switching member; a light guide plate made of a thermoplastic material, which includes at least one light introducing portion on at least one side surface thereof; and a light source disposed on the at least one side surface, in which: the at least one light introducing portion includes, in plan view of the light guide plate: a first portion extending from a light incident surface, which is an end surface of the at least one light introducing portion, while keeping a substantially constant width; and a second portion, which extends from the first portion and has a form which widens; and at least the second portion is connected to a front surface of the light guide plate through an inclined surface which is smoothly continuous with the front surface of the light guide plate.
Abstract:
A color cathode ray has an electron gun which includes three cathodes for emitting three in-line electron beams and a plurality of electrodes fixed in a predetermined axially spaced relationship on insulating supports. At least one of the plurality of electrodes is cup-shaped and has a correction electrode therein, and edges of the correction electrode are formed with recesses and sloped portions. A distance L from a mouth of each of the recesses of the correction electrode to an inner wall of the at least one of the plurality of electrodes satisfies the following relationship: L′≦L≦15 &mgr;m, where L′ is a height of a burr caused in press-forming of the recesses.
Abstract translation:彩色阴极射线具有电子枪,其包括用于发射三个一字形电子束的三个阴极和在绝缘支撑件上以预定的轴向间隔关系固定的多个电极。 多个电极中的至少一个是杯形的并且其中具有校正电极,并且校正电极的边缘形成有凹陷部分和倾斜部分。 从校正电极的每个凹部的口部到多个电极中的至少一个电极的内壁的距离L满足以下关系:L'<= L <=15μm,其中L'是高度 在凹部的压制成型中引起的毛刺。
Abstract:
A color cathode ray tube including a panel section having a phosphor layer formed on an internal surface thereof, a neck portion having an electron gun assembly for emission of three electron beams therein, and a funnel section connecting the panel section and the neck portion. The electron gun assembly includes three cathodes and a plurality of grid electrodes disposed along a tube axis. The grid electrodes includes at least one plate-shaped electrode which has a fixed support structure. The plate-shaped electrode has three bulged portions along an electron beam passage, a first electron beam passage hole being formed in a respective bulged portion and a second electron beam passage being hole formed in a top face portion of a respective bulge portion. A diameter of the first electron beam passage hole is greater than a diameter of the second electron beam passage hole.
Abstract:
It is the object of the invention to suppress the leakage current of a semiconductor photodiode. A trench, a side wall of which is covered with and insulating layer, is formed on the surface of a semiconductor substrate of the first conductivity type. Then, an epitaxial layer of the second conductivity type is grown in the trench, where a PN-junction is constructed between the bottom surface of the epitaxial layer and the semiconductor substrate. An impurity diffusion layer of the second conductivity type with higher impurity concentration than that of an internal portion of the epitaxial semiconductor layer is formed over the side surface of the epitaxial layer of the second conductivity type. In the aforementioned structure, when a reverse bias voltage is applied to the PN-junction, a depletion layer does not extend to a neighborhood of the insulating layer, and a leakage current, which flows via surface states near the insulating layer.
Abstract:
The present invention provides a semiconductor photodetector formed over a substrate and being positioned adjacent to an optical fiber guiding groove also formed in said substrate bounding structure, said semiconductor photodetector having an optical waveguide layer including an optical absorption layer, wherein an edge portion of said optical waveguide layer is bounded to a side portion of said optical fiber guiding groove through an insulation layer having an refractive index higher than any parts of said optical waveguide layer.
Abstract:
A color cathode ray tube includes a phosphor screen, a shadow mask closely spaced from the phosphor screen and electron gun. The electron gun has a plurality of electrodes including a plurality of cathodes for emitting a plurality of in-line electron beams, a control grid having a plurality of in-line apertures centered with the cathodes, an accelerating electrode, a cup-shaped focus electrode and a cup-shaped anode fixed on insulating supports. Each of the cup-shaped focus electrode and anode has at a first end face thereof opposing the other of the cup-shaped focus electrode and anode, a single opening surrounded by a rim formed by turning in the end face thereof toward an interior thereof. Each of said cup-shaped focus electrode and anode has a correction plate electrode therein, has a step on an inner wall thereof at a position set back from the first end face thereof to provide a first portion having an inside diameter larger on an open end side thereof opposite the first end face, than that of a second portion thereof on a side of the first end face. The correction plate electrode is pressed against the step and fixed to the cup-shaped electrode, or is fixed in the second portion of the smaller inside diameter.
Abstract:
A semiconductor device having the SOI structure is provided, which enables to reduce the size of components compared with the conventional semiconductor devices. The device contains a first insulator film formed on a semiconductor substrate, and semiconductor islands formed on the first insulator film. Each of the islands has an electronic component. The device further contains semiconductor sidewalls formed to surround the respective islands. The sidewalls are contacted with outer sides of the corresponding islands. Electrodes are formed outside the islands to be contacted with the corresponding sidewalls. A second insulator film is formed on the exposed first insulator film from the islands to laterally isolate the respective islands and the corresponding sidewalls from each other. The electronic components are electrically connected to the respective electrodes through the corresponding sidewalls. Preferably, the components provided in the islands are bipolar transistors, and the electrodes are used as collector electrodes.
Abstract:
It is the object of the invention to suppress the leakage current of a semiconductor photodiode. A trench, a side wall of which is covered with and insulating layer, is formed on the surface of a semiconductor substrate of the first conductivity type. Then, an epitaxial layer of the second conductivity type is grown in the trench, where a PN-junction is constructed between the bottom surface of the epitaxial layer and the semiconductor substrate. An impurity diffusion layer of the second conductivity type with higher impurity concentration than that of an internal portion of the epitaxial semiconductor layer is formed over the side surface of the epitaxial layer of the second conductivity type. In the aforementioned structure, when a reverse bias voltage is applied to the PN-junction, a depletion layer does not extend to a neighborhood of the insulating layer, and a leakage current, which flows via surface states near the insulating layer.