Wood fiber board and manufacturing method thereof
    31.
    发明授权
    Wood fiber board and manufacturing method thereof 有权
    木纤维板及其制造方法

    公开(公告)号:US08936855B2

    公开(公告)日:2015-01-20

    申请号:US13272335

    申请日:2011-10-13

    IPC分类号: B32B23/04

    摘要: Provided is a wood fiber board, and a production method thereof, such that the wood fiber board contains no phenolic resin, is simple to produce, and exhibits flexural strength and water resistance comparable to those of wood fiber boards produced by incorporating a phenolic resin. The wood fiber board of the present invention has only wood fibers; a polyacrylamide resin being an amphoteric-ionic resin, which has monomers having cationic groups and monomers having anionic groups at a ratio of 7:3 to 3:7 on a mole ratio basis, and which has a molecular weight ranging from 800,000 to 3,000,000; and cationic paraffin. A method of producing a wood fiber board of the present invention involves preparing a slurry to a solids concentration ranging from 2 to 3 wt % and pH of 3 to 5, and adding only the polyacrylamide resin and paraffin to the slurry.

    摘要翻译: 本发明提供一种木纤维板及其制造方法,使得木质纤维板不含酚醛树脂,制造简单,并且具有与通过掺入酚醛树脂制造的木纤维板相当的抗弯强度和耐水性。 本发明的木纤维板仅具有木纤维; 具有阳离子基团的单体的聚丙烯酰胺树脂和摩尔比为7:3〜3:7的阴离子性基团的单体,分子量为80万〜300万; 和阳离子石蜡。 本发明的木纤维板的制造方法包括将浆料制备成固体浓度为2〜3重量%,pH为3〜5,仅将聚丙烯酰胺树脂和石蜡加入到浆料中。

    Integrated capacitive and inductive power sources for a plasma etching chamber
    32.
    发明申请
    Integrated capacitive and inductive power sources for a plasma etching chamber 有权
    用于等离子体蚀刻室的集成电容和感应电源

    公开(公告)号:US20070199658A1

    公开(公告)日:2007-08-30

    申请号:US11363703

    申请日:2006-02-27

    IPC分类号: B08B6/00 C23F1/00 C23C16/00

    摘要: Broadly speaking, the present invention fills these needs by providing an improved chamber cleaning mechanism. The present invention can also be used to provide additional knobs to tune the etch processes. In one embodiment, a plasma processing chamber configured to generate a plasma includes a bottom electrode assembly with an bottom electrode, wherein the bottom electrode is configured to receive a substrate. The plasma processing chamber includes a top electrode assembly with a top electrode and an inductive coil surrounding the top electrode. The inductive coil is configured to convert a gas into a plasma within a region defined within the chamber, wherein the region is outside an area defined above a top surface of the bottom electrode.

    摘要翻译: 概括地说,本发明通过提供改进的室清洁机构来满足这些需要。 本发明还可以用于提供附加的旋钮来调整蚀刻工艺。 在一个实施例中,构造成产生等离子体的等离子体处理室包括具有底部电极的底部电极组件,其中底部电极被配置为容纳衬底。 等离子体处理室包括具有顶部电极的顶部电极组件和围绕顶部电极的感应线圈。 感应线圈被配置为将气体转变成在腔室内限定的区域内的等离子体,其中该区域位于限定在底部电极的顶表面之上的区域之外。

    Method of preventing damage to porous low-k materials during resist stripping
    33.
    发明申请
    Method of preventing damage to porous low-k materials during resist stripping 有权
    防止剥离过程中破坏多孔低k材料的方法

    公开(公告)号:US20050130435A1

    公开(公告)日:2005-06-16

    申请号:US10738280

    申请日:2003-12-16

    摘要: A method of forming a feature in a porous low-K dielectric layer is provided. A porous low-K dielectric layer is placed over a substrate. A patterned photoresist mask is placed over the porous low-K dielectric layer. A feature is etched into the porous low-K dielectric layer. A protective layer is deposited over the feature after the etching the feature. The patterned photoresist mask is stripped, so that part of the protective layer is removed, where protective walls formed from the protective layer remain in the feature.

    摘要翻译: 提供了在多孔低K电介质层中形成特征的方法。 将多孔低K电介质层放置在衬底上。 将图案化的光致抗蚀剂掩模放置在多孔低K电介质层上。 将特征蚀刻到多孔低K电介质层中。 在蚀刻特征之后,在特征上沉积保护层。 剥去图案化的光致抗蚀剂掩模,从而去除保护层的一部分,其中从保护层形成的保护壁保留在特征中。

    Vacuum plasma processor apparatus and method
    34.
    发明授权
    Vacuum plasma processor apparatus and method 有权
    真空等离子体处理装置及方法

    公开(公告)号:US06531029B1

    公开(公告)日:2003-03-11

    申请号:US09607326

    申请日:2000-06-30

    IPC分类号: H01L213065

    CPC分类号: H01J37/321

    摘要: 200 mm and 300 mm wafers are processed in vacuum plasma processing chambers that are the same or have the same geometry. Substantially planar excitation coils having different geometries for the wafers of different sizes excite ionizable gas in the chamber to a plasma by supplying electromagnetic; fields to the plasma through a dielectric window at the top of the chamber. Both coils include plural symmetrical, substantially circular turns coaxial with a center point of the coil and at least one turn that is asymmetrical with respect to the coil center point. Both coils include four turns, with r.f. excitation being applied to the turn that is closest to the coil center point. The turn that is third farthest from the center point is asymmetric in the coil used for 200 mm wafers. The two turns closest to the coil center point are asymmetric in the coil used for 300 mm wafers.

    摘要翻译: 200mm和300mm晶片在相同或具有相同几何形状的真空等离子体处理室中进行处理。 对于不同尺寸的晶片,具有不同几何形状的基本上平面的激励线圈通过提供电磁而将腔室中的可电离气体激发到等离子体; 通过室顶部的电介质窗到等离子体的场。 两个线圈包括与线圈的中心点同轴的多个对称的基本圆形的匝和至少一个相对于线圈中心点不对称的匝。 两个线圈包括四圈,r.f. 激励被施加到最接近线圈中心点的转弯。 距离中心点第三远的转弯在用于200 mm晶圆的线圈中是不对称的。 在线圈中心点最近的两个转弯在用于300毫米晶圆的线圈中是不对称的。

    Method for improving uniformity and reducing etch rate variation of etching polysilicon
    35.
    发明授权
    Method for improving uniformity and reducing etch rate variation of etching polysilicon 有权
    改善蚀刻多晶硅的均匀性和降低蚀刻速率变化的方法

    公开(公告)号:US06514378B1

    公开(公告)日:2003-02-04

    申请号:US09540549

    申请日:2000-03-31

    IPC分类号: H05H100

    CPC分类号: H01J37/32642 H01L21/32137

    摘要: An apparatus and method for consecutively processing a series of semiconductor substrates with minimal plasma etch rate variation following cleaning with fluorine-containing gas and/or seasoning of the plasma etch chamber. The method includes steps of (a) placing a semiconductor substrate on a substrate support in a plasma etching chamber, (b) maintaining a vacuum in the chamber, (c) etching an exposed surface of the substrate by supplying an etching gas to the chamber and energizing the etching gas to form a plasma in the chamber, (d) removing the substrate from the chamber; and (e) consecutively etching additional substrates in the chamber by repeating steps (a-d), the etching step being carried out by minimizing a recombination rate of H and Br on a silicon carbide edge ring surrounding the substrate at a rate sufficient to offset a rate at which Br is consumed across the substrate. The method can be carried out using pure HBr or combination of HBr with other gases.

    摘要翻译: 一种用于在用含氟气体清洁和/或等离子体蚀刻室的调节之后以最小等离子体蚀刻速率变化连续处理一系列半导体衬底的装置和方法。 该方法包括以下步骤:(a)将半导体衬底放置在等离子体蚀刻室中的衬底支撑件上,(b)在室中保持真空,(c)通过向腔室中提供蚀刻气体来蚀刻衬底的暴露表面 并且激励蚀刻气体以在腔室中形成等离子体,(d)从腔室移除衬底; 并且(e)通过重复步骤(ad)连续地蚀刻腔室中的附加衬底,蚀刻步骤通过使围绕衬底的碳化硅边缘环上的H和Br的复合速率以足以抵消速率 其中Br在基底上被消耗。 该方法可以使用纯HBr或HBr与其他气体的组合进行。

    Laser beam scanning optical apparatus having means for generating moire
fringes
    36.
    发明授权
    Laser beam scanning optical apparatus having means for generating moire fringes 失效
    具有用于产生莫尔条纹的装置的激光束扫描光学装置

    公开(公告)号:US5856669A

    公开(公告)日:1999-01-05

    申请号:US696066

    申请日:1996-08-13

    摘要: A laser beam scanning optical apparatus which has Moire fringes generating elements which is located near a position optically equivalent to a scanning surface and modulates a laser beam emitted from a laser source to generate Moire fringes. The Moire fringes generating elements comprises, for example, a first filter which has spatial grating and a second filter which has spatial grating which slants slightly with respect to the spatial grating of the first filter, the first filter and the second filter being arranged upstream and downstream respectively in an optical path. The laser beam scanning optical apparatus further has a light receiving element for receiving the Moire fringes generated by the Moire fringes generating elements. Focusing means for correcting a position of an image point of the laser beam is driven in accordance with an output of the light receiving element. For example, the light receiving element is a photoelectric element with a plurality of light receiving surfaces, each of which generates an electric signal in accordance with the laser beam incident thereto, and from a phase difference between the electric signals, the position of the image point is detected.

    摘要翻译: 一种激光束扫描光学装置,其具有位于光学上等同于扫描表面的位置附近的莫尔条纹产生元件,并且调制从激光源发射的激光束以产生莫尔条纹。 莫尔条纹生成元件包括例如具有空间光栅的第一滤光器和具有相对于第一滤光器的空间光栅稍微倾斜的空间光栅的第二滤光器,第一滤光器和第二滤光器布置在上游, 分别在光路中。 激光束扫描光学装置还具有用于接收由莫尔条纹生成元件产生的莫尔条纹的光接收元件。 根据光接收元件的输出来驱动用于校正激光束的图像点的位置的聚焦装置。 例如,光接收元件是具有多个光接收表面的光电元件,每个光接收表面根据入射到其的激光束产生电信号,并且根据电信号之间的相位差,图像的位置 点检测。

    Integrated capacitive and inductive power sources for a plasma etching chamber
    39.
    发明授权
    Integrated capacitive and inductive power sources for a plasma etching chamber 有权
    用于等离子体蚀刻室的集成电容和感应电源

    公开(公告)号:US08911590B2

    公开(公告)日:2014-12-16

    申请号:US11363703

    申请日:2006-02-27

    摘要: Broadly speaking, the embodiments of the present invention provide an improved chamber cleaning mechanism. The present invention can also be used to provide additional knobs to tune the etch processes. In one embodiment, a plasma processing chamber configured to generate a plasma includes a bottom electrode assembly with an bottom electrode, wherein the bottom electrode is configured to receive a substrate. The plasma processing chamber includes a top electrode assembly with a top electrode and an inductive coil surrounding the top electrode. The inductive coil is configured to convert a gas into a plasma within a region defined within the chamber, wherein the region is outside an area defined above a top surface of the bottom electrode.

    摘要翻译: 广义而言,本发明的实施例提供了一种改进的室清洁机构。 本发明还可以用于提供附加的旋钮来调整蚀刻工艺。 在一个实施例中,构造成产生等离子体的等离子体处理室包括具有底部电极的底部电极组件,其中底部电极被配置为容纳衬底。 等离子体处理室包括具有顶部电极的顶部电极组件和围绕顶部电极的感应线圈。 感应线圈被配置为将气体转变成在腔室内限定的区域内的等离子体,其中该区域位于限定在底部电极的顶表面之上的区域之外。