摘要:
A system for identifying wafers contained in a wafer carrier includes a wafer sorter. Each wafer includes a surface terminating in an edge and a plurality of sector identification codes disposed on the surface proximate the edge. The wafer sorter is adapted to scan at least a portion of a wafer extending from the carrier and to identify at least one of the sector identification codes on the wafer independent of the orientation of the wafer in the wafer carrier. A method for identifying wafers contained in a wafer carrier is provided. Each wafer includes a surface terminating in an edge and a plurality of sector identification codes disposed on the surface proximate the edge. The method includes scanning at least a portion of a wafer extending from the carrier and identifying at least one of the sector identification codes on the wafer independent of the orientation of the wafer in the wafer carrier.
摘要:
A method for monitoring health of a tool includes receiving at least one tool parameter related to the processing of a workpiece in a tool; receiving a model selection trigger; selecting a tool health model based on the model selection trigger; generating at least one predicted tool parameter based on the selected tool health model; and generating a tool health rating for the tool based on a comparison between the measured tool parameter and the predicted tool parameter. A tool health monitor includes a library of tool health models, a model selector, and a fault detection and classification unit. The model selector is adapted to receive a model selection trigger and select a tool health model based on the model selection trigger. The fault detection and classification unit is adapted to receive at least one tool parameter related to the processing of a workpiece in a tool, generate at least one predicted tool parameter based on the selected tool health model, and generate a tool health rating for the tool based on a comparison between the received tool parameter and the predicted tool parameter.
摘要:
A method and apparatus for performing manufacturing system analysis upon a manufacturing network. Real-time production data is collected. The real-time production data is stored in a static file database. A real-time data flow is emulated using said real-time production data from said static file database. A reactive function analysis is performed.
摘要:
A method and apparatus for providing fault detection in an Advanced Process Control (APC) framework. A first interface receives operational state data of a processing tool related to the manufacture of a processing piece. The state data is sent from the first interface to a fault detection unit. A fault detection unit determines if a fault condition exists with the processing tool based upon the state data. A predetermined action is performed on the processing tool in response to the presence of a fault condition. In accordance with one embodiment, the predetermined action is to shutdown the processing tool so as to prevent further production of faulty wafers.
摘要:
A system and method for stocking and sorting reticles used in a semiconductor fabrication facility, the facility having a material handling system that presents a reticle to a photolithography process area. In an example embodiment of the reticle management system, a reticle storage system and a reticle sorting apparatus are coupled to a host system that is adapted to track and control the movement of reticles in the material handling system. The host system is capable of interfacing with a management input module that integrates management directives into the reticle flow plan in the manufacturing process. The result is a reticle management system that is flexible enough to manage a finite number of reticles and pods in minimizing the delivery time of a reticle to the desired location while responding to changing conditions external to the manufacturing process.
摘要:
An apparatus and a system for stocking and sorting wafers in a wafer processing system reduce cycle time in manufacturing and reduce excessive handling of delicate wafers. In an example embodiment, the apparatus includes in an enclosure having therein a scanner adapted to identify codes located on the wafer carriers that indicate the position of a wafer within the carrier. A sorting mechanism for sorting wafers and carriers within the enclosure is also included as well as a computer arrangement that communicates with the management system of the wafer processing system. One of the advantages of the present invention is the reduction in cycle time that is achieved by sorting wafers immediately on demand while at a stocking location.
摘要:
An apparatus and method are presented for identifying a semiconductor die within a group of semiconductor dice formed upon a surface of the same semiconductor wafer. During wafer fabrication, several parallel-resonant electronic structures are formed within each die area of the semiconductor wafer. The parallel-resonant structures are configured such that each semiconductor die responds differently to an alternating current (a.c.) electrical signal. During an identification operation, an a.c. electrical signal is coupled to the parallel-resonant structures of a selected semiconductor die. The unique response of the parallel-resonant structures of the selected semiconductor die to the a.c. electrical signal is used to determine the position of the selected semiconductor die relative to other semiconductor dice formed from the same semiconductor wafer. The apparatus includes a includes a variable frequency oscillator configured to produce an a.c. voltage Vout, a probe, and a resistor. Voltage Vout is coupled to an inductive coil of the probe connected in series with the resistor. An a.c. voltage Vmeas developed across the resistor is used to determine the response of the selected semiconductor die to the a.c. signal. A graph of the ratio of the magnitude of voltage Vmeas to the magnitude of voltage Vout versus the corresponding frequency of the a.c. electrical signal is plotted and used to determine the position of the die relative to other semiconductor dice produced from the same semiconductor wafer.
摘要:
A system and method for managing empty carriers in an automated material handling system. The system includes a plurality of material carriers, some of which are empty, and a plurality of stock areas which store the carriers while waiting for the contained material to be processed or after having been processed. The system also includes a transportation system for moving the carriers between the stock areas. The system also includes a control system which receives status information from the transportation system and stock areas and controls the movement of carriers, in particular empty carriers, within the system in order to avoid production inefficiencies due to time delays introduced by an empty carrier not being available at a stock area when needed. The control system accomplishes this by calculating status variables, such as the empty percentage of each stock area, the current move rate of carriers in the system, and the current empty move rate in the system. The control system controls the movement of empty carriers based on the status information in relation to control parameters. The empty carrier control system attempts to keep the empty percentage of each stock area within a range defined by minimum and maximum empty percentage control parameters. The empty carrier movement is performed subject to not exceeding a maximum system move rate control parameter, which serves to avoid exceeding the physical limitations of the system, and not exceeding a maximum empty carrier move rate control parameter, which serves as a damping factor to avoid introducing system instability. In one embodiment, the system is for handling semiconductor wafers. In one embodiment, the control system is a network of computers executing a distributed software application for controlling the empty carrier movement.
摘要:
A method includes collecting trace data associated with a first device tester. A tester health metric is generated for the first device tester. At least one device tested by the first device tester is retested responsive to determining the tester health metric violates a predetermined threshold. A system includes a first device tester operable to test devices and a tester monitoring unit. The tester monitoring unit is operable to collect trace data associated with the first device tester, generate a tester health metric for the first device tester, and initiate a retest of at least one device tested by the first device tester responsive to determining the tester health metric violates a predetermined threshold.
摘要:
The present invention is generally directed to various methods and systems for fault detection control of multiple tools based upon external data. In one illustrative embodiment, the method includes monitoring each of a plurality of tools to determine if a fault condition occurs in any of the tools, each of the tools being comprised of at least one integrated metrology device, monitoring external data regarding at least one parameter that may impact an operation performed in each of the tools, and determining if an indicated fault condition in at least one of the tools is a valid fault condition or a systemic fault condition associated with a change in a value of the at least one parameter.