公开(公告)号：US08575634B2

公开(公告)日：2013-11-05

申请号：US12981600

申请日：2010-12-30

Applicant: Tsang-Yu Liu ,  Yu-Lin Yen ,  Chuan-Jin Shiu ,  Po-Shen Lin

Inventor： Tsang-Yu Liu ,  Yu-Lin Yen ,  Chuan-Jin Shiu ,  Po-Shen Lin

IPC: H01L33/60 ,  H01L33/48

CPC classification number: H01L27/14618 ,  H01L21/76898 ,  H01L23/055 ,  H01L23/16 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention provides a chip package, including: a chip having a semiconductor device thereon; a cap layer over the semiconductor device; a spacer layer between the chip and the cap layer, wherein the spacer layer surrounds the semiconductor device and forms a cavity between the chip and the cap layer; and an anti-reflective layer between the cap layer and the chip, wherein the anti-reflective layer has a overlapping region with the spacer layer and extends into the cavity. Furthermore, a method for fabricating a chip package is also provided.

Abstract translation: 本发明提供了一种芯片封装，包括：其上具有半导体器件的芯片; 半导体器件上的覆盖层; 在所述芯片和所述盖层之间的间隔层，其中所述间隔层围绕所述半导体器件并且在所述芯片和所述盖层之间形成空腔; 以及在所述盖层和所述芯片之间的抗反射层，其中所述抗反射层具有与所述间隔层的重叠区域并延伸到所述空腔中。 此外，还提供了一种用于制造芯片封装的方法。

公开(公告)号：US20130107165A1

公开(公告)日：2013-05-02

申请号：US13381366

申请日：2011-11-03

Applicant: Po-Shen Lin ,  Liang-Chan Liao ,  Xin-Ming Gao

Inventor： Po-Shen Lin ,  Liang-Chan Liao ,  Xin-Ming Gao

IPC: G02F1/13357 ,  H05B37/00

CPC classification number: G09G3/34 ,  G09G3/3406 ,  H05B33/086

Abstract: The present invention provides a display device and an LED backlight driving circuit thereof. The LED backlight driving circuit includes a plurality of LED light strings connected in parallel; a switch module including switches; a power module, and a switching control module. The switching control module includes: a driving unit connected to the switches; a current detection unit connected to the switches; an ON time detection unit connected to the driving unit; a reference unit, the reference unit supplying a reference value; multipliers, each of which has two input terminals respectively connected to the ON time detection unit and the current detection unit to receive a ON time value of a corresponding one of the switches and a voltage signal indicating the current of the switch; and comparison units, each of which has two input terminals respectively connected to the reference unit and an output terminal of a corresponding one of the multipliers. Each of the comparison units has an output terminal connected to the driving unit. The driving unit controls the ON time of the switch corresponding to the comparison unit according to an output result of the comparison unit.

Abstract translation: 本发明提供一种显示装置及其LED背光驱动电路。 LED背光驱动电路包括并联连接的多个LED灯串; 包括开关的开关模块; 电源模块和开关控制模块。 开关控制模块包括：连接到开关的驱动单元; 连接到开关的电流检测单元; 连接到驱动单元的ON时间检测单元; 参考单元，所述参考单元提供参考值; 乘法器，其中每个具有分别连接到接通时间检测单元的两个输入端子和用于接收相应一个开关的接通时间值的电流检测单元和指示开关电流的电压信号; 以及比较单元，每个比较单元具有分别连接到参考单元的两个输入端子和相应的一个乘法器的输出端子。 每个比较单元具有连接到驱动单元的输出端子。 驱动单元根据比较单元的输出结果控制对应于比较单元的开关的接通时间。

公开(公告)号：US20130063912A1

公开(公告)日：2013-03-14

申请号：US13377789

申请日：2011-10-01

Applicant: Liang-Chan Liao ,  Po-Shen Lin ,  Yu Wu

Inventor： Liang-Chan Liao ,  Po-Shen Lin ,  Yu Wu

IPC: H05K7/06 ,  H05K13/04

CPC classification number: H05K13/0084 ,  B65D73/02 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

Abstract: A COF packaging method and structure for LCD driver chips, the packaging structure comprises a substrate tape and a plurality of COF packaging units arranged consecutively along a direction the substrate tape is moved. Each of the packaging units includes a LCD driver chip, and a first lead and a second lead electrically connected to the LCD driver chip and distributed along two sides of the LCD driver chip. The LCD driver chip of each of the packaging units is parallel to the moving direction of the substrate tape, the first lead and the second lead of each of the packaging units are extended along a width of the substrate tape. By the method, the number and intervals of the leads are not limited by the width dimension of the substrate tape, in order to suit the requirements of large-sized liquid crystal panels.

Abstract translation: 一种用于LCD驱动器芯片的COF封装方法和结构，所述封装结构包括基板带和沿着所述基板带移动的方向连续设置的多个COF封装单元。 每个包装单元包括LCD驱动器芯片，以及电连接到LCD驱动器芯片并沿着LCD驱动器芯片的两侧分布的第一引线和第二引线。 每个包装单元的LCD驱动器芯片平行于衬底带的移动方向，每个包装单元的第一引线和第二引线沿着衬底带的宽度延伸。 通过该方法，引线的数量和间隔不受衬底带的宽度尺寸的限制，以适应大尺寸液晶面板的要求。

公开(公告)号：US20130045549A1

公开(公告)日：2013-02-21

申请号：US13588898

申请日：2012-08-17

Applicant: Chuan-Jin SHIU ,  Po-Shen LIN ,  Shen-Yuan MAO ,  Cheng-Chi PENG

Inventor： Chuan-Jin SHIU ,  Po-Shen LIN ,  Shen-Yuan MAO ,  Cheng-Chi PENG

IPC: H01L33/60 ,  H01L31/0232

CPC classification number: H01L27/14618 ,  H01L2224/13 ,  H01L2933/0025

Abstract: An embodiment of the invention provides a method for forming a chip package which includes: providing a substrate having a first surface and a second surface, wherein at least one optoelectronic device is formed in the substrate; forming an insulating layer on the substrate; forming a conducting layer on the insulating layer on the substrate, wherein the conducting layer is electrically connected to the at least one optoelectronic device; and spraying a solution of light shielding material on the second surface of the substrate to form a light shielding layer on the second surface of the substrate.

Abstract translation: 本发明的一个实施例提供了一种用于形成芯片封装的方法，其包括：提供具有第一表面和第二表面的衬底，其中在衬底中形成至少一个光电器件; 在所述基板上形成绝缘层; 在所述基板上的所述绝缘层上形成导电层，其中所述导电层电连接到所述至少一个光电器件; 以及在所述基板的第二表面上喷射遮光材料的溶液，以在所述基板的第二表面上形成遮光层。

公开(公告)号：US20130001621A1

公开(公告)日：2013-01-03

申请号：US13536628

申请日：2012-06-28

Applicant: Chuan-Jin SHIU ,  Po-Shen LIN ,  Yi-Ming CHANG

Inventor： Chuan-Jin SHIU ,  Po-Shen LIN ,  Yi-Ming CHANG

IPC: H01L33/60

CPC classification number: H01L27/14618 ,  H01L27/1463 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

Abstract: An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a light shielding layer disposed on the second surface of the substrate and directly contacting with the conducting layer, wherein the light shielding layer has a light shielding rate of more than about 80% and has at least an opening exposing the conducting layer; and a conducting bump disposed in the opening of the light shielding layer to electrically contact with the conducting layer, wherein all together the light shielding layer and the conducting bump substantially and completely cover the second surface of the substrate.

Abstract translation: 本发明的实施例提供了一种芯片封装，其包括：具有第一表面和第二表面的基板; 形成在所述基板中的光电子器件; 设置在所述基板上的导电层，其中所述导电层电连接到所述光电子器件; 设置在所述基板和所述导电层之间的绝缘层; 遮光层，其设置在所述基板的所述第二表面上并与所述导电层直接接触，其中所述遮光层具有大于约80％的遮光率并且具有暴露所述导电层的至少一个开口; 以及布置在所述遮光层的开口中以与所述导电层电接触的导电凸块，其中所述遮光层和所述导电凸起部分都基本上完全覆盖所述基板的第二表面。

公开(公告)号：US20120313116A1

公开(公告)日：2012-12-13

申请号：US13379640

申请日：2011-08-31

Applicant: Liang-Chan Liao ,  Po-Shen Lin ,  Yu Wu

Inventor： Liang-Chan Liao ,  Po-Shen Lin ,  Yu Wu

IPC: H01L33/64 ,  H01L23/48

CPC classification number: G02F1/13452 ,  H01L23/36 ,  H01L24/32 ,  H01L2224/83447 ,  H01L2924/15788 ,  H01L2924/00

Abstract: A chip on film (COF) is disclosed in the present disclosure, which comprises an adhesive base layer, a driving integrated circuit (IC), an adhesive layer and a copper layer. The driving IC is embedded on a surface of the adhesive base layer; the adhesive layer is located under the adhesive base layer; the copper layer is located under the adhesive layer. The adhesive base layer is formed with a heat and pressure spreading structure. A heat and pressure spreading structure is disposed on the adhesive base layer of the COF so that deformation or unevenness of the glass substrate in the bonded area can be avoided when the COF is thermally pressed to the glass substrate of the LCD. These guarantees the consistency between the bonded area and the unbounded area, the bonded area and the unbounded area of the glass substrate will have the same transmissivity and luminance.

Abstract translation: 在本公开内容中公开了一种薄膜（COF），其包括粘合剂基层，驱动集成电路（IC），粘合剂层和铜层。 驱动IC嵌入在粘合剂基层的表面上; 粘合剂层位于粘合剂基层下方; 铜层位于粘合层下方。 粘合剂基层由热压扩散结构形成。 在COF的粘合剂基层上设置有热压扩散结构，使得当COF被热压到LCD的玻璃基板上时，可以避免在接合区域中的玻璃基板的变形或不均匀。 这些保证了接合面积和无界区域的一致性，玻璃基板的接合面积和无界面积将具有相同的透射率和亮度。