Abstract:
A composition, suitable for encapsulation-type molding, containing from about 30 to 50 weight percent poly (arylene sulfide), about 10 to about 30 weight percent glass fibers, about 30 to about 60 weight percent of a component that can be glass beads or fused silica and about 0.5 to about 3 weight percent of organic silane. Preferably the composition also contains up to about 2 weight percent of a processing aid. A method for preparing a composition suitable for molding in which there is compounded a masterbatch of glass fiber and poly (arylenesulfide), the masterbatch is reduced to particles, and the masterbatch particles are blended with a sufficient amount of organic silane, additional poly (arylene sulfide) and a component chosen from glass beads and fused silica to provide a composition of about 30 to about 50 weight percent poly (arylene sulfide), about 10 to about 30 weight percent glass fibers, about 30 to about 60 weight percent glass beads, or fused silica and 0.5 to about 3 weight percent organic silane. An article of manufacture comprising a semiconductor chip encapsulated in a molded composition as described above.
Abstract:
An arc resistant composition is produced by incorporating into poly(arylene sulfide) about 30-70 percent by weight of fillers including 20-50 percent by weight of the total composition of at least one of clay and talc. Glass, calcium carbonate, lithium carbonate, and zinc stearate can also be present in the composition to improve physical properties and processing. Addition of small quantities of silanes to the arc resistant composition improves its water resistance and linear coefficient of expansion without impairing its arc resistance or physical properties. Electrical components which must be arc resistant and low wattage resistance heater housings can be produced from the compositions made in accordance with this invention.
Abstract:
Combination of a polyolefin; a crosslinking agent; a halogenated phosphorous-nitrogen compound having the formula ##EQU1## where R' is selected from the group consisting of hydrogen and alkyl radicals having 1 to 3 carbon atoms, R is a cyano alkyl radical having 2 to 6 carbon atoms and X is chlorine, bromine, or iodine; ammonium polyphosphate; and hexachlorocyclopentadiene dimer yields a composition which is strong, fire-retardant and also strongly adherent to certain surfaces including aluminum.
Abstract:
A thermoplastic resin composition is disclosed which contains a polymodal, resinous, branched block butadiene/styrene copolymer and a naphthenic extender oil. The resin has very high impact strength.