摘要:
Provided is a wood fiber board, and a production method thereof, such that the wood fiber board contains no phenolic resin, is simple to produce, and exhibits flexural strength and water resistance comparable to those of wood fiber boards produced by incorporating a phenolic resin. The wood fiber board of the present invention has only wood fibers; a polyacrylamide resin being an amphoteric-ionic resin, which has monomers having cationic groups and monomers having anionic groups at a ratio of 7:3 to 3:7 on a mole ratio basis, and which has a molecular weight ranging from 800,000 to 3,000,000; and cationic paraffin. A method of producing a wood fiber board of the present invention involves preparing a slurry to a solids concentration ranging from 2 to 3 wt % and pH of 3 to 5, and adding only the polyacrylamide resin and paraffin to the slurry.
摘要:
Broadly speaking, the present invention fills these needs by providing an improved chamber cleaning mechanism. The present invention can also be used to provide additional knobs to tune the etch processes. In one embodiment, a plasma processing chamber configured to generate a plasma includes a bottom electrode assembly with an bottom electrode, wherein the bottom electrode is configured to receive a substrate. The plasma processing chamber includes a top electrode assembly with a top electrode and an inductive coil surrounding the top electrode. The inductive coil is configured to convert a gas into a plasma within a region defined within the chamber, wherein the region is outside an area defined above a top surface of the bottom electrode.
摘要:
A method of forming a feature in a porous low-K dielectric layer is provided. A porous low-K dielectric layer is placed over a substrate. A patterned photoresist mask is placed over the porous low-K dielectric layer. A feature is etched into the porous low-K dielectric layer. A protective layer is deposited over the feature after the etching the feature. The patterned photoresist mask is stripped, so that part of the protective layer is removed, where protective walls formed from the protective layer remain in the feature.
摘要:
200 mm and 300 mm wafers are processed in vacuum plasma processing chambers that are the same or have the same geometry. Substantially planar excitation coils having different geometries for the wafers of different sizes excite ionizable gas in the chamber to a plasma by supplying electromagnetic; fields to the plasma through a dielectric window at the top of the chamber. Both coils include plural symmetrical, substantially circular turns coaxial with a center point of the coil and at least one turn that is asymmetrical with respect to the coil center point. Both coils include four turns, with r.f. excitation being applied to the turn that is closest to the coil center point. The turn that is third farthest from the center point is asymmetric in the coil used for 200 mm wafers. The two turns closest to the coil center point are asymmetric in the coil used for 300 mm wafers.
摘要:
An apparatus and method for consecutively processing a series of semiconductor substrates with minimal plasma etch rate variation following cleaning with fluorine-containing gas and/or seasoning of the plasma etch chamber. The method includes steps of (a) placing a semiconductor substrate on a substrate support in a plasma etching chamber, (b) maintaining a vacuum in the chamber, (c) etching an exposed surface of the substrate by supplying an etching gas to the chamber and energizing the etching gas to form a plasma in the chamber, (d) removing the substrate from the chamber; and (e) consecutively etching additional substrates in the chamber by repeating steps (a-d), the etching step being carried out by minimizing a recombination rate of H and Br on a silicon carbide edge ring surrounding the substrate at a rate sufficient to offset a rate at which Br is consumed across the substrate. The method can be carried out using pure HBr or combination of HBr with other gases.
摘要:
A laser beam scanning optical apparatus which has Moire fringes generating elements which is located near a position optically equivalent to a scanning surface and modulates a laser beam emitted from a laser source to generate Moire fringes. The Moire fringes generating elements comprises, for example, a first filter which has spatial grating and a second filter which has spatial grating which slants slightly with respect to the spatial grating of the first filter, the first filter and the second filter being arranged upstream and downstream respectively in an optical path. The laser beam scanning optical apparatus further has a light receiving element for receiving the Moire fringes generated by the Moire fringes generating elements. Focusing means for correcting a position of an image point of the laser beam is driven in accordance with an output of the light receiving element. For example, the light receiving element is a photoelectric element with a plurality of light receiving surfaces, each of which generates an electric signal in accordance with the laser beam incident thereto, and from a phase difference between the electric signals, the position of the image point is detected.
摘要:
A plurality of holding members individually hold some of a plurality of lenses in a scanning optical system. A base member holds and connects a plurality of the holding members at predetermined positional relations with rigidity higher than that of the holding member, and is attached to a structural member of an image forming apparatus.
摘要:
A process for reducing a radioactive material of an object containing a radioactive material to a safe level in a living environment includes releasing pressure including carrying out a heating process on an aqueous liquid that includes water, water-soluble liquid, or a mixture of water and water-soluble liquid, and the object in a state where temperature is less than or equal to a critical temperature of the aqueous liquid and pressure is greater than or equal to a saturated vapor pressure of the aqueous liquid when the object is immersed in the aqueous liquid to such a degree that the object is covered or to a greater degree and then abruptly releasing the pressure, and separating, after the releasing pressure, the mixture of the object and the aqueous liquid into liquid and solid.
摘要:
Broadly speaking, the embodiments of the present invention provide an improved chamber cleaning mechanism. The present invention can also be used to provide additional knobs to tune the etch processes. In one embodiment, a plasma processing chamber configured to generate a plasma includes a bottom electrode assembly with an bottom electrode, wherein the bottom electrode is configured to receive a substrate. The plasma processing chamber includes a top electrode assembly with a top electrode and an inductive coil surrounding the top electrode. The inductive coil is configured to convert a gas into a plasma within a region defined within the chamber, wherein the region is outside an area defined above a top surface of the bottom electrode.
摘要:
Provided are a process and device for reducing radioactive material of an object containing the radioactive material to a safe level in a living environment.Included are a step of performing at least a step of carrying out a heating process on the object, into which radioactive material is absorbed and/or adsorbed from an environment or which absorbs and/or adsorbs radioactive material from an environment, in a state where temperature is less than or equal to the critical temperature of water and pressure is greater than or equal to the saturated vapor pressure of water, or a step of abruptly releasing the pressure; and a step of separating, after the above step, into liquid and solid.