USING LIGHT COUPLING PROPERTIES FOR MACHINE-LEARNING-BASED FILM DETECTION

    公开(公告)号:US20220388112A1

    公开(公告)日:2022-12-08

    申请号:US17825839

    申请日:2022-05-26

    Abstract: Exemplary semiconductor processing systems may include a substrate support defining an aperture therethrough. The processing systems may include a light assembly having a light source that emits an optical signal that is directed toward the aperture. The optical signal may have a high angle of incidence relative to the substrate support. The processing systems may include a photodetector aligned with an angle of reflectance of the optical signal. A controller for the processing system may be programmed to receive an amount of the optical signal received by the photodetector and determine a thickness of the outermost layer of film. The controller may include a model trained to classify based on the optical signal. The output of the model may be used to control a process performed on the substrate.

    COLOR IMAGING FOR CMP MONITORING
    34.
    发明申请

    公开(公告)号:US20200151868A1

    公开(公告)日:2020-05-14

    申请号:US16744058

    申请日:2020-01-15

    Abstract: A metrology technique for analyzing a substrate includes storing data indicating a boundary of an area in a 2-dimensional color space having a pair of color channels including a first color channel and a second color channel as axes of the color space, receiving color data of a substrate from a camera, generating a color image of the substrate from the color data, performing a comparison of a pair of color values for the pair of color channels for the pixel to the boundary of the area in the 2-dimensional color space for each pixel of a plurality of pixels of the color image to determine whether the pair of color values meet thresholds provided by the boundary, and generating a signal to an operator based on results of the comparison for the plurality of pixels.

    Consumable Part Monitoring in Chemical Mechanical Polisher

    公开(公告)号:US20190283209A1

    公开(公告)日:2019-09-19

    申请号:US16294486

    申请日:2019-03-06

    Abstract: A polishing apparatus includes a polishing station to hold a polishing pad, a carrier head to hold a substrate in contact with a polishing pad at the polishing station, a camera positioned to capture an image of a lower surface of a consumable part when the consumable part moves away from the polishing pad, and a controller configured to perform an image processing algorithm on the image to determine whether the consumable part is damaged. The consumable part can be a retaining ring on a carrier head, or a conditioner disk on a conditioner head.

    Thickness measurement of substrate using color metrology

    公开(公告)号:US10325364B2

    公开(公告)日:2019-06-18

    申请号:US15686785

    申请日:2017-08-25

    Abstract: A metrology system for obtaining a measurement representative of a thickness of a layer on a substrate includes a camera positioned to capture a color image of at least a portion of the substrate. A controller is configured to receive the color image from the camera, store a predetermined path in a coordinate space of at least two dimension including a first color channel and a second color channel, store a function that provides a value representative of a thickness as a function of a position on the predetermined path, determine a coordinate of a pixel in the coordinate space from color data in the color image for the pixel, determine a position of a point on the predetermined path that is closest to the coordinate of the pixel, and calculate a value representative of a thickness from the function and the position of the point on the predetermined path.

    INDUCTIVE MONITORING OF CONDUCTIVE LOOPS
    38.
    发明申请

    公开(公告)号:US20190035699A1

    公开(公告)日:2019-01-31

    申请号:US16150009

    申请日:2018-10-02

    Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.

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