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    METHODS AND APPARATUS FOR REDUCING THE CONSUMPTION OF REAGENTS IN ELECTRONIC DEVICE MANUFACTURING PROCESSES
    32.
    发明申请
    METHODS AND APPARATUS FOR REDUCING THE CONSUMPTION OF REAGENTS IN ELECTRONIC DEVICE MANUFACTURING PROCESSES 审中-公开
    减少电子设备制造过程中试剂消耗的方法和装置

    公开(公告)号：US20090017206A1

    公开(公告)日：2009-01-15

    申请号：US12140055

    申请日：2008-06-16

    Applicant: Daniel O. Clark ,  Robert Z. Bachrach ,  Mehran Moalem ,  Jay J. Jung

    Inventor： Daniel O. Clark ,  Robert Z. Bachrach ,  Mehran Moalem ,  Jay J. Jung

    IPC: C23C16/44 ,  C23C16/54

    CPC classification number: C23C16/4412 ,  C23C16/45593

    Abstract: A substrate coating system is provided which includes a substrate coating chamber; a gas box connected to the coating chamber and adapted to provide reagent gases to the coating chamber; and a reagent reclaim system connected to the substrate coating chamber and the gas box, wherein the reagent reclaim system includes a wet scrubber connected to the coating chamber; a polisher connected to the wet scrubber; and a dryer connected to the polisher and the gas box.

    Abstract translation: 提供了一种基材涂布系统，其包括基材涂布室; 连接到所述涂覆室并适于向所述涂覆室提供试剂气体的气体箱; 以及连接到所述基板涂覆室和所述气体箱的试剂回收系统，其中所述试剂回收系统包括连接到所述涂覆室的湿式洗涤器; 与湿式洗涤器连接的抛光机; 和连接到抛光机和气箱的干燥机。

    Robot blade for handling of semiconductor substrates
    33.
    发明授权
    Robot blade for handling of semiconductor substrates 有权
    用于处理半导体衬底的机器人刀片

    公开(公告)号：US06199927B1

    公开(公告)日：2001-03-13

    申请号：US09294440

    申请日：1999-01-21

    Applicant: Behzad Shamlou ,  Wen Chiang Tu ,  Xuyen Pham ,  Yu Chang ,  Daniel O. Clark ,  Shun Wu

    Inventor： Behzad Shamlou ,  Wen Chiang Tu ,  Xuyen Pham ,  Yu Chang ,  Daniel O. Clark ,  Shun Wu

    IPC: B25J1506

    CPC classification number: H01L21/6838 ,  H01L21/68707 ,  Y10S294/907 ,  Y10S414/141

    Abstract: The amount of particulate contamination produced due to rubbing between a semiconductor substrate and the robotic substrate handling blade has been greatly reduced by the use of specialized materials either as the principal material of construction for the semiconductor substrate handling blade, or as a coating upon the surface of the substrate handling blade. In particular, the specialized material must exhibit the desired stiffness at temperatures in excess of about 450° C.; the specialized material must also have an abrasion resistant surface which does not produce particulates when rubbed against the semiconductor substrate. The abrasion resistant surface needs to be very smooth, having a surface finish of less than 1.0 micro inch, and preferably less than 0.2 micro inch. In addition, the surface must be essentially void-free. In the most preferred embodiments, the upper, top surface of the substrate handling blade is constructed from a dielectric material being smooth, non-porous, and wear-resistant. A preferred material for construction of the substrate handling blade is single crystal sapphire. Other single crystal materials, such as single crystal silicon and single crystal silicon carbide should also perform well. In a particularly preferred embodiment of the substrate handling blade, a capacitance sensor is used to indicate the presence of a semiconductor substrate on the surface of the handling blade and a structure through which vacuum is applied may be used to hold (chuck) the semiconductor substrate to the surface of the handling blade.

    Abstract translation: 通过使用作为半导体基板处理叶片的构造的主要材料的特殊材料或作为表面上的涂层，由于半导体基板和机器人基板处理刮板之间的摩擦而产生的颗粒污染物的量已经大大降低 的基板处理叶片。 特别地，专用材料必须在超过约450℃的温度下显示所需的刚度; 专用材料也必须具有在摩擦半导体衬底时不会产生微粒的耐磨表面。 耐磨表面需要非常光滑，表面光洁度小于1.0微英寸，优选小于0.2微英寸。 此外，表面必须基本上无空隙。 在最优选的实施例中，衬底处理刀片的上顶表面由平滑，无孔和耐磨的电介质材料构成。 用于构造基板处理叶片的优选材料是单晶蓝宝石。 其他单晶材料，如单晶硅和单晶碳化硅也应表现良好。 在基板处理叶片的特别优选的实施例中，使用电容传感器来表示在处理叶片的表面上存在半导体基板，并且可以使用施加真空的结构来保持（卡盘）半导体基板 到处理叶片的表面。

    Semi-permeable membranes with an internal discriminating region
    35.
    发明授权
    Semi-permeable membranes with an internal discriminating region 失效
    半透膜与内部鉴别区域

    公开(公告)号：US4838904A

    公开(公告)日：1989-06-13

    申请号：US129273

    申请日：1987-12-07

    Applicant: Edgar S. Sanders, Jr. ,  Daniel O. Clark ,  John A. Jensvold

    Inventor： Edgar S. Sanders, Jr. ,  Daniel O. Clark ,  John A. Jensvold

    IPC: B01D53/22 ,  C01B13/02 ,  C08G64/10

    CPC classification number: C08G64/10 ,  B01D53/22 ,  C01B13/0255 ,  C01B2210/0046

    Abstract: The invention is a semi-permeable membrane which comprises a polymeric matrix with two porous surfaces and a region which functions to separate one or more gases from one or more other gases.The membranes of this invention exhibit excellent separation factors and flux. Such membranes are less prone to being damaged due to handling and exposure to contaminants due to the internal region which affects the separation, as the porous surfaces function to protect such region.

    Abstract translation: 本发明是一种半透膜，其包括具有两个多孔表面的聚合物基体和用于将一种或多种气体与一种或多种其它气体分离的区域。 本发明的膜表现出优异的分离因子和通量。 由于处理和暴露于影响分离的内部区域的污染物，因此多孔表面起保护这种区域的作用，因此这种膜不容易被损坏。

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