Thermal detector with stress-aligned thermally sensitive element and
method
    31.
    发明授权
    Thermal detector with stress-aligned thermally sensitive element and method 失效
    具有应力对准热敏元件和方法的热探测器

    公开(公告)号:US6020216A

    公开(公告)日:2000-02-01

    申请号:US920261

    申请日:1997-08-22

    IPC分类号: H01L27/146 H01L31/09

    CPC分类号: H01L27/1465

    摘要: Method of stress-aligning a thermally sensitive element may comprise the step of forming a thin film layer of thermally sensitive material (80). The thin film layer of thermally sensitive material (80) may be crystallized. A stress alignment layer (82) may be formed in communication with the thin film layer of thermally sensitive material (80). The thin film layer of thermally sensitive material (80) may be heated above a transition temperature of the thermally sensitive material. The stress alignment layer (82) may be expanded relative to the thin film layer of thermally sensitive material (80). The thin film layer of thermally sensitive material (80) may be cooled below the transition temperature of the thermally sensitive material. The stress alignment layer (82) may be compressed relative to the thin film layer of thermally sensitive material (80) as the thin film layer of thermally sensitive material (80) cools below the transition temperature to preferentially-order crystals of the thermally sensitive material.

    摘要翻译: 应力对准热敏元件的方法可包括形成热敏材料薄膜层(80)的步骤。 热敏材料(80)的薄膜层可以结晶。 可以形成与热敏材料(80)的薄膜层连通的应力取向层(82)。 可以将热敏材料(80)的薄膜层加热到热敏材料的转变温度以上。 应力取向层(82)可以相对于热敏材料(80)的薄膜层膨胀。 热敏材料(80)的薄膜层可以被冷却到热敏材料的转变温度以下。 当热敏材料(80)的薄膜层冷却到转变温度以下时,应力取向层(82)可相对于热敏材料(80)的薄膜层被压缩以优先排列热敏材料的晶体 。

    Thermal isolation structure for hybrid thermal imaging system
    32.
    发明授权
    Thermal isolation structure for hybrid thermal imaging system 失效
    混合热成像系统的隔热结构

    公开(公告)号:US5485010A

    公开(公告)日:1996-01-16

    申请号:US182868

    申请日:1994-01-13

    摘要: A mesa-type structure (52) is formed from polyimide (or a similar polymer material) to achieve a supporting structure for mounting a focal plane array (30 and 130) on an integrated circuit substrate (70 and 170). In an exemplary thermal imaging system (20 and 120), a thermal isolation structure (50 and 150) is disposed on an integrated circuit substrate (70 and 170) for electrically connecting and mechanically bonding a corresponding focal plane array (30 and 130) of thermal sensors (40 and 140). Each mesa-type structure (52 and 152) initially includes a polyimide mesa (54) over which is formed a reinforcing layer (56 and 156) and a metal conductor (58, 158 and 168) that extends from the top of the mesa-type structure (52 and 152) to an adjacent contact pad (72, 172 and 174). After the focal plane array (30 and 130) is bonded to the corresponding array of mesa-type structures (52 and 152), the polyimide mesas (54) are removed to create void spaces (60 and 160). The resulting mesa-type structures (52 and 152) provide a thermally isolated, but electrically conductive path between the sensor signal electrode (44 and 144) of each thermal sensor (40 and 140) and the corresponding contact pad (72 and 172) on the integrated circuit substrate (70 and 170).

    摘要翻译: 台式结构(52)由聚酰亚胺(或类似的聚合物材料)形成,以实现用于将焦平面阵列(30和130)安装在集成电路基板(70和170)上的支撑结构。 在示例性热成像系统(20和120)中,热隔离结构(50和150)设置在集成电路基板(70和170)上,用于将相应的焦平面阵列(30和130)电连接和机械地结合 热传感器(40和140)。 每个台面型结构(52和152)最初包括聚酰亚胺台面(54),其上形成有加强层(56和156)和金属导体(58,158和168) (52和152)连接到相邻的接触垫(72,172和174)。 在焦平面阵列(30和130)结合到相应的台面型结构(52和152)阵列之后,去除聚酰亚胺台面(54)以产生空隙(60和160)。 所得到的台面型结构(52和152)在每个热传感器(40和140)的传感器信号电极(44和144)与相应的接触垫(72和172)之间提供热隔离但导电的通路 集成电路基板(70和170)。

    Capacitive bolometer and method for detecting infrared radiation
    34.
    发明授权
    Capacitive bolometer and method for detecting infrared radiation 失效
    电容式辐射热量计和红外辐射检测方法

    公开(公告)号:US4902895A

    公开(公告)日:1990-02-20

    申请号:US243281

    申请日:1988-09-12

    申请人: Charles M. Hanson

    发明人: Charles M. Hanson

    IPC分类号: G01J5/20 G01J5/34 H01L27/16

    摘要: The capacitive bolometer comprises a detection capacitor having a first-order phase transition ferroelectric material between two electrodes. The detection capacitor operates during a detection step and a subsequent readout step. During the detection step, a preselected electric field is applied to the detection capacitor to maximize its sensitivity to temperature. A second electric field is applied to the capacitor during the readout step in order to increase responsivity of the detection cell. The detection cells according to the invention can be assembled into disclosed detection arrays.

    摘要翻译: 电容测辐射热计包括在两个电极之间具有一阶相变铁电材料的检测电容器。 检测电容器在检测步骤和随后的读出步骤期间操作。 在检测步骤期间,将预选的电场施加到检测电容器以使其对温度的敏感度最大化。 在读出步骤期间,向电容器施加第二电场,以增加检测单元的响应度。 根据本发明的检测单元可组装成所公开的检测阵列。

    Infrared detector array assembly with attached optical microphonics
filter
    36.
    发明授权
    Infrared detector array assembly with attached optical microphonics filter 失效
    红外探测器阵列组件,附带光学麦克风滤光片

    公开(公告)号:US4253022A

    公开(公告)日:1981-02-24

    申请号:US36969

    申请日:1979-05-08

    IPC分类号: G01J5/06 G01J1/00

    CPC分类号: G01J5/061

    摘要: An infrared detector assembly comprising a substrate of suitable material such as sapphire, an infrared detector array attached to the substrate, a cold shield attached to the detector array, and an optical microphonics filter attached to the cold shield is disclosed. The optical microphonics filter includes a substrate of material having its major surfaces coated with layers of thin film coatings for passing a preselected frequency band, and a metalization for reflecting spurious energy impinging thereon thereby shielding the filter's substrate and coatings therefrom.

    摘要翻译: 公开了一种红外检测器组件,其包括诸如蓝宝石的合适材料的衬底,附着到衬底的红外检测器阵列,附接到检测器阵列的冷屏蔽以及连接到冷屏蔽的光学麦克风滤光器。 光学麦克风滤光器包括其主表面涂覆有用于通过预选频带的薄膜涂层的材料的基底,以及用于反射入射在其上的寄生能量的金属化,从而屏蔽过滤器的基底和涂层。

    Pixel structure for microbolometer detector
    37.
    发明授权
    Pixel structure for microbolometer detector 有权
    微光度计检测器的像素结构

    公开(公告)号:US08546757B2

    公开(公告)日:2013-10-01

    申请号:US12799627

    申请日:2010-04-28

    申请人: Charles M. Hanson

    发明人: Charles M. Hanson

    IPC分类号: G01J5/20

    摘要: Microbolometer pixel structures including membrane material in a current path between at least two spaced electrodes, the membrane material having multiple openings defined in the current path that are configured such that substantially the entire volume of electrically conductive membrane material in at least a portion of the current path contributes to conduction of current between the electrical contacts.

    摘要翻译: 微电子照度计像素结构,包括在至少两个间隔开的电极之间的电流通路中的膜材料,所述膜材料具有限定在电流路径中的多个开口,其被配置为使得在电流的至少一部分中基本上整个体积的导电膜材料 路径有助于电触点之间的电流传导。

    In-cell current subtraction for infrared detectors
    38.
    发明申请
    In-cell current subtraction for infrared detectors 有权
    红外探测器的单元电流减法

    公开(公告)号:US20100001173A1

    公开(公告)日:2010-01-07

    申请号:US12459122

    申请日:2009-06-26

    IPC分类号: G01J1/44 H03F3/08

    CPC分类号: G01W1/08

    摘要: Read-out cell systems are disclosed for image detectors, including infrared image detectors, that provide improved sensitivity by providing in-cell subtraction through the use of a voltage ramp signal generated using a reference pixel and a feedback amplifier. The ramp voltage is generated using a reference pixel and an amplifier having feedback. The ramp voltage is then provided to a plurality of read-out cells. The ramp voltage can be coupled to an input transistor to provide current subtraction prior to the integration node. The ramp voltage can also be provided to integration capacitors within the read-out cells to provide current subtraction directly to the integration node. Further, a temperature-independent fixed current source can also be utilized to further control current subtraction.

    摘要翻译: 公开了用于包括红外图像检测器的图像检测器的读出单元系统,其通过使用使用参考像素和反馈放大器产生的电压斜坡信号来提供单元内减法来提供改善的灵敏度。 使用参考像素和具有反馈的放大器产生斜坡电压。 然后将斜坡电压提供给多个读出单元。 斜坡电压可以耦合到输入晶体管,以在集成节点之前提供电流减法。 斜坡电压也可以提供给读出单元内的积分电容器,以便直接向集成节点提供减法。 此外,还可以利用温度独立的固定电流源来进一步控制电流减法。

    Micro-bolometer cell structure
    39.
    发明授权
    Micro-bolometer cell structure 失效
    微量热仪单元结构

    公开(公告)号:US06361825B1

    公开(公告)日:2002-03-26

    申请号:US08699960

    申请日:1996-08-20

    IPC分类号: C23C1640

    CPC分类号: G01J5/20 G01J5/34

    摘要: A pyroelectric detector system, the pyroelectric detector element therefor and the method of making the detector element which comprises an integrated circuit (1) and a pyroelectric detector element (7) coupled to the integrated circuit and thermally isolated from the integrated circuit. The element includes a lead-containing pyroelectric layer having a pair of opposing surfaces and having a thickness to provide a resonant cavity for radiations in a predetermined frequency range. A bottom electrode (5) opaque to radiations in the predetermined frequency range is secured to one of the pair of opposing surfaces and a top electrode (9, 11) is secured to the other of the pair of opposing surfaces which is semi-transparent to radiations in the predetermined frequency range. The top electrode is taken from the group consisting of platinum and nichrome. The lead-containing pyroelectric layer is preferably lead titanate.

    摘要翻译: 一种热释电检测器系统,其热电检测器元件及其制造方法,其包括集成电路(1)和与该集成电路耦合并与该集成电路热隔离的热电检测元件(7)。 元件包括含铅的热电层,其具有一对相对的表面,并且具有厚度以提供用于在预定频率范围内的辐射的谐振腔。 在预定频率范围内对辐射不透明的底部电极(5)固定到一对相对表面中的一个,并且顶部电极(9,11)固定到一对相对表面中的另一个,其是半透明的 在预定频率范围内的辐射。顶部电极取自铂和镍铬合金组。 含铅的热电层优选为钛酸铅。

    Thermal detector with inter-digitated thin film electrodes and method
    40.
    发明授权
    Thermal detector with inter-digitated thin film electrodes and method 失效
    具有数字化薄膜电极的热检测器和方法

    公开(公告)号:US6137107A

    公开(公告)日:2000-10-24

    申请号:US919729

    申请日:1997-08-28

    摘要: Thermal sensor (36) may include a thermally sensitive element (50), a first thin film electrode (52) and a second thin film electrode (54). The thermally sensitive element (50) may include a plurality of preferentially-ordered crystals. The first thin film electrode (52) may include a plurality of digits (53) in communication with the thermally sensitive element (50). The digits (53) of the first thin film electrode (52) may be in spaced relation with one another. The second thin film electrode (54) may include a plurality of digits (55) in communication with the thermally sensitive element (50) opposite the first thin film electrode (52). The digits (55) of the second thin film electrode (54) may be in spaced relation with one another and in spaced interposed relation with the digits (53) of the first thin film electrode (52).

    摘要翻译: 热传感器(36)可以包括热敏元件(50),第一薄膜电极(52)和第二薄膜电极(54)。 热敏元件(50)可以包括多个优先有序晶体。 第一薄膜电极(52)可以包括与热敏元件(50)连通的多个数字(53)。 第一薄膜电极(52)的数字(53)可以彼此间隔开。 第二薄膜电极(54)可以包括与第一薄膜电极(52)相对的与热敏元件(50)连通的多个数字(55)。 第二薄膜电极(54)的数字(55)可以彼此间隔开,与第一薄膜电极(52)的数字(53)间隔开。