公开(公告)号：US10980511B2

公开(公告)日：2021-04-20

申请号：US15421854

申请日：2017-02-01

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Gregory Corteville

IPC: A61B8/14 ,  A61B8/00 ,  A61B8/13 ,  A61B8/08 ,  G03B27/42 ,  G03B27/52 ,  B06B1/02 ,  G01S7/00 ,  G01S7/52 ,  G01S15/89 ,  A61N7/02 ,  A61N7/00

Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.

公开(公告)号：US10856840B2

公开(公告)日：2020-12-08

申请号：US15415434

申请日：2017-01-25

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Christopher Thomas McNulty ,  Jaime Scott Zahorian ,  Paul Francis Cristman ,  Matthew de Jonge ,  Keith G. Fife

IPC: A61B8/00 ,  A61B8/14 ,  A61B8/12 ,  B06B1/02 ,  B06B1/06

Abstract: A universal ultrasound device having an ultrasound includes a semiconductor die; a plurality of ultrasonic transducers integrated on the semiconductor die, the plurality of ultrasonic transducers configured to operate a first mode associated with a first frequency range and a second mode associated with a second frequency range, wherein the first frequency range is at least partially non-overlapping with the second frequency range; and control circuitry configured to: control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the first frequency range, in response to receiving an indication to operate the ultrasound probe in the first mode; and control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the second frequency range, in response to receiving an indication to operate the ultrasound probe in the second mode.

公开(公告)号：US20190324132A1

公开(公告)日：2019-10-24

申请号：US16459293

申请日：2019-07-01

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Tyler S. Ralston ,  Nevada J. Sanchez ,  Andrew J. Casper

IPC: G01S7/52 ,  B06B1/02 ,  G10K11/34 ,  B06B1/06 ,  H03K5/13

Abstract: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.

公开(公告)号：US20190210869A1

公开(公告)日：2019-07-11

申请号：US16290188

申请日：2019-03-01

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B81C1/00 ,  B06B1/02 ,  B81B7/00 ,  G01N29/24 ,  H01L29/84 ,  H04R19/00

Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.

公开(公告)号：US10228353B2

公开(公告)日：2019-03-12

申请号：US15648187

申请日：2017-07-12

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston

IPC: G01N29/24 ,  B81C1/00 ,  B06B1/02 ,  A61B8/00 ,  B81B7/00

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US20180186628A1

公开(公告)日：2018-07-05

申请号：US15910776

申请日：2018-03-02

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B81C1/00 ,  B06B1/02 ,  B81B7/00 ,  G01N29/24 ,  H04R19/00 ,  H01L29/84

CPC classification number: B81C1/00301 ,  B06B1/02 ,  B06B1/0292 ,  B81B7/007 ,  B81C1/00134 ,  B81C1/00158 ,  B81C1/00246 ,  B81C2201/0195 ,  B81C2203/0735 ,  B81C2203/0771 ,  G01N29/2406 ,  H01L29/84 ,  H04R19/005

Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.

公开(公告)号：US09895718B2

公开(公告)日：2018-02-20

申请号：US15349223

申请日：2016-11-11

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B06B1/00 ,  B06B1/02 ,  B81B3/00 ,  B81C1/00 ,  G10K11/18 ,  G10K9/12

CPC classification number: B06B1/0292 ,  B06B1/02 ,  B81B3/0021 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/015 ,  B81C1/00158 ,  B81C2201/013 ,  B81C2203/0118 ,  B81C2203/0735 ,  B81C2203/0771 ,  G10K9/12 ,  G10K11/18

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

公开(公告)号：US20170360405A1

公开(公告)日：2017-12-21

申请号：US15631819

申请日：2017-06-23

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Christopher Thomas McNulty ,  Jaime Scott Zahorian ,  Paul Francis Cristman ,  Matthew de Jonge ,  Keith G. Fife ,  David Elgena

IPC: A61B8/00 ,  A61B8/08

CPC classification number: A61B8/4477 ,  A61B8/0883 ,  A61B8/0891 ,  A61B8/12 ,  A61B8/4236 ,  A61B8/4427 ,  A61B8/4444 ,  A61B8/4472 ,  A61B8/4494 ,  A61B8/465 ,  A61B8/467 ,  A61B8/483 ,  A61B8/485 ,  A61B8/488 ,  A61B8/5207 ,  A61B8/54 ,  A61B8/56 ,  B06B1/0292 ,  B06B1/0622

Abstract: A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.

公开(公告)号：US20170285152A1

公开(公告)日：2017-10-05

申请号：US15087970

申请日：2016-03-31

Applicant: Butterfly Network, Inc.

Inventor： Liewei Bao ,  Kailiang Chen ,  Tyler S. Ralston ,  Nevada J. Sanchez

IPC: G01S7/524

CPC classification number: G01S7/524 ,  G01S7/52034

Abstract: Circuitry for ultrasound devices is described. A multi-level pulser is described, which can support time-domain and spatial apodization. The multi-level pulser may be controlled through a software-defined waveform generator. In response to the execution of a computer code, the waveform generator may access master segments from a memory, and generate a stream of packets directed to pulsing circuits. The stream of packets may be serialized. A plurality of decoding circuits may modulate the streams of packets to obtain spatial apodization.

公开(公告)号：US20170283254A1

公开(公告)日：2017-10-05

申请号：US15626801

申请日：2017-06-19

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B06B1/02 ,  B81B7/00 ,  B81C1/00 ,  G01N29/24 ,  H01L29/84 ,  H04R19/00

CPC classification number: B81C1/00301 ,  B06B1/02 ,  B06B1/0292 ,  B81B7/007 ,  B81C1/00134 ,  B81C1/00158 ,  B81C1/00246 ,  B81C2201/0195 ,  B81C2203/0735 ,  B81C2203/0771 ,  G01N29/2406 ,  H01L29/84 ,  H04R19/005

Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.