Structure of an interleaving striped capacitor substrate
    32.
    发明授权
    Structure of an interleaving striped capacitor substrate 失效
    交错条纹电容器基板的结构

    公开(公告)号:US07102876B2

    公开(公告)日:2006-09-05

    申请号:US11039924

    申请日:2005-01-24

    Abstract: An interleaving striped capacitor substrate structure for pressing-type print circuit boards is disclosed. To meet the high-frequency, high-speed, and high-density requirements in modern electronic systems, the interleaving striped capacitor substrate structure uses several dielectric materials of different dielectric coefficients to make a dielectric layer. One dielectric layer can be stacked on another to form a multi-layered capacitor substrate so that a single capacitor substrate can provide the highest capacitance required for the decoupling capacitor to suppress high-frequency noise signals, and the lower dielectric coefficient substrate required for high-speed signal transmission. This simultaneously achieves the effects of reducing high-frequency transmission time and suppressing high-frequency noise.

    Abstract translation: 公开了一种用于按压式印刷电路板的交错条纹电容器基底结构。 为了满足现代电子系统的高频,高速和高密度要求,交错条纹电容器基板结构使用不同介电系数的几种介电材料制成介电层。 一个电介质层可以堆叠在另一个上以形成多层电容器基板,使得单个电容器基板可以提供去耦电容器所需的最高电容以抑制高频噪声信号,并且高电平基板所需的低介电系数基板, 速度信号传输。 这同时实现了降低高频传输时间并抑制高频噪声的效果。

    Ink jet recording materials
    33.
    发明授权
    Ink jet recording materials 失效
    喷墨记录材料

    公开(公告)号:US06340516B1

    公开(公告)日:2002-01-22

    申请号:US09240797

    申请日:1999-01-30

    Abstract: The present invention relates to ink jet recording materials and method for making the same. The material has a gel layer formed on a base material to improve the optical density of the material and improve the printing quality of ink of pigment type. The method for forming the gel layer is to coat a first ink-receptive layer composed of high valance metallic halide, such as calcium chloride (CaCl2) or magnesium chloride (MgCl2), on the base layer, then a second ink-receptive layer composed of alginate, such as sodium alginate, potassium alginate or other compounds of alginic acid, on the first ink-receptive layer. The second and the first ink-receptive layers will react to form a gel layer during coating for absorbing ink dots and improving print quality.

    Abstract translation: 喷墨记录材料及其制造方法技术领域本发明涉及喷墨记录材料及其制造方法。 该材料具有形成在基材上的凝胶层,以提高材料的光密度并提高颜料类型的油墨的印刷质量。 用于形成凝胶层的方法是在基层上涂覆由高价金属卤化物(如氯化钙(CaCl 2)或氯化镁(MgCl 2))组成的第一油墨接收层,然后由第二油墨接收层组成 的藻酸盐,例如海藻酸钠,藻酸钾或其他海藻酸​​化合物,在第一油墨接受层上。 在涂覆期间,第二和第一墨水接收层将反应形成凝胶层,以吸收墨点并提高打印质量。

    Polyimide composition for LOC adhesive tapes
    34.
    发明授权
    Polyimide composition for LOC adhesive tapes 有权
    LOC胶带的聚酰亚胺组合物

    公开(公告)号:US6117951A

    公开(公告)日:2000-09-12

    申请号:US253836

    申请日:1999-02-19

    CPC classification number: C09J179/08

    Abstract: An adhesive tape for lead-on-chip (LOC) IC applications containing a polyamide-based adhesive composition which is the reaction product from a reaction mixture of: (a) a pre-imidized polyamic acid; and (b) a bismaleimide that has been modified by a barbituric acid of a derivative of barbituric acid to become a barbituric acid modified bismaleimide. The pre-imidized polyamic acid is a reaction product from a reaction mixture that contains a polyamic acid and a cyclizing agent. The polyamide-based adhesive composition provides all the desirable heat resistance and other mechanical and dielectric characteristics. But, most significantly, its microscopic rheological properties are adjusted such that excellent contact is achieved between the resin molecules and the lead frame surface while eliminating or at least minimizing the extent of adhesive overflow, which can substantially reduce the reliability of the final IC product.

    Abstract translation: 一种用于片上(LOC)IC应用的胶带,其包含聚酰胺基粘合剂组合物,其为来自以下反应混合物的反应产物:(a)预酰亚胺化的聚酰胺酸; 和(b)已经被巴比妥酸衍生物的巴比妥酸改性成为巴比妥酸改性双马来酰亚胺的双马来酰亚胺。 预酰亚胺化聚酰胺酸是含有聚酰胺酸和环化剂的反应混合物的反应产物。 聚酰胺基粘合剂组合物提供所有期望的耐热性和其它机械和介电特性。 但是,最显着的是,其微观流变特性被调节,使得在树脂分子和引线框架表面之间获得良好的接触,同时消除或至少最小化粘合剂溢出的程度,这可以显着降低最终IC产品的可靠性。

    Heat resistant composition bismaleimide-modified polyurethane
    35.
    发明授权
    Heat resistant composition bismaleimide-modified polyurethane 失效
    耐热组合物双马来酰亚胺改性聚氨酯

    公开(公告)号:US5602213A

    公开(公告)日:1997-02-11

    申请号:US89797

    申请日:1993-07-09

    Abstract: A heat resistant composition comprising a mixture of (a) a polyurethane or a modified polyurethane and (b) a bismaleimide oligomer, in which the bismaleimide oligomer is in an amount of about 1 to 35 percent by weight based on overall solid contents. The polyurethane is formed by reacting a diisocyanate-containing compound with a dihydroxy diol-compound. Then the polyurethane is reacted with a trimellitic anhydride, a diacid or a mixture thereof to form the modified polyurethane. The bismaleimide oligomer is formed by reacting a bismaleimide resin with a barbituric acid or a derivative thereof.

    Abstract translation: 一种耐热组合物,其包含(a)聚氨酯或改性聚氨酯和(b)双马来酰亚胺低聚物的混合物,其中所述双马来酰亚胺低聚物的量为基于总固体含量的约1至35重量%。 通过使含二异氰酸酯的化合物与二羟基二醇化合物反应形成聚氨酯。 然后将聚氨酯与偏苯三酸酐,二酸或其混合物反应以形成改性聚氨酯。 双马来酰亚胺低聚物通过双马来酰亚胺树脂与巴比妥酸或其衍生物反应形成。

    Barbituric acid-modified bismaleimide with diamine and
polyisocyanate-modified epoxy resin
    36.
    发明授权
    Barbituric acid-modified bismaleimide with diamine and polyisocyanate-modified epoxy resin 失效
    巴比妥酸改性双马来酰亚胺与二胺和多异氰酸酯改性环氧树脂

    公开(公告)号:US5326794A

    公开(公告)日:1994-07-05

    申请号:US911692

    申请日:1992-07-10

    CPC classification number: H05K1/0353 C08L63/00 C08L79/085

    Abstract: A process for manufacturing a high glass transition temperature printed circuit board comprising blending a modified bismaleimide resin into a modified epoxy resin is disclosed. Particularly the material is manufactured by blending a bismaleimide resin reacted with barbituric acid and its derivative thereof and an epoxy resin with an oxazolidone ring resulting from the reaction of a polyisocyanate and an epoxy resin modified with a secondary diamine and followed by curing. The resultant product has a high glass transition temperature, a good adhesion, flame retardancy, and a low bromine content.

    Abstract translation: 公开了一种制造高玻璃化转变温度印刷电路板的方法,其包括将改性双马来酰亚胺树脂掺混到改性环氧树脂中。 特别地,该材料通过将与巴比妥酸及其衍生物反应的双马来酰亚胺树脂与环氧树脂与由多异氰酸酯和经二胺改性的环氧树脂反应得到的恶唑烷酮环并随后固化而制得。 所得产物具有高玻璃化转变温度,良好的粘合性,阻燃性和低溴含量。

    Polyimide composition for polyimide/copper foil laminate
    37.
    发明授权
    Polyimide composition for polyimide/copper foil laminate 失效
    聚酰亚胺/铜箔层压板用聚酰亚胺组合物

    公开(公告)号:US5290909A

    公开(公告)日:1994-03-01

    申请号:US70537

    申请日:1993-05-28

    CPC classification number: C08G73/18 H05K1/0346 Y10T428/31681 Y10T428/31721

    Abstract: A polyimide composition for use in making polyimide/copper foil laminate that does not require an adhesive layer between the polyimide substrate and the copper foil. A polyimide precursor is first prepared from a monomer composition, which comprises a dianhydride and an imidazole-containing or benzimidazole-containing compound, or mixture thereof The polyimide precursor is then coated onto a copper foil and subsequently subject to an imidization reaction to form a polyimide/copper foil laminate, which exhibits excellent peel strength and flatness while retaining all the advantageous properties that are characteristic of polyimide resins, such as excellent mechanical strength and heat and chemical resistance. Because the polyimide/copper foil laminates disclosed in the present invention are made without the need to apply an adhesive layer, the process of manufacturing the same is greatly simplified and the cost of production therefor can be substantially reduced. Furthermore, many of the problems caused by the inferior chemical and/or physical properties of the adhesive layer are completely eliminated.

    Abstract translation: 一种用于制造聚酰亚胺/铜箔层压体的聚酰亚胺组合物,其不需要聚酰亚胺基底和铜箔之间的粘合剂层。 聚酰亚胺前体首先由包含二酐和含咪唑或苯并咪唑的化合物或其混合物的单体组合物制备。然后将聚酰亚胺前体涂覆在铜箔上,随后进行酰亚胺化反应以形成聚酰亚胺 /铜箔层叠体,其具有优异的剥离强度和平坦度,同时保持聚酰亚胺树脂特有的所有有利特性,例如优异的机械强度和耐热性和耐化学性。 由于本发明中公开的聚酰亚胺/铜箔层叠体不需要施加粘合剂层,所以制造方法大大简化,并且可以大幅降低其生产成本。 此外,完全消除了由粘合剂层的较差化学和/或物理性质引起的许多问题。

    Battery electrode paste composition containing modified maleimides
    40.
    发明授权
    Battery electrode paste composition containing modified maleimides 有权
    含有改性马来酰亚胺的电池电极糊组合物

    公开(公告)号:US08137838B2

    公开(公告)日:2012-03-20

    申请号:US11976557

    申请日:2007-10-25

    Abstract: A battery electrode paste composition containing modified maleimide(s) is provided, which has an electrode active material, a conductive additive, a binder and modified maleimide(s) as dispersant. The modified maleimide as the dispersant in the battery electrode paste composition has dendrimer-like hyperbranched structures, which can form a stable complex with the electrode active material. Therefore, owing to the excellent compatibility of the modified maleimide with the solvent in the electrode paste, the storage stability of the paste is increased. Furthermore, through formation of stable bonding between the modified maleimide and the current-collecting metal substrate, the adhesive force between the electrode film and the current-collecting metal substrate is enhanced and the cycling life of the battery product is extended.

    Abstract translation: 提供含有改性马来酰亚胺的电池电极糊剂组合物,其具有电极活性材料,导电添加剂,粘合剂和改性马来酰亚胺作为分散剂。 在电池电极糊料组合物中作为分散剂的改性马来酰亚胺具有树枝状大分子超支化结构,其可以与电极活性材料形成稳定的络合物。 因此,由于改性马来酰亚胺与电极糊中的溶剂的相溶性优异,因此糊料的保存稳定性提高。 此外,通过形成改性马来酰亚胺和集电金属基材之间的稳定结合,电极膜和集电金属基板之间的粘合力增强,电池产品的循环寿命延长。

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