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公开(公告)号：US20250093699A1
公开(公告)日：2025-03-20
申请号：US18291783
申请日：2022-06-30
Inventor： Qiaoke ZHOU , Xiang LI , Bochang WANG , Guojian QU , Tanhong ZHAO , Gang LI , Hui LI
IPC: G02F1/1335 , G02F1/13357
Abstract: A display device includes a display substrate including a display region and a bezel region surrounding the display region, a portion of bezel region serving as a binding region, the display substrate including a ground terminal; an opposite substrate opposite to the display substrate, the orthographic projection of opposite substrate exposes the binding region; the opposite substrate includes a black matrix, an electrostatic shielding layer; the black matrix includes a first opening of which the orthographic projection is in the bezel region, the first opening separates the black matrix in a first direction intersecting with the direction from the display region to the binding region; a conductive adhesive connecting the ground terminal and the electrostatic shielding layer, the orthographic projection of conductive adhesive is in the bezel region, the conductive adhesive in contact with the side of black matrix facing toward the binding region and perpendicular to the display substrate.
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公开(公告)号：US20250006873A1
公开(公告)日：2025-01-02
申请号：US18260656
申请日：2022-06-20
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Wei LI , Mingxing WANG , Xiao ZHANG , Minghua XUAN , Can ZHANG , Can WANG , Dongliang ZHANG , Qian JIN , Xiang LI , Jingjing ZHANG , Jinfei NIU
Abstract: A chip structure is provided. The chip structure includes: a chip wafer unit and a color conversion layer unit arranged on a light-exit side of the chip wafer unit. The chip wafer unit includes a plurality of sub-pixel light-emitting function layers. The color conversion layer unit includes color conversion layers arranged on the light-exit side of the chip wafer unit. The chip structure further includes: an attaching layer, arranged between the chip wafer unit and the color conversion layer unit and configured to attach the chip wafer unit and the color conversion layer unit.
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公开(公告)号：US20240413274A1
公开(公告)日：2024-12-12
申请号：US18261680
申请日：2022-05-31
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Wei LI , Mingxing WANG , Qian SUN , Huajie YAN , Zhiqiang JIAO , Xuan LIANG , Qian JIN , Xiang LI , Can WANG , Minghua XUAN , Can ZHANG
Abstract: A chip structure is provided. The chip structure includes a chip wafer unit and a color conversion layer substrate unit arranged on a light-exit side of the chip wafer unit. The chip wafer unit includes a plurality of sub-pixel light-emitting functional layers. The color conversion layer substrate unit includes a color conversion layer arranged on the light-exit side of the chip wafer unit. The chip wafer unit further includes a first bonding layer, arranged between the sub-pixel light-emitting functional layers and the color conversion layer, and configured to bond the chip wafer unit and the color conversion layer substrate unit.
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公开(公告)号：US20240177634A1
公开(公告)日：2024-05-30
申请号：US17791226
申请日：2021-08-27
Applicant: BOE Technology Group Co., Ltd.
Inventor： Yang YUE , Wei WANG , Ruoyu MA , Shunhang ZHANG , Chuanxiang XU , Xiang LI , Yong YU , Shi SHU , Qi YAO
Abstract: The present disclosure provides a display backplane and a preparation method therefor, and a display apparatus. The display backplane includes a plurality of display units, at least one display unit includes a pixel area and a light transmitting area, the pixel area is configured to perform image display and the light transmitting area is configured to transmit light; and in a plane perpendicular to the display backplane, the light transmitting area includes a substrate and a light transmitting structure layer arranged on the substrate, and the light transmitting structure layer is provided with light transmitting holes.
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35.发明申请公开(公告)号：US20230011316A1
公开(公告)日：2023-01-12
申请号：US17780701
申请日：2021-06-03
Inventor： Chuanxiang XU , Shi SHU , Qi YAO , Guangcai YUAN , Haitao HUANG , Xiang LI , Yong YU , Yang YUE , Qingyu HUANG
Abstract: A display substrate includes a base; and a first display region and a second display region disposed on the base, where a light transmittance of the first display region is greater than a light transmittance of the second display region, and the first display region includes one or more first sub-regions and one or more second sub-regions; where the one or more first sub-regions include a plurality of first sub-pixels, and each of the first sub-pixels includes a first electrode disposed on the base, a light emitting layer disposed on the first electrode, and a second electrode disposed on the light emitting layer. A display panel, a display device and a method of manufacturing a display substrate are further disclosed.
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Patent Agency Ranking
公开(公告)号：US20220328578A1
公开(公告)日：2022-10-13
申请号：US17417299
申请日：2020-09-24
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Xiang LI , Wei HE , Haowei ZOU , Shi SHU , Chuanxiang XU , Yong YU , Yang YUE , Haitao HUANG , Qi YAO
Abstract: A display substrate, a display panel and a manufacturing method thereof, and a display device are disclosed. The display substrate includes: a first substrate; a pixel defining layer on the first substrate and having pixel openings; and light emitting devices in one-to-one correspondence with the pixel openings. The light emitting device includes a first electrode and a light emitting function layer, the first electrode is between the pixel defining layer and the first substrate, and includes a main body portion exposed by the pixel opening; the light emitting function layer is in the pixel opening and on a side of the main body portion away from the first substrate, at least a part of the light emitting function layer directly faces the main body portion, and the part of the light emitting function layer directly facing the main body portion is a curved film layer protruding towards the first substrate.
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公开(公告)号：US20220278174A1
公开(公告)日：2022-09-01
申请号：US17628516
申请日：2021-03-09
Applicant: BOE Technology Group Co., Ltd.
Inventor： Yong YU , Shi SHU , Qi YAO , Guangcai YUAN , Chuanxiang XU , Yang YUE , Haitao HUANG , Xiang LI
IPC: H01L27/32 , G02F1/13357 , G02F1/1335 , G02F1/1343 , H01L51/52
Abstract: Provided are a display apparatus and a manufacturing method therefor, the display apparatus comprising: a plurality of mutually independent subpixel regions; a light source (101), light emitted from the light source (101) illuminating the subpixel regions; and a light control layer (102), which is located on a light exiting side of the light source (101), the light control layer (102) comprising: color conversion structures (1021) located at the subpixel regions, the color conversion structures (1021) each comprising a nanoporous material and at least a color conversion material distributed among the nanoporous material, the color conversion material being used to convert light emitted from the light source (101) into light of a color corresponding to the subpixel region where the light is located.
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公开(公告)号：US20210376003A1
公开(公告)日：2021-12-02
申请号：US17232167
申请日：2021-04-16
Inventor： Chuanxiang XU , Shi SHU , Haitao HUANG , Yang YUE , Yong YU , Xiang LI , Qi YAO
Abstract: Provided are a display panel, a manufacturing method thereof and a display apparatus. The display panel includes a fingerprint identification sensor, a first light shield layer disposed on the fingerprint identification sensor and a color film layer disposed on the first light shield layer, wherein the color film layer includes color filters with different colors and light transmission parts disposed between the color filters with different colors; the first light shield layer includes first openings and light shield parts, the light transmission parts and the first openings are used for allowing fingerprint reflected light to transmit and reach the fingerprint identification sensor, and the light shield parts are used for blocking out stray light.
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39.发明申请公开(公告)号：US20210305073A1
公开(公告)日：2021-09-30
申请号：US17264902
申请日：2020-05-29
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Yang YUE , Tong YANG , Shi SHU , Yong YU , Haitao HUANG , Xiang LI , Qi YAO , Xue JIANG , Guangcai YUAN
IPC: H01L21/67 , H01L27/20 , H01L41/08 , H01L41/09 , H01L41/314 , H01L25/075 , H01L33/62 , B65G47/90
Abstract: Provided in the embodiments are a transfer structure and a manufacturing method thereof, and a transfer device and a manufacturing method thereof. The transfer structure includes: a first electrode, a piezoelectric layer, a second electrode and an adhesive layer stacked on a substrate in sequence, wherein the first electrode and the second electrode are insulated from each other. The transfer structure further includes: a position-limiting layer, wherein the position-limiting layer includes a cavity; the piezoelectric layer and at least part of the adhesive layer are located in the cavity of the position-limiting layer; and in the direction perpendicular to the substrate, the distance between the surface, away from the substrate, of the position-limiting layer and the substrate is greater than the distance between the surface, away from the substrate, of the adhesive layer and the substrate.
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公开(公告)号：US20210225901A1
公开(公告)日：2021-07-22
申请号：US17059501
申请日：2020-03-11
Inventor： Wenqian LUO , Xiang LI , Zhanchang BU
Abstract: The manufacturing method of the driving backplane includes following steps. A first flexible base is formed on a surface of a rigid substrate. At least one type of conductive pattern is formed on a surface of the first flexible base. At least one type of first via is provided in the rigid substrate. At least one type of second via is provided in the first flexible base by using the rigid substrate as a mask and a conductive pillar is formed in the at least one type of second via, so that the conductive pillars are connected to respective types of conductive pattern in one-to-one correspondence. At least one type of driving chip is correspondingly bonded to the conductive pillar formed in the at least one type of second via from a side of the first flexible base away from the at least one type of conductive pattern.
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