Poly (arylene sulfide) composition suitable for use in semi-conductor
encapsulation
    31.
    发明授权
    Poly (arylene sulfide) composition suitable for use in semi-conductor encapsulation 失效
    适用于半导体封装的聚(亚芳基硫醚)组合物

    公开(公告)号:US4337182A

    公开(公告)日:1982-06-29

    申请号:US247687

    申请日:1981-03-26

    CPC classification number: H01B3/301 C08K13/04 C08K3/36 C08K5/54 C08K7/14 C08K7/20

    Abstract: A composition, suitable for encapsulation-type molding, containing from about 30 to 50 weight percent poly (arylene sulfide), about 10 to about 30 weight percent glass fibers, about 30 to about 60 weight percent of a component that can be glass beads or fused silica and about 0.5 to about 3 weight percent of organic silane. Preferably the composition also contains up to about 2 weight percent of a processing aid. A method for preparing a composition suitable for molding in which there is compounded a masterbatch of glass fiber and poly (arylenesulfide), the masterbatch is reduced to particles, and the masterbatch particles are blended with a sufficient amount of organic silane, additional poly (arylene sulfide) and a component chosen from glass beads and fused silica to provide a composition of about 30 to about 50 weight percent poly (arylene sulfide), about 10 to about 30 weight percent glass fibers, about 30 to about 60 weight percent glass beads, or fused silica and 0.5 to about 3 weight percent organic silane. An article of manufacture comprising a semiconductor chip encapsulated in a molded composition as described above.

    Abstract translation: 适用于包封型成型的组合物,其含有约30至50重量%的聚(亚芳基硫醚),约10至约30重量%的玻璃纤维,约30至约60重量%的可以是玻璃珠的组分或 熔融二氧化硅和约0.5至约3重量%的有机硅烷。 优选地,组合物还含有最多约2重量%的加工助剂。 一种制备适合于模塑的组合物的方法,其中混合了玻璃纤维母料和聚(芳基硫化物),将母料还原成颗粒,并将母料颗粒与足量的有机硅烷共混,另外的聚(亚芳基 硫化物)和选自玻璃珠和熔融二氧化硅的组分,以提供约30至约50重量%的聚(亚芳基硫醚),约10至约30重量%的玻璃纤维,约30至约60重量%的玻璃珠的组合物, 或熔融二氧化硅和0.5至约3重量%的有机硅烷。 一种制造方法,其包括如上所述的封装在模制组合物中的半导体芯片。

    Arc resistant composition
    32.
    发明授权
    Arc resistant composition 失效
    抗弧组合物

    公开(公告)号:US4176098A

    公开(公告)日:1979-11-27

    申请号:US914837

    申请日:1978-06-12

    CPC classification number: H01B7/292 C08K3/26 C08K3/34 C08K3/346 H01B3/301

    Abstract: An arc resistant composition is produced by incorporating into poly(arylene sulfide) about 30-70 percent by weight of fillers including 20-50 percent by weight of the total composition of at least one of clay and talc. Glass, calcium carbonate, lithium carbonate, and zinc stearate can also be present in the composition to improve physical properties and processing. Addition of small quantities of silanes to the arc resistant composition improves its water resistance and linear coefficient of expansion without impairing its arc resistance or physical properties. Electrical components which must be arc resistant and low wattage resistance heater housings can be produced from the compositions made in accordance with this invention.

    Abstract translation: 通过将约30-70重量%的填料掺入聚(亚芳基硫醚)中制备耐电弧组合物,其包括总组合物的20-50重量%的至少一种粘土和滑石。 玻璃,碳酸钙,碳酸锂和硬脂酸锌也可以存在于组合物中以改善物理性能和加工性能。 将少量硅烷添加到耐电弧组合物中,可以改善其耐水性和线性膨胀系数,而不会损害其耐电弧性或物理性能。 必须具有耐电弧性和低瓦数电阻的加热器壳体的电气部件可以由根据本发明制成的组合物制造。

    Thermoplastic resin composition having high impact strength
    34.
    发明授权
    Thermoplastic resin composition having high impact strength 失效
    具有高冲击强度的热塑性树脂组合物

    公开(公告)号:US3939112A

    公开(公告)日:1976-02-17

    申请号:US524887

    申请日:1974-11-18

    CPC classification number: C08K5/01

    Abstract: A thermoplastic resin composition is disclosed which contains a polymodal, resinous, branched block butadiene/styrene copolymer and a naphthenic extender oil. The resin has very high impact strength.

    Abstract translation: 公开了一种热塑性树脂组合物,其包含多嵌段,树脂,支化嵌段丁二烯/苯乙烯共聚物和环烷烃增量油。 该树脂具有非常高的冲击强度。

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