摘要:
A semiconductor device has a driver device (10) in proximity to a power device (12). In making the semiconductor device, an N+ layer (24) is formed on a substrate (22). A portion of the N+ layer is removed, substantially down to the substrate, to provide a layer offset (28) between the driver device area and the power device area. An epi region of uniform thickness is formed over the driver device and power device areas. The epi region has a similar offset as the layer offset. The epi region is planarized so that the epi region over the power device area has less thickness than the epi region over the driver device area. The driver devices are formed in first and second wells (36, 38) in the thicker area of the epi region. The power device is formed in the third well (40) in the thinner area of the epi region.
摘要翻译:半导体器件具有靠近功率器件(12)的驱动器器件(10)。 在制造半导体器件时,在衬底(22)上形成N +层(24)。 N +层的一部分基本上被去除到衬底,以在驱动器器件区域和功率器件区域之间提供层偏移(28)。 在驱动器设备和功率器件区域上形成均匀厚度的外延区域。 epi区域具有与层偏移相似的偏移。 epi区域被平坦化,使得功率器件区域上的epi区域具有比驱动器器件区域上的epi区域更小的厚度。 驱动器器件形成在第一和第二阱(36,38)中,在epi区域的较厚区域中。 功率器件形成在epi区域的较薄区域中的第三阱(40)中。
摘要:
An edge termination structure is created by forming trench structures (14) near a PN junction. The presence of the trench structures (14) extends a depletion region (13) between a doped region (12) and a body of semiconductor material or a semiconductor substrate (11) of the opposite conductivity type away from the doped region (12). This in turn forces junction breakdown to occur in the semiconductor bulk, leading to enhancement of the breakdown voltage of a semiconductor device (10). A surface of the trench structures (14) is covered with a conductive layer (16) which keeps the surface of the trench structures (14) at an equal voltage potential. This creates an equipotential surface across each of the trench structures (14) and forces the depletion region to extend laterally along the surface of semiconductor substrate (11). The conductive layers (16) are electrically isolated from an electrical contact (17) which contacts the doped region (12) and from the conductive layers (16) of neighboring trench structures (14).
摘要:
A semiconductor component includes a semiconductor layer (110) having a trench (326). The trench has first and second sides. A portion (713) of the semiconductor layer has a conductivity type and a charge density. The semiconductor component also includes a control electrode (540, 1240) in the trench. The semiconductor component further includes a channel region (120) in the semiconductor layer and adjacent to the trench. The semiconductor component still further includes a region (755) in the semiconductor layer. The region has a conductivity type different from that of the portion of the semiconductor layer. The region also has a charge density balancing the charge density of the portion of the semiconductor layer.
摘要:
The switching speed of bipolar power rectifiers is increased by formation of misfit dislocations in the depletion region, spaced from the substrate/epitaxial layer interface, in order to reduce minority carrier lifetime. The misfit dislocations are formed by the introduction of germanium during epitaxy, and are distributed along the silicon/silicon-germanium interface. Preferably, the germanium containing layer is located proximate the center of the depletion region.
摘要:
In one embodiment, a bi-directional ESD device is formed to have a third harmonic at frequencies no less than about one gigahertz wherein the third harmonic has a magnitude that is no greater than about minus thirty five dBm.
摘要:
A junction field effect transistor (JFET) has a gate region, drain region, and a source region. An epitaxial region having a first conductivity type is disposed over the drain region. The first conductivity type is N-type semiconductor material. The gate region is disposed within a trench which is formed in the epitaxial region. A P+ region is disposed within the epitaxial region and under the gate region. The P+ region has a first doping concentration of a second conductivity type opposite the first conductivity type. A P− region is disposed under the P+ region. The P− region has a second doping concentration of the second conductivity type which is less than the first doping concentration. The P− region may be disposed adjacent to a first portion of the P+ region while another P− region is disposed adjacent to a second portion of the P+ region. The P+ region may be implanted from the gate region deep into the epitaxial region.
摘要翻译:结型场效应晶体管(JFET)具有栅极区域,漏极区域和源极区域。 具有第一导电类型的外延区域设置在漏极区域上。 第一导电类型是N型半导体材料。 栅极区域设置在形成在外延区域中的沟槽内。 P +区域设置在外延区域内并在栅极区域下方。 P +区域具有与第一导电类型相反的第二导电类型的第一掺杂浓度。 P区域设置在P +区域的下方。 P-区具有小于第一掺杂浓度的第二导电类型的第二掺杂浓度。 P-区可以被布置成与P +区的第一部分相邻,而另一个P-区邻近P +区的第二部分设置。 P +区域可以从栅极区域深深地注入到外延区域中。
摘要:
A semiconductor device has a driver device (10) in proximity to a power device (12). In making the semiconductor device, an N+ layer (24) is formed on a substrate (22). A portion of the N+ layer is removed, substantially down to the substrate, to provide a layer offset (28) between the driver device area and power device area. An epi region of uniform thickness is formed over the driver device and power device areas. A portion of the epi layer is removed to provide another layer offset (70). An oxide layer (68) of uniform thickness is formed over the epi region. The oxide layer is planarized to remove oxide layer over the N+ layer. An oxide-filled trench (80) is formed between the driver device and the power device. The oxide-filled trench extends down to the oxide layer to isolate the driver device from the power device.
摘要:
A transistor (30) uses a single continuous base region (40) with an undulating structure. The semiconductor device is an insulated gate field effect transistor having a semiconductor substrate with a plurality of doped base branches, which extend into the semiconductor substrate, form into a single base region for the entire transistor. Each of the plurality of base branches (82) is undulating and of substantially constant width, and each of the base branches undulates in-phase with the immediately adjacent base branches. A continuous gate layer (34) overlies the semiconductor substrate and is self-aligned to the plurality of base branches. The undulating structure of the base region improves channel density, and thus lowers on-resistance, and the use of a single base region ensures that all portions of the base region throughout the device will be at a substantially constant electric potential.