公开(公告)号：US20140367570A1

公开(公告)日：2014-12-18

申请号：US14326076

申请日：2014-07-08

Applicant: EBARA CORPORATION

Inventor： Toshifumi Kimba ,  Tohru Satake ,  Tsutomu Karimata ,  Kenji Watanabe ,  Nobuharu Noji ,  Takeshi Murakami ,  Masahiro Hatakeyama ,  Mamoru Nakasuji ,  Hirosi Sobukawa ,  Shoji Yoshikawa ,  Shin Oowada ,  Mutsumi Saito

IPC: H01J37/22 ,  H01J37/18 ,  H01J37/06 ,  H01J37/28

CPC classification number: H01J37/222 ,  G01N23/225 ,  G01N23/2251 ,  H01J37/06 ,  H01J37/073 ,  H01J37/185 ,  H01J37/20 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/0216 ,  H01J2237/082 ,  H01J2237/2002 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/20228 ,  H01J2237/204 ,  H01J2237/22 ,  H01J2237/24564 ,  H01J2237/2806 ,  H01J2237/2813 ,  H01J2237/2816 ,  H01J2237/2817 ,  H01L2224/48227 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/3025 ,  H01L2924/00

Abstract: There is provided a substrate inspection method. The method includes: maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; positioning the substrate on a stage in the inspection chamber; selecting an evaluation parameter according to a kind of said processing apparatus; and determining inspection regions of the substrate so that an inspection time required per a lot of the substrate is equal to a processing time spent for said processing step required per a lot of the substrate. The method also includes radiating a primary electron beam from an electron gun; deflecting the primary electron beam with an E*B unit; irradiating said inspection regions of the substrate with the deflected primary electron beam; and projecting secondary electrons emitted from said substrate through the E*B unit onto a detector with a secondary optical system.

Abstract translation: 提供了基板检查方法。 该方法包括：在所述检查室中保持真空; 将所述检查室与振动隔离; 将基板定位在检查室中的台上; 根据所述处理装置的种类选择评估参数; 并且确定基板的检查区域，使得每批次的基板所需的检查时间等于每批基板所需的所述处理步骤所花费的处理时间。 该方法还包括从电子枪辐射一次电子束; 用E * B单元偏转一次电子束; 用偏转的一次电子束照射基板的所述检查区域; 并且通过E * B单元将从所述衬底发射的二次电子投射到具有次级光学系统的检测器上。