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    MEMS SWITCH AND ELECTRONIC DEVICE
    33.
    发明申请
    MEMS SWITCH AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20250136434A1

    公开(公告)日：2025-05-01

    申请号：US18689528

    申请日：2023-02-16

    Applicant: Beijing BOE Technology Development Co., Ltd. ,  BOE Technology Group Co., Ltd.

    Inventor： Yingli SHI ,  Yanzhao LI

    IPC: B81B3/00

    Abstract: Embodiments of the present disclosure provide an MEMS switch and an electronic device. The MEMS switch includes: a base substrate; an electrode structure on the base substrate, including a first ground electrode, a signal transmission line, a second ground electrode, a first drive electrode and a third ground electrode which are sequentially arranged on the base substrate at intervals; and a metal beam stretching over the electrode structure, where a first end of the metal beam is electrically connected to the third ground electrode, an orthographic projection of a second end of the metal beam on the base substrate is within an orthographic projection of the signal transmission line on the base substrate, and an orthographic projection of the metal beam on the base substrate is overlapped with an orthographic projection of the first drive electrode on the base substrate.

    LINEWIDTH MEASUREMENT MTHOD AND APPARATUS, COMPUTING AND PROCESSING DEVICE, COMPUTER PROGRAM AND COMPUTER READABLE MEDIUM
    35.
    发明公开
    LINEWIDTH MEASUREMENT MTHOD AND APPARATUS, COMPUTING AND PROCESSING DEVICE, COMPUTER PROGRAM AND COMPUTER READABLE MEDIUM 审中-公开

    公开(公告)号：US20240221201A1

    公开(公告)日：2024-07-04

    申请号：US17921535

    申请日：2021-10-29

    Applicant: BOE Technology Group Co., Ltd.

    Inventor： Sifan WANG ,  Yulan HU ,  Yanzhao LI ,  Chao ZHOU ,  Tuo SUN ,  Longfei LI ,  Shuo ZHANG ,  Zhenzhong ZHANG ,  Cuifang ZHANG

    IPC: G06T7/62 ,  G06T5/30 ,  G06T7/13 ,  G06T7/187

    CPC classification number: G06T7/62 ,  G06T5/30 ,  G06T7/13 ,  G06T7/187 ,  G06T2207/20036

    Abstract: A linewidth measurement method and apparatus, a computing and processing device, a computer program and a computer readable medium are provided for measuring a width of a line. The linewidth measurement method includes: obtaining a target image of the line, the line including a first line segment; performing region connecting on an edge image or binary image of the target image to obtain a region connected image, the region connected image including a target connected region corresponding to a pattern of the line, and a pixel value of each pixel in the target connected region being different from that of each pixel outside the target connected region; determining a first edge point and a second edge point of the first line segment based on the region connected image, the first edge point being located on a first edge line of the first line segment, the second edge point being located on a second edge line of the second line segment, and the first edge line and the second edge line being oppositely arranged in a first direction; and determining a width of the first line segment according to the first edge point and the second edge point, and determining the width of the line according to the width of the first line segment.

    ULTRASONIC TRANSDUCER UNIT AND MANUFACTURING METHOD THEREOF
    37.
    发明申请
    ULTRASONIC TRANSDUCER UNIT AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20220347721A1

    公开(公告)日：2022-11-03

    申请号：US17427358

    申请日：2020-10-30

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Hui HUA ,  Yanzhao LI

    IPC: B06B1/02

    Abstract: The present disclosure provides an ultrasonic transducer unit and a manufacturing method thereof. The ultrasonic transducer unit includes a substrate, a first electrode arranged on the substrate, an insulating layer arranged on the first electrode, a vibrating film arranged on the insulating layer, a closed cavity being between the vibrating film and the insulating layer, and a second electrode arranged on the vibrating film. The vibrating film is made of a photoresist. The ultrasonic transducer unit disclosed by the present disclosure adopts the photoresist as a material of the insulating layer and/or the vibrating film, so that the ultrasonic transducer unit with better performance can be obtained.

    LIQUID CRYSTAL ANTENNA, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
    38.
    发明申请
    LIQUID CRYSTAL ANTENNA, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20200243969A1

    公开(公告)日：2020-07-30

    申请号：US16754316

    申请日：2019-04-29

    Applicant: BOE Technology Group Co., Ltd.

    Inventor： Jia FANG ,  Yanzhao LI ,  Xiyuan WANG ,  Zongmin LIU

    IPC: H01Q3/36 ,  H01Q9/04

    Abstract: The disclosure provides a liquid crystal antenna including: a first substrate; a second substrate facing the first substrate; a third substrate facing the second substrate such that the second substrate is between the first substrate and the third substrate; a liquid crystal layer between the first substrate and the second substrate; a transmission line on a surface of the first substrate adjacent to the liquid crystal layer; a ground electrode on a surface of the second substrate adjacent to the liquid crystal layer; a feeder line and a radiation patch both on a surface of the third substrate, wherein the transmission line and the ground electrode form a signal transmission circuit, and the transmission line and the liquid crystal layer form a phase shifter. In addition, the disclosure also relates to a method for manufacturing the liquid crystal antenna and an electronic device including the liquid crystal antenna.

    ARRAY SUBSTRATE AND METHOD FOR FABRICATING THE SAME
    40.
    发明申请
    ARRAY SUBSTRATE AND METHOD FOR FABRICATING THE SAME 有权
    阵列基板及其制造方法

    公开(公告)号：US20160027819A1

    公开(公告)日：2016-01-28

    申请号：US14430310

    申请日：2014-05-12

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Yanzhao LI ,  Gang WANG ,  Dongfang WANG ,  Wei LIU ,  Jingang FANG

    IPC: H01L27/12

    CPC classification number: H01L27/1288 ,  H01L21/0274 ,  H01L29/786 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An array substrate and a method for fabricating the same are disclosed. The method includes steps of providing a substrate (20), a first metal layer including patterns of gate electrodes (21, 24) of a first and second TFTs, an active layer (27) and a gate insulation layer (28) are formed on the substrate; forming an etch stop layer film and a photoresist sequentially on the substrate (20), and allowing the photoresist to form a first, second and third regions through gray-scale exposing and developing; forming a pattern of an etch stop layer (29), a connection via hole (30), and a contact via hole (31) respectively in the first, second and third regions through a patterning process; and forming source electrodes and drain electrodes (22, 23,25, 26) of the first and second TFTs. Photoresist of different thicknesses are disposed according to etch depths, thereby avoiding the over-etch of relatively shallow via holes.

    Abstract translation: 公开了阵列基板及其制造方法。 该方法包括提供衬底（20）的步骤，包括第一和第二TFT的栅电极（21,24）的图案的第一金属层，有源层（27）和栅极绝缘层（28）形成在 基材; 在衬底（20）上依次形成蚀刻停止层膜和光致抗蚀剂，并且通过灰度曝光和显影使光致抗蚀剂形成第一，第二和第三区域; 通过图案化工艺在第一，第二和第三区域分别形成蚀刻停止层（29），连接通孔（30）和接触通孔（31）的图案; 以及形成所述第一和第二TFT的源电极和漏电极（22,23,25,26）。 根据蚀刻深度设置不同厚度的光刻胶，从而避免相对浅的通孔的过度蚀刻。

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