-
公开(公告)号:US10483702B2
公开(公告)日:2019-11-19
申请号:US16192139
申请日:2018-11-15
Applicant: Sentinel Connector Systems, Inc.
Inventor: Brett D. Robinson
IPC: H01R24/64 , H01R13/6474 , H01R13/66 , H01R43/20 , H05K1/02 , H05K1/09 , H05K1/11 , H05K1/16 , H01R13/6581 , H01R107/00
Abstract: A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
-
公开(公告)号:US20190089105A1
公开(公告)日:2019-03-21
申请号:US16192139
申请日:2018-11-15
Applicant: Sentinel Connector Systems, Inc.
Inventor: Brett D. Robinson
IPC: H01R24/64 , H05K1/02 , H05K1/16 , H05K1/11 , H01R13/66 , H01R13/6474 , H05K1/09 , H01R43/20 , H01R13/6581 , H01R107/00
CPC classification number: H01R24/64 , H01R13/6474 , H01R13/6581 , H01R13/6625 , H01R13/6658 , H01R43/205 , H01R2107/00 , H05K1/0218 , H05K1/0228 , H05K1/09 , H05K1/115 , H05K1/162 , Y10T29/49165
Abstract: A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
-
公开(公告)号:US10141698B2
公开(公告)日:2018-11-27
申请号:US15146008
申请日:2016-05-04
Applicant: Sentinel Connector Systems, Inc.
Inventor: Brett D. Robinson
IPC: H01R24/64 , H01R13/6474 , H01R43/20 , H05K1/02 , H05K1/09 , H05K1/11 , H05K1/16 , H01R13/6581 , H01R13/66 , H01R107/00
Abstract: A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
-
34.
公开(公告)号:US10014990B2
公开(公告)日:2018-07-03
申请号:US14223405
申请日:2014-03-24
Applicant: SENTINEL CONNECTOR SYSTEMS, INC.
Inventor: Brett D. Robinson
IPC: H04L1/24 , H01R13/6474 , H01R13/6469 , H05K1/02 , H01R24/64 , G01R1/04
CPC classification number: H04L1/24 , G01R1/0416 , H01R13/6469 , H01R13/6474 , H01R24/64 , H05K1/0228 , H05K1/025 , H05K2201/09027 , H05K2201/09236 , H05K2201/10189
Abstract: A testing unit including a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate and terminating at an end point, a plurality of termination points adjacent to the end points of the pin traces, a plurality of end traces having a height and a width with each end trace extending from an end point of a respective pin trace towards to a corresponding termination point near to the pin trace, a plurality of traces extending from the end of a respective end point or termination point to the edge of the substrate.
-
公开(公告)号:US20170324190A1
公开(公告)日:2017-11-09
申请号:US15586435
申请日:2017-05-04
Applicant: Sentinel Connector Systems, Inc.
Inventor: Justin WAGNER
IPC: H01R13/58 , H01R24/64 , H01R107/00
CPC classification number: H01R13/582 , H01R13/5816 , H01R13/5837 , H01R24/64 , H01R2107/00
Abstract: A communication plug including a plug body, a cavity in the plug body, the cavity having a first portion, a second portion and a third portion, a load bar having a plurality of openings on a front face of the load bar, where the cavity is sized to engage the load bar such that the load bar directs at least one wire inserted into a corresponding opening in the load bar into channels in the plug.
-
公开(公告)号:US09337592B2
公开(公告)日:2016-05-10
申请号:US14504088
申请日:2014-10-01
Applicant: Sentinel Connector Systems, Inc.
Inventor: Brett D. Robinson
IPC: H01R24/64 , H01R13/6474 , H01R13/6581 , H01R13/66
CPC classification number: H01R24/64 , H01R13/6474 , H01R13/6581 , H01R13/6625 , H01R13/6658 , H01R43/205 , H01R2107/00 , H05K1/0218 , H05K1/0228 , H05K1/09 , H05K1/115 , H05K1/162 , Y10T29/49165
Abstract: A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug and a shielding case surrounding the housing. A flexible circuit board between the shielding case and the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a first side of the substrate, with each trace extending from a corresponding one of the plurality of vias, and a shielding plane on a second side of the substrate opposite the first side of the substrate.
Abstract translation: 一种高速通信插座,包括:壳体,其包括用于接收插头的端口,所述端口包括多个引脚,每个引脚均连接到插头中的相应信号线;以及围绕外壳的屏蔽壳。 在屏蔽壳体和壳体之间的柔性电路板具有衬底,多个通孔延伸穿过衬底,每个通孔被配置为容纳壳体上的销,衬底的第一侧上的多个迹线,每个 从所述多个通孔中的相应一个延伸的迹线以及在所述基板的与所述基板的所述第一侧相对的第二侧上的屏蔽平面。
-
公开(公告)号:US20150017837A1
公开(公告)日:2015-01-15
申请号:US14504088
申请日:2014-10-01
Applicant: Sentinel Connector Systems, Inc.
Inventor: Brett D. Robinson
IPC: H01R24/64 , H01R43/20 , H01R13/6473 , H01R13/6581 , H01R12/77 , H01R13/66
CPC classification number: H01R24/64 , H01R13/6474 , H01R13/6581 , H01R13/6625 , H01R13/6658 , H01R43/205 , H01R2107/00 , H05K1/0218 , H05K1/0228 , H05K1/09 , H05K1/115 , H05K1/162 , Y10T29/49165
Abstract: A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug and a shielding case surrounding the housing. A flexible circuit board between the shielding case and the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a first side of the substrate, with each trace extending from a corresponding one of the plurality of vias, and a shielding plane on a second side of the substrate opposite the first side of the substrate.
Abstract translation: 一种高速通信插座,包括:壳体,其包括用于接收插头的端口,所述端口包括多个引脚,每个引脚均连接到插头中的相应信号线;以及围绕外壳的屏蔽壳。 在屏蔽壳体和壳体之间的柔性电路板具有衬底,多个通孔延伸穿过衬底,每个通孔被配置为容纳壳体上的销,衬底的第一侧上的多个迹线,每个 从所述多个通孔中的相应一个延伸的迹线以及在所述基板的与所述基板的所述第一侧相对的第二侧上的屏蔽平面。
-
公开(公告)号:US20250062563A1
公开(公告)日:2025-02-20
申请号:US18934469
申请日:2024-11-01
Applicant: Sentinel Connector Systems, Inc.
Inventor: Randy Schwartz , Robert Brennan
IPC: H01R13/502 , H01R24/64 , H01R43/18
Abstract: A modular plug system including a plug housing including a top surface, bottom surface and two opposing side surfaces, a front end having a cavity formed in the front end and an opening opposite the front end, and a cavity extending from the front end to the opening in the back end, and a cap unit that is inserted into the front end such that a surface of the front end is co-planer with the front surface of the cap unit, where the cavity has a back surface that is recessed from the front surface of the plug.
-
公开(公告)号:US12051878B2
公开(公告)日:2024-07-30
申请号:US17396311
申请日:2021-08-06
Applicant: Sentinel Connector Systems, Inc.
Inventor: Brett D Robinson
IPC: H01R24/64 , H01R13/646 , H01R13/6474 , H01R13/66 , H01R13/7195 , H01R43/20 , H05K1/02 , H05K1/09 , H05K1/11 , H05K1/16 , H01R13/6581 , H01R107/00
CPC classification number: H01R24/64 , H01R13/646 , H01R13/6474 , H01R13/6625 , H01R13/7195 , H01R43/205 , H05K1/0218 , H05K1/0228 , H05K1/09 , H05K1/115 , H05K1/162 , H01R13/6581 , H01R13/6658 , H01R2107/00 , Y10T29/49165 , Y10T29/49218
Abstract: A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
-
公开(公告)号:US11495921B2
公开(公告)日:2022-11-08
申请号:US17188341
申请日:2021-03-01
Applicant: Sentinel Connector Systems, Inc.
Inventor: Robert Brennan , Justin Wagner , Brett Robinson
IPC: H01R13/70 , H01R13/713 , H01R13/627
Abstract: An arc prevention system including a jack having a receptacle, a modular connector sized to be positioned in the receptacle of the jack, the modular connector including a plurality of contacts, with at least two of the contacts creating an energized electrical path with an external power source in electrical communication with the external power source, a latch extending from a top surface of the modular connector, a switching unit positioned on the latch, a plug unit positioned between the latch and the jack that prevents the modular connector from moving out of the receptacle, a control circuit in electrical communication with switch and the at least two energized contacts, where the electrical path between the control circuit and the switching unit is energized when the plug engages the switching unit on the latch, and the control circuit adjusts the energized electrical path to a predetermined electrical level.
-
-
-
-
-
-
-
-
-