Abstract:
One embodiment includes a non-volatile memory cell array, and a read unit configured to disable read operation for the non-volatile memory cell array for a time period following writing of data in the non-volatile memory cell array.
Abstract:
In one embodiment, the semiconductor device includes a non-volatile memory cell array, a write circuit configured to write to the non-volatile memory cell array, and a control circuit. The control circuit is configured to store at least one erase indicator. The erase indicator is associated with at least a portion of the non-volatile memory cell array and indicates a logic state. The control circuit is configured to control the write circuit to write the logic state indicated by the erase indicator in the non-volatile memory cell array during an erase operation of the associated portion of the non-volatile memory cell array.
Abstract:
The present invention can magnify a sealing characteristic and prevent deformation of hard rubber by coupling a container body with a rib formed on an external cap and through double-injection molding by an elastomer having a different elastic restoring force from the hard rubber charged and hardened in an injection concave groove of a support body that accommodates an internal container, in order to maximize product reliability by improving a sealing structure of a make-up base container or a cosmetic container and providing a clear air-tight effect since the sealing structure cannot be transformed even in case of long-term use. Further, the invention provides regular and firm adhesion without the unequal distribution of the coupling intensity between internal sealing members when the external cap is closed, such that superior sealing performance is accomplished even in case of long-term use and an aesthetic point on the appearance is increased since an opening and closing means is not necessary, and further, it is possible to solve the unstable storage state which is caused when the opening and closing means is equipped.
Abstract:
A method for manufacturing a lateral double diffused metal oxide semiconductor (LDMOS) device includes forming an oxide layer on a semiconductor substrate, forming first and second trenches by partially etching the oxide layer and the semiconductor substrate, forming a small trench overlapping with the second trench so that the second trench has a stepped structure, and depositing one or more dielectric layers so that the first trench forms a device isolation layer defining a semiconductor device region and the second trench having a stepped structure forms a drain extension device isolation layer. The breakdown voltage of the LDMOS device may be improved while reducing the on-resistance, thereby improving the operational reliability of the device.
Abstract:
A nonvolatile memory device comprises a one-time-programmable (OTP) lock bit register. The nonvolatile memory device comprises a variable-resistance memory cell array comprising an OTP block that store data and a register that stores OTP lock state information indicating whether the data is changeable. The register comprises a variable memory cell. An initial value of the OTP lock state information is set to a program protection state.
Abstract:
A capacitor of a semiconductor device and a method for manufacturing the same includes a lower metal layer on and/or over a semiconductor substrate; an insulating layer formed on and/or over the lower metal layer with step difference; and an upper electrode on and/or over the insulating layer pattern, wherein a top corner of the upper electrode is rounded so that a curvature pattern is formed on the top corner of the upper electrode.
Abstract:
A lateral double diffused metal oxide semiconductor (LDMOS) device and a method of manufacturing the same. A LDMOS device may include a high voltage well formed over a substrate, a reduced surface field region formed thereover which may be adjacent a body region, and/or an isolation layer. An isolation layer may include a predetermined area formed over a reduced surface field region, may be partially overlapped with a top surface of a substrate and/or may include an area formed adjacent a high voltage well. A low voltage well may be formed over a substrate. A gate electrode may extend from a predetermined top surface of a body region to a predetermined top surface of an isolation layer. A drain region may be formed over a low voltage well. A source region may be formed over a body region and may have at least a portion formed under a gate electrode.
Abstract:
A method for manufacturing a lateral double diffused metal oxide semiconductor (LDMOS) device includes forming an oxide layer on a semiconductor substrate, forming first and second trenches by partially etching the oxide layer and the semiconductor substrate, forming a small trench overlapping with the second trench so that the second trench has a stepped structure, and depositing one or more dielectric layers so that the first trench forms a device isolation layer defining a semiconductor device region and the second trench having a stepped structure forms a drain extension device isolation layer. The breakdown voltage of the LDMOS device may be improved while reducing the on-resistance, thereby improving the operational reliability of the device.
Abstract:
Embodiments of the invention include a MIM capacitor that has a high capacitance that can be manufactured without the problems that affected the prior art. Such a capacitor includes an upper electrode, a lower electrode, and a dielectric layer that is intermediate the upper and the lower electrodes. A first voltage can be applied to the upper electrode and a second voltage, which is different from the first voltage, can be applied to the lower electrode. A wire layer, through which the first voltage is applied to the upper electrode, is located in the same level as or in a lower level than the lower electrode.
Abstract:
The continuously variable transmission (CVT) includes an input shaft delivering power from an engine, an output shaft having a first drive member, and a secondary shaft having a first driven member operationally connected with the first drive member. The CVT further includes a pulley member transferring power from the input shaft to the secondary shaft. The pulley member includes a drive pulley and a driven pulley operationally connected to the drive pulley. The pulley member forms a first power pathway for communicating the engine power from the input shaft to the output shaft via the secondary shaft. The CVT also includes a power by-pass member for selectively supplying power from the input shaft directly to the output shaft to form a second power pathway for communicating the engine power from the input shaft directly to the output shaft which by-passes the first power pathway.