公开(公告)号：US10553258B2

公开(公告)日：2020-02-04

申请号：US16229406

申请日：2018-12-21

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： Wei Huang

IPC: G11C7/04 ,  H01L23/38 ,  H01L35/32 ,  H01L27/16 ,  H01L27/108

Abstract: Managing temperature of a semiconductor device having a temperature inverted processor core and stacked memory by operation of an integrated thermoelectric cooler. The thermoelectric cooler is operated to pump heat from a stacked memory device that requires a cool operating temperature to a temperature inverted processor core that maintains a higher operating temperature until threshold operating temperatures are achieved.

公开(公告)号：US10389251B2

公开(公告)日：2019-08-20

申请号：US16130136

申请日：2018-09-13

Applicant: Advanced Micro Devices, Inc.

Inventor： Wei Huang ,  Yasuko Eckert ,  Xudong An ,  Muhammad Shoaib Bin Altaf ,  Jieming Yin

IPC: H02M3/158 ,  G05F1/56 ,  G05F1/46 ,  G05F1/575 ,  H02M1/00

Abstract: The described embodiments include an apparatus that controls voltages for an integrated circuit chip having a set of circuits. The apparatus includes a switching voltage regulator separate from the integrated circuit chip and two or more low dropout (LDO) regulators fabricated on the integrated circuit chip. The switching voltage regulator provides an output voltage that is received as an input voltage by each of the two or more LDO regulators, and each of the two or more LDO regulators provides a local output voltage, each local output voltage received as a local input voltage by a different subset of the circuits in the set of circuits. During operation, a controller sets an operating point for each of the subsets of circuits based on a combined power efficiency for the subsets of the circuits and the LDO regulators, each operating point including a corresponding frequency and voltage.

公开(公告)号：US20180088606A1

公开(公告)日：2018-03-29

申请号：US15274697

申请日：2016-09-23

Applicant: Advanced Micro Devices, Inc.

Inventor： Wei Huang ,  Yazhou Zu ,  Indrani Paul

IPC: G05D23/19 ,  G06F1/28

CPC classification number: G06F1/28 ,  G06F1/3206 ,  G06F1/3296 ,  Y02D10/172

Abstract: A method and apparatus for managing processing power determine a supply voltage to supply to a processing unit, such as a central processing unit (CPU) or graphics processing unit (GPU), based on temperature inversion based voltage, frequency, temperature (VFT) data. The temperature inversion based VFT data includes supply voltages and corresponding operating temperatures that cause the processing unit's transistors to operate in a temperature inversion region. In one example, the temperature inversion based VFT data includes lower supply voltages and corresponding higher temperatures in a temperature inversion region of a processing unit. The temperature inversion based VFT data is based on an operating frequency of the processing unit. The apparatus and method adjust a supply voltage to the processing unit based on the temperature inversion based VFT data.

公开(公告)号：US20170083065A1

公开(公告)日：2017-03-23

申请号：US14862044

申请日：2015-09-22

Applicant: Advanced Micro Devices, Inc.

Inventor： Wei Huang ,  Manish Arora ,  Yasuko Eckert ,  Indrani Paul

IPC: G06F1/20 ,  G06F1/32 ,  G06T1/20

CPC classification number: G06F1/206 ,  G06F1/3206 ,  G06F1/3234 ,  G06F1/324 ,  G06F1/3296 ,  G06F11/3024 ,  G06F11/3058

Abstract: A three-dimensional (3-D) processor stack includes a plurality of processor cores implemented in a plurality of layers. A controller is to selectively throttle one or more of a plurality of processor cores in response to detecting a thermal event. The controller selectively throttles the one or more of the plurality of processor cores based on values of thermal couplings between the plurality of layers and based on measures of criticality of threads executing on the plurality of processor cores.